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公开(公告)号：US09093620B2
公开(公告)日：2015-07-28
申请号：US14537947
申请日：2014-11-11
Applicant: NICHIA CORPORATION
Inventor： Takeshi Ikegami , Hiroto Tamaki
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2924/01078 , H01L2933/0041
Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and achieving an even light distribution color, and a method of manufacturing the same. A method of manufacturing a light emitting device includes arranging a plurality of semiconductor light emitting elements spaced apart from each other on an expandable sheet, spraying a slurry containing a solvent, a thermosetting resin, and phosphor particles, onto an entire surface of the sheet having the arranged semiconductor light emitting elements to form a resin layer, pre-curing the resin layer, disuniting the resin layer formed on the surface of the semiconductor light emitting element from the resin layer formed on the sheet by expanding the sheet, and main curing the resin layer, which steps are performed in this order.
Abstract translation: 提供一种在半导体发光元件的表面上具有荧光体层并实现均匀的发光颜色的发光器件及其制造方法。 一种制造发光器件的方法包括在可膨胀片材上彼此间隔开的多个半导体发光元件布置，将含有溶剂，热固性树脂和荧光体颗粒的浆料喷射到具有 布置的半导体发光元件以形成树脂层，对树脂层进行预固化，通过使片材膨胀从由形成在片材上的树脂层分离形成在半导体发光元件的表面上的树脂层，并且主固化 树脂层，其顺序按此顺序进行。
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公开(公告)号：US08987853B2
公开(公告)日：2015-03-24
申请号：US14152712
申请日：2014-01-10
Applicant: Nichia Corporation
Inventor： Shinji Nishijima , Tomohide Miki , Hiroto Tamaki
IPC: H01L31/0203 , H01L23/495 , H05K5/00 , H01L33/48 , H01L33/52 , H01L33/60
CPC classification number: H05K5/0091 , H01L33/486 , H01L33/52 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01322 , H01L2924/181 , H01L2924/18301 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.
Abstract translation: 一种发光器件包括形成由底表面和侧壁限定的凹部的基体，其上表面露出在凹部中并且其下表面形成外表面的导电构件，设置在凹部中的突出部分， 安装在所述凹部中并电连接到所述导电构件的发光元件，以及设置在所述凹部中以覆盖所述发光元件的密封构件。 基体具有由树脂一体形成的底部部分和侧壁部分，侧壁部分的内表面是限定凹部的侧壁，并且具有弯曲部分，并且突出部分靠近 曲面。 通过这种布置，可以获得光提取效率和可靠性优异的薄型和小型发光装置。
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公开(公告)号：USRE49047E1
公开(公告)日：2022-04-19
申请号：US16902000
申请日：2020-06-15
Applicant: NICHIA CORPORATION
Inventor： Ryoma Suenaga , Hiroto Tamaki
Abstract: A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
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公开(公告)号：US10193036B2
公开(公告)日：2019-01-29
申请号：US15879812
申请日：2018-01-25
Applicant: NICHIA CORPORATION
Inventor： Suguru Beppu , Yoichi Bando , Hiroto Tamaki , Takuya Nakabayashi
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
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公开(公告)号：US10002993B2
公开(公告)日：2018-06-19
申请号：US15383711
申请日：2016-12-19
Applicant: NICHIA CORPORATION
Inventor： Takeshi Ikegami , Hiroto Tamaki
IPC: H01L33/00 , H01L33/50 , H01L33/46 , H01L33/48 , H01L33/54 , H01L27/15 , H01L33/20 , H01L25/075 , H01L33/60
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2924/01078 , H01L2933/0041
Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.
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Patent Agency Ranking
公开(公告)号：US09887335B2
公开(公告)日：2018-02-06
申请号：US15494863
申请日：2017-04-24
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Yoshitaka Bando , Hiroto Tamaki
IPC: H01L23/495 , H01L33/62 , H01L33/48
CPC classification number: H01L23/49537 , H01L21/4828 , H01L23/49503 , H01L23/49544 , H01L23/49551 , H01L23/49562 , H01L23/49582 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from the second lead portion, with a part of the resin member being arranged within the lead recess portion. The light emitting element includes first and second electrodes that respectively face the first and second lead portions. The first electrode includes a first electrode side surface and an electrode recess portion that extends from the first electrode side surface in a direction away from the second electrode. The electrode recess portion is arranged at a position overlapping the lead recess portion in a plan view.
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公开(公告)号：US09842970B2
公开(公告)日：2017-12-12
申请号：US15257994
申请日：2016-09-07
Applicant: NICHIA CORPORATION
Inventor： Yuta Oka , Hiroto Tamaki
CPC classification number: H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60
Abstract: A light emitting device has; a light emitting element, a light reflecting member that is disposed so as to cover the lateral surfaces of the light emitting element and expose a top surface of the light emitting element, a frame that is disposed on the light reflecting member so as to surround an outer periphery of the top surface of the light emitting element, a light transmissive member that is disposed inside the frame, and a sealing member that covers the light reflecting member, the frame and the light transmissive member, and that has a flange covering part of the frame.
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公开(公告)号：US09711691B2
公开(公告)日：2017-07-18
申请号：US15296519
申请日：2016-10-18
Applicant: NICHIA CORPORATION
Inventor： Hiroto Tamaki , Takuya Nakabayashi
CPC classification number: H01L33/486 , H01L24/97 , H01L33/50 , H01L33/507 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a plurality of light emitting elements connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting elements, the base material having a protruding component on the second main face, the protruding component being one of a heat releasing terminal, a reinforcement terminal, and an insulating film, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.
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公开(公告)号：US09711491B2
公开(公告)日：2017-07-18
申请号：US14928009
申请日：2015-10-30
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi Marutani , Hiroto Tamaki , Tadaaki Miyata
IPC: H01L25/075 , H01L33/62 , H01L33/50 , H01L33/60 , F21K9/27 , F21Y103/10 , F21Y115/10
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.
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公开(公告)号：US09484511B2
公开(公告)日：2016-11-01
申请号：US14274872
申请日：2014-05-12
Applicant: NICHIA CORPORATION
Inventor： Ryoma Suenaga , Hiroto Tamaki
CPC classification number: H01L33/62 , H01L24/96 , H01L25/167 , H01L33/005 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/36 , H01L33/486 , H01L33/52 , H01L33/56 , H01L2924/01322 , H01L2924/12035 , H01L2924/12042 , H01L2924/15788 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
Abstract translation: 发光器件包括发光元件，端子基板和固定元件。 发光元件是具有第一半导体层，发光层和第二半导体层的半导体层叠体，其顺序层叠，与第一半导体层连接的第一电极和与第二半导体连接的第二电极 层。 端子基板包括连接到第一电极和第二电极的一对端子和固定端子的绝缘体层。 端子基板的外边缘的至少一部分比半导体层叠体的外边缘更靠近发光器件的中心。 固定构件固定发光元件和端子基板。
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