公开(公告)号：US20200020824A1

公开(公告)日：2020-01-16

申请号：US16579422

申请日：2019-09-23

Applicant: NICHIA CORPORATION

Inventor： Takeshi KUSUSE ,  Satoshi SHICHIJO ,  Kunihito SUGIMOTO

IPC: H01L33/00 ,  H01L21/56 ,  H01L33/62 ,  H01L25/075 ,  H01L33/32

Abstract: A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.

公开(公告)号：US20190006554A1

公开(公告)日：2019-01-03

申请号：US16024620

申请日：2018-06-29

Applicant: NICHIA CORPORATION

Inventor： Takeshi KUSUSE ,  Satoshi SHICHIJO ,  Kunihito SUGIMOTO

IPC: H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/40 ,  H01L33/50 ,  H01L25/075

CPC classification number: H01L33/0075 ,  H01L21/563 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L33/505 ,  H01L33/62

Abstract: A method of manufacturing a light-emitting device includes: directly bonding a plurality of light-emitting elements to a collective light-transmissive member having a plate shape, each light-emitting element comprising a plurality of electrodes; subsequently, forming stud bumps on each electrode of each light-emitting element; subsequently, dividing the collective light-transmissive member to obtain a plurality of light-transmissive members on each of which one or more of the light-emitting elements are bonded; and subsequently, mounting the light-emitting elements on or above a mounting base by a flip-chip technique.

公开(公告)号：US20170025572A1

公开(公告)日：2017-01-26

申请号：US15216321

申请日：2016-07-21

Applicant: NICHIA CORPORATION

Inventor： Satoshi SHICHIJO ,  Kunihito SUGIMOTO ,  Kenji OZEKI ,  Shogo ABE

IPC: H01L33/20 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.

Abstract translation: 发光器件包括：基底部件; 安装在所述基座构件上的发光元件; 覆盖所述发光元件的上表面并且在俯视图中大致为矩形的透光构件; 以及覆盖透光构件的侧面的光反射构件，该光反射构件在俯视图中具有大致矩形的框架形状。 光反射构件的宽度沿着透光构件的短边比沿着透光构件的长边更小。 光反射构件的高度沿着透光构件的短边比沿着光透射构件的长边在与光反射构件的外边缘分开预定距离的位置处较小。

公开(公告)号：US20230392769A1

公开(公告)日：2023-12-07

申请号：US18451215

申请日：2023-08-17

Applicant: NICHIA CORPORATION

Inventor： Yusuke HAYASHI ,  Satoshi SHICHIJO ,  Hiroki FUKUTA

IPC: F21V9/30 ,  F21V7/04

CPC classification number: F21V9/30 ,  F21V7/04

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface opposite the lower surface, and a lateral surface that meets the upper surface; a first light reflecting member disposed on an upper surface of the substrate and covering lateral surfaces of the light emitting element; and a second wavelength conversion member disposed on the first light reflecting member, on the upper surface of the substrate, and on the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member.

公开(公告)号：US20210242365A1

公开(公告)日：2021-08-05

申请号：US17234147

申请日：2021-04-19

Applicant: NICHIA CORPORATION

Inventor： Satoshi SHICHIJO ,  Harunobu SAGAWA

IPC: H01L33/00 ,  H01L33/18 ,  H01L33/50

Abstract: A method of manufacturing a light emitting device includes: bonding a light emitting element and a light transmissive member by a surface activated bonding method, which includes: activating a first bonding surface of the light emitting element to which the light transmissive member is to be bonded, by irradiating at least the first bonding surface with an ion beam, activating a second bonding surface of the light transmissive member to which the light emitting element is to be bonded, by irradiating at least the second bonding surface with an ion beam, and joining the light emitting element and the light transmissive member by bringing the activated first bonding surface and the activated second bonding surface into contact.

公开(公告)号：US20180277721A1

公开(公告)日：2018-09-27

申请号：US15934551

申请日：2018-03-23

Applicant: NICHIA CORPORATION

Inventor： Shusaku BANDO ,  Takanobu SOGAI ,  Satoshi SHICHIJO

IPC: H01L33/50 ,  H01L33/38 ,  H01L33/60

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/387 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005

Abstract: A light emitting device including: a light emitting element, a phosphor plate, and a light guiding part. The lower face of the light emitting element has a rectangular shape. The light guiding part covers lateral faces of the light emitting element and the lower face of the phosphor plate that is exposed from the light emitting element. The light guiding part has one or more lateral faces having at least one of structures below: a height at both ends being different from the height at a central area; outer lateral faces being parallel to the lateral faces of the light emitting element.

公开(公告)号：US20180029523A1

公开(公告)日：2018-02-01

申请号：US15662702

申请日：2017-07-28

Applicant: NICHIA CORPORATION

Inventor： Satoshi SHICHIJO

IPC: B60Q1/04 ,  F21S8/10 ,  H01L33/60

CPC classification number: B60Q1/04 ,  F21S41/141 ,  F21S41/64 ,  F21S43/14 ,  F21S45/10 ,  H01L33/504 ,  H01L33/505 ,  H01L33/508 ,  H01L33/60

Abstract: A light emitting device includes a light emitting element, a first light transmissive member, a second light transmissive member, and a light reflective member. The first light transmissive member contains a first phosphor. The first light transmissive member is in contact with an upper surface of the light emitting element, and has an area smaller than the light emitting element in a plan view. The second light transmissive member contains a second phosphor. The second light transmissive member covers lateral surfaces of the first light transmissive member and a part of the upper surface of the light emitting element that is exposed from the first light transmissive member, with an upper surface of the first light transmissive member being not covered by the second light transmissive member. The light reflective member covers lateral surfaces of the second light transmissive member and lateral surfaces of the light emitting element.

公开(公告)号：US20170054064A1

公开(公告)日：2017-02-23

申请号：US15239914

申请日：2016-08-18

Applicant: NICHIA CORPORATION

Inventor： Satoshi SHICHIJO ,  Kunihito SUGIMOTO ,  Kenji OZEKI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

Abstract: A light-emitting device includes a light-emitting element; a first light transmissive member that is disposed over the light-emitting element and that includes a first upper surface, a lower surface, a first lateral surface; and a second lateral surface positioned outside the first lateral surface, a second light transmissive member that covers at least a part of the first lateral surface; and a light reflective member that is disposed on a lateral surface of the second light transmissive member, the second lateral surface of the first light transmissive member, and a lateral surface of the light-emitting element.

Abstract translation: 发光装置包括发光元件; 第一透光构件，其设置在所述发光元件上方，并且包括第一上表面，下表面，第一侧表面; 以及位于所述第一侧表面外侧的第二侧表面，覆盖所述第一侧表面的至少一部分的第二透光构件; 以及设置在第二透光构件的侧面，第一透光构件的第二侧面和发光元件的侧面的光反射构件。

公开(公告)号：US20160190417A1

公开(公告)日：2016-06-30

申请号：US14976702

申请日：2015-12-21

Applicant: NICHIA CORPORATION

Inventor： Masatsugu ICHIKAWA ,  Satoshi SHICHIJO ,  Takehito SHIMATSU

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/64 ,  C04B37/00 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L33/0079 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2924/01047 ,  H01L2924/01079

Abstract: A semiconductor device includes an insulating substrate,a semiconductor element disposed on an upper surface of the substrate, a heat dissipation member, and a metal bonding layer that bonds the lower surface of the substrate to the upper surface of the heat dissipation member, and the area of the upper surface of the heat dissipation member is larger than the area of the lower surface of the substrate, and the metal bonding layer contacts the whole of the lower surface of the substrate and has an area larger than the area of the lower surface of the substrate, and the heat conductivity of the metal bonding layer is higher than the heat conductivity of the heat dissipation member.

Abstract translation: 半导体器件包括绝缘衬底，设置在衬底的上表面上的半导体元件，散热构件和将衬底的下表面粘合到散热构件的上表面的金属接合层，以及 散热构件的上表面的面积大于基板的下表面的面积，并且金属接合层与基板的整个下表面接触，并且具有比下表面的面积大的面积 并且金属接合层的导热率高于散热构件的导热率。