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公开(公告)号：US20180069159A1
公开(公告)日：2018-03-08
申请号：US15805402
申请日：2017-11-07
Applicant: NICHIA CORPORATION
Inventor： Yuta OKA , Hiroto TAMAKI
CPC classification number: H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60
Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. The second light reflecting member surrounds an outer periphery of the light emitting element in a plan view. The second light reflecting member is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member is disposed inside the second light reflecting member. The light transmissive member includes a wavelength conversion substance. The sealing member covers the first and second light reflecting members and the light transmissive member.
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公开(公告)号：US20140034973A1
公开(公告)日：2014-02-06
申请号：US13953859
申请日：2013-07-30
Applicant: NICHIA CORPORATION
Inventor： Yuta OKA , Tatsuya YANAMOTO
CPC classification number: H01L33/64 , F21K9/00 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H05K1/0203 , H05K1/0295 , H05K1/0296 , H05K3/28 , H05K3/284 , H05K2201/0187 , H05K2201/09954 , H05K2201/10106 , H05K2201/2054 , H05K2203/063 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting device including: a base; light-emitting elements arranged on the base at intervals in an array along a predetermined direction of the base; and conductive-wiring parts formed on first and second sides of the array of the light-emitting elements on the base. The conductive-wiring parts are discretely formed along the predetermined direction of the base, each of the conductive-wiring parts relaying electricalconnection between the light-emitting elements, and the number of the conductive-wiring parts arranged per light-emitting element on each of the first and second sides of the array of the light-emitting elements is two or more.
Abstract translation: 一种发光装置，包括：基座; 发光元件沿着基座的预定方向以阵列的间隔布置在基座上; 以及形成在基底上的发光元件阵列的第一和第二侧上的导电布线部分。 导电布线部分沿着基板的预定方向离散地形成，每个导电布线部分中继发光元件之间的电连接以及每个发光元件上布置的导电布线部件的数量 发光元件阵列的第一和第二面是两个或更多个。
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公开(公告)号：US20230352458A1
公开(公告)日：2023-11-02
申请号：US18299168
申请日：2023-04-12
Applicant: NICHIA CORPORATION
Inventor： Tetsuya ISHIKAWA , Yuta OKA
IPC: H01L25/075 , H01L33/60 , H01L23/00
CPC classification number: H01L25/0753 , H01L24/29 , H01L24/32 , H01L33/60 , H01L2224/29017 , H01L2224/29191 , H01L2224/32059 , H01L2224/32225
Abstract: A light-emitting device includes: a light source including: a first light source part including one or more first light-emitting elements, and a second light source part located outward of the first light source part so as to surround the first light source part in a top view, the second light source part including a plurality of second light-emitting elements; one or more first light-transmitting layers located above the first light source part; one or more second light-transmitting layers located above the second light source part; and a light-reflective member located between the plurality of second light-emitting elements. A first of the one or more second light-transmitting layers overlaps adjacent second light-emitting elements among the plurality of second light-emitting elements and the light-reflective member disposed between the adjacent second light-emitting elements in a top view.
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公开(公告)号：US20220316683A1
公开(公告)日：2022-10-06
申请号：US17713727
申请日：2022-04-05
Applicant: NICHIA CORPORATION
Inventor： Norimasa YOSHIDA , Shinya MATSUOKA , Yuta OKA
Abstract: A light source device includes: a combined body including light emitting portions including: a first light emitting portion including a first light emitting element, and a second light emitting portion provided separately from and along an outer periphery of the first light emitting portion in a plan view, the second light emitting portion including a plurality of second light emitting elements; and a lens disposed above the combined body. The first light emitting element and the plurality of second light emitting elements are arrayed in first and second directions that are perpendicular to each other. The first light emitting element and the plurality of second light emitting elements are controllable to be lit independently.
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公开(公告)号：US20200066700A1
公开(公告)日：2020-02-27
申请号：US16669043
申请日：2019-10-30
Applicant: NICHIA CORPORATION
IPC: H01L25/16 , H01L27/02 , H01L29/866 , H01L33/50 , H01L33/58
Abstract: A method of manufacturing a light emitting device includes: placing a light-emitting element above a light-transmitting portion of a first resin layer; placing a protective element above the first resin layer or a first surface of the light-emitting element; forming a second resin layer on the first resin layer so as to cover an entirety of the light-emitting element and an entirety of the protective element; removing a portion of the second resin layer such that an anode and a cathode of the light-emitting element and a first electrically-conductive structure and a second electrically-conductive structure of the protective element are exposed from the second resin layer; and forming a first electrode, which is electrically connected to the anode and the first electrically-conductive structure, and a second electrode, which is electrically connected to the cathode and the second electrically-conductive structure.
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Patent Agency Ranking
公开(公告)号：US20180151547A1
公开(公告)日：2018-05-31
申请号：US15826521
申请日：2017-11-29
Applicant: NICHIA CORPORATION
CPC classification number: H01L25/167 , H01L27/0248 , H01L29/866 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/16245 , H01L2224/32225 , H01L2224/73267 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a light emitting device includes: placing, on a supporting layer, a light-emitting element including an anode and a cathode at a first surface side of the light-emitting element; placing, on the supporting layer, a protective element including a first terminal and a second terminal at a third surface side of the protective element; placing a protecting layer above a second surface of the light-emitting element; covering at least a lateral portion of the light-emitting element and a lateral portion of the protecting layer with a resin composition; curing the resin composition; removing the supporting layer to expose the anode, the cathode, the first terminal, and the second terminal; and forming a first electrode, which is electrically connected to the anode and the first terminal, and a second electrode, which is electrically connected to the cathode and the second terminal.
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公开(公告)号：US20160300987A1
公开(公告)日：2016-10-13
申请号：US15184578
申请日：2016-06-16
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA , Yuta OKA
CPC classification number: H01L33/60 , H01L33/0095 , H01L33/38 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2933/0033
Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.
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公开(公告)号：US20150303356A1
公开(公告)日：2015-10-22
申请号：US14690138
申请日：2015-04-17
Applicant: Nichia Corporation
Inventor： Daisuke SANGA , Yuta OKA
CPC classification number: H01L33/60 , H01L33/0095 , H01L33/38 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2933/0033
Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.
Abstract translation: 提供实现小型化和高亮度的半导体发光器件。 半导体发光器件具有平行于半导体层（2）的层叠方向的光提取表面（6）。 半导体发光器件包括一个放置在半导体层（2）上并具有一倾斜表面（7）的导光元件（3），其具有与光提取表面倾斜的光提取表面（6）相对的侧表面，以及 光反射构件（4）至少包括导光构件的倾斜表面放置在导光构件的表面上。
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公开(公告)号：US20150109790A1
公开(公告)日：2015-04-23
申请号：US14517267
申请日：2014-10-17
Applicant: NICHIA CORPORATION
Inventor： Yuta OKA
CPC classification number: H01L33/54 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
Abstract: A light emitting device includes a supporting base member which has an external electrode, at least one light emitting element disposed on at least a portion of an upper surface of the supporting base member. A sealing member encloses the light emitting element and has an outermost periphery larger than the supporting base member in a plan view. The supporting base member has at least one recess. The sealing member is filled in at least a portion of the recess and is formed so as to expose an electrode surface of the external electrode.
Abstract translation: 发光装置包括：支撑基体，其具有外部电极;至少一个发光元件，设置在所述支撑基体的上表面的至少一部分上。 密封构件包围发光元件，并且在平面图中具有比支撑基底构件更大的最外周。 支撑基座部件具有至少一个凹部。 密封构件填充在凹部的至少一部分中，并且形成为暴露外部电极的电极表面。
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公开(公告)号：US20150021640A1
公开(公告)日：2015-01-22
申请号：US14315437
申请日：2014-06-26
Applicant: NICHIA CORPORATION
Inventor： Yuta OKA , Satoshi OKADA
CPC classification number: H01L33/60 , H01L24/45 , H01L24/48 , H01L33/62 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on the white resist and includes a transparent substrate and a semiconductor layer. The transparent substrate is bonded to the white resist via a bonding member. The semiconductor layer is provided on the transparent substrate. The wire connects the light-emitting element and the lead frame at the opening.
Abstract translation: 发光装置包括引线框，白色抗蚀剂，发光元件和导线。 白色抗蚀剂设置在引线框架上以与引线框架接触。 白色抗蚀剂具有露出引线框的开口。 发光元件设置在白色抗蚀剂上，并且包括透明基板和半导体层。 透明基板经由接合部件与白色抗蚀剂接合。 半导体层设置在透明基板上。 导线在开口处连接发光元件和引线框架。
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