公开(公告)号：US08846456B2

公开(公告)日：2014-09-30

申请号：US12310539

申请日：2007-08-29

申请人： Karl Weidner

发明人： Karl Weidner

IPC分类号： H01L21/00 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H05K3/28

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3164 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2203/0537 ,  H05K2203/063 ,  H05K2203/074 ,  H05K2203/1311

摘要： A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface.

摘要翻译： 具有布置在其上的至少一个组件（例如半导体芯片）的衬底由层压到衬底的表面上的塑料材料制成的薄膜和至少一个组件制成，其中表面具有至少一个触点 区。 首先，将要层压在基材表面上的薄膜和至少一种组分或包含该薄膜的薄膜复合材料布置在室中，使得该腔室被薄膜或薄膜复合材料分裂成第一腔室部分 以及第二室部分，其与第一室部分隔离以便气密。 在第一室部分中比在第二室部分中提供或产生更高的大气压力; 并且在布置在第二室部分中的基板的表面与至少一个部件以及膜或膜复合物之间形成接触，该接触引起膜在表面上的层压。

公开(公告)号：US20130214323A1

公开(公告)日：2013-08-22

申请号：US13816839

申请日：2011-08-12

申请人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

发明人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

IPC分类号： H01L31/0232 ,  H01L33/48

CPC分类号： H01L31/0232 ,  H01L21/76804 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.

摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。

公开(公告)号：US08261439B2

公开(公告)日：2012-09-11

申请号：US12733507

申请日：2008-08-04

申请人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

发明人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

IPC分类号： H01R43/00

CPC分类号： H01L24/33 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/18 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/30107 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00014

摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

公开(公告)号：US20110309377A1

公开(公告)日：2011-12-22

申请号：US13121128

申请日：2009-08-25

申请人： Bert Braune ,  Jörg Erich Sorg ,  Walter Wegleiter ,  Karl Weidner ,  Oliver Wutz

发明人： Bert Braune ,  Jörg Erich Sorg ,  Walter Wegleiter ,  Karl Weidner ,  Oliver Wutz

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： An optoelectronic module is specified, comprising a carrier substrate (1) and a plurality of radiation-emitting semiconductor components (2). The carrier substrate (1) comprises structured conductor tracks. The radiation-emitting semiconductor components (2) each comprise an active layer (2a) suitable for generating electromagnetic radiation, a first contact area (21) and a second contact area (22), wherein the first contact area (21) is in each case arranged on that side of the radiation-emitting semiconductor components (2) which is remote from the carrier substrate (1). The radiation-emitting semiconductor components (2) are provided with an electrically insulating layer (4), which in each case has a cutout in a region of the first contact area (21). Conductive structures (8) are arranged in regions on the electrically insulating layer (4). One of the conductive structures (8) electrically conductively connects at least the first contact area (21) of a radiation-emitting semiconductor component (2) to a further first contact area (21) of a further radiation-emitting semiconductor component (2) or to a conductor track of the carrier substrate (1). Furthermore, a method for producing such a module is specified.

摘要翻译： 规定了光电子模块，其包括载体衬底（1）和多个辐射发射半导体部件（2）。 载体基板（1）包括结构化的导体轨道。 辐射发射半导体部件（2）各自包括适于产生电磁辐射的有源层（2a），第一接触区域（21）和第二接触区域（22），其中第一接触区域（21）在每个 辐射发射半导体部件（2）的远离载体基板（1）的那一侧的情况。 辐射发射半导体部件（2）设置有电绝缘层（4），其在每种情况下在第一接触区域（21）的区域中具有切口。 导电结构（8）布置在电绝缘层（4）上的区域中。 导电结构（8）中的一个导电地将辐射发射半导体部件（2）的至少第一接触区域（21）导电连接到另外的辐射发射半导体部件（2）的另外的第一接触区域（21） 或载体衬底（1）的导体轨道。 此外，规定了这种模块的制造方法。

公开(公告)号：US20110272826A1

公开(公告)日：2011-11-10

申请号：US12310070

申请日：2007-07-31

申请人： Jens-Christian Holst ,  Jens Dahl Jensen ,  Karl Weidner ,  Robert Weinke

发明人： Jens-Christian Holst ,  Jens Dahl Jensen ,  Karl Weidner ,  Robert Weinke

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H05K3/32 ,  C23C24/04 ,  H01L23/552 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/102 ,  H05K3/14 ,  H05K2203/1344 ,  H05K2203/1469

摘要： An electric functional layer is produced on a surface of a substrate, having at least an electronic component, particularly a semiconductor chip, provided thereof. The electric functional layer is formed using particles in powder of an electrically conductive material. The functional layer is blown on the surface of the substrate to form a thick and strong adhesive layer on impact with the substrate.

摘要翻译： 在基板的表面上制造电功能层，至少具有设置有电子部件的电子部件，特别是半导体芯片。 电功能层使用导电材料的粉末形成。 在衬底的表面上吹送功能层，以在与衬底冲击时形成厚而坚固的粘合剂层。

公开(公告)号：US20110107594A1

公开(公告)日：2011-05-12

申请号：US13002110

申请日：2009-06-16

申请人： Friedrich Lupp ,  Karl Weidner

发明人： Friedrich Lupp ,  Karl Weidner

IPC分类号： H05K3/30

CPC分类号： H01L23/49861 ,  H01L23/15 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.

摘要翻译： 对于电子部件，特别是电源模块，以及用于制造或接触所述部件的相应方法中，组件（1）被紧固到具有至少一个第一无机材料的电绝缘载体膜（3） 以及至少一个开口（5），其中提供组件（1）的至少一个电接触连接（7）到组件（1）外部。 这使得可以在> 175℃的温度范围内提供电子部件（1），特别是功率模块。

公开(公告)号：US07859005B2

公开(公告)日：2010-12-28

申请号：US11991197

申请日：2006-08-30

申请人： Karl Weidner

发明人： Karl Weidner

IPC分类号： H01L33/00

CPC分类号： H01L23/482 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/351 ,  H01L2924/00

摘要： In a method for producing a semiconductor component, in particular a semiconductor structure having a surface structure or topography which is produced by means of electronic components (2) on a substrate (1), at least one electronic component (2) is applied to a substrate (1), and an isolation layer (3) is applied to the topography which is produced by means of the at least one component (2) on the substrate (1). Contact-making openings (5) are then produced in the isolation layer (3) at contact points (8, 9) for the at least one electronic component, the isolation layer (3) and the contact points (8, 9) in the contact-making openings (5) are planar-metallized, and the metallization is structured in order to produce electrical connections (4), with the isolation layer (3) having a glass coating.

摘要翻译： 在用于制造半导体部件的方法中，特别是具有通过基板（1）上的电子部件（2）制造的表面结构或形貌的半导体结构，至少一个电子部件（2）被施加到 衬底（1）和隔离层（3）施加到通过衬底（1）上的至少一个部件（2）产生的形貌。 然后在用于至少一个电子部件的接触点（8,9）的隔离层（3）中产生接触制作开口（5），隔离层（3）和接触点（8,9） 接触开口（5）是平面金属化的，并且金属化被构造为产生电连接（4），隔离层（3）具有玻璃涂层。

公开(公告)号：US20100208438A1

公开(公告)日：2010-08-19

申请号：US12733507

申请日：2008-08-04

申请人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

发明人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

IPC分类号： H05K7/02 ,  H05K13/00

CPC分类号： H01L24/33 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/18 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/30107 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00014

摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

公开(公告)号：US20100133577A1

公开(公告)日：2010-06-03

申请号：US12452955

申请日：2008-07-17

申请人： Werner Hoffmann ,  Roland Höfer ,  Herbert Schwarzbauer ,  Karl Weidner

发明人： Werner Hoffmann ,  Roland Höfer ,  Herbert Schwarzbauer ,  Karl Weidner

IPC分类号： H01L23/522 ,  H01L21/56 ,  H01L33/00

CPC分类号： H01L23/3185 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/19043 ,  H01L2924/00

摘要： A plurality of chips disposed in a wafer on a passivated main side, having at least one chip contact surface, is provided with an insulation layer. The insulation layer has openings in the area of the at least one chip contact surface of each chip. The chip contact surfaces of each chip are provided with a chip contact surface metallization of a prescribed thickness, and the chips disposed in the water are separated therefrom.

摘要翻译： 设置在具有至少一个芯片接触表面的钝化主侧上的晶片中的多个芯片设置有绝缘层。 绝缘层在每个芯片的至少一个芯片接触表面的区域中具有开口。 每个芯片的芯片接触表面设置有规定厚度的芯片接触表面金属化，并且设置在水中的芯片与其分离。

公开(公告)号：US07524775B2

公开(公告)日：2009-04-28

申请号：US11457318

申请日：2006-07-13

申请人： Henrik Ewe ,  Karl Weidner

发明人： Henrik Ewe ,  Karl Weidner

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/3185 ,  H01L23/49517 ,  H01L23/49562 ,  H01L24/24 ,  H01L24/33 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/8382 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for producing a dielectric layer extending between two or more elements of an electronic component includes arranging a free-standing dielectric layer above the elements and a deformable support layer below the elements. The free-standing dielectric layer is laminated onto at least a portion of the first surface of the first element and onto at least a portion of the first surface of the second element such that a portion of the dielectric layer extends between the first surface of the first element and the first surface of the second element.

摘要翻译： 用于制造在电子部件的两个或更多个元件之间延伸的电介质层的方法包括在元件上方设置独立的电介质层和在元件下面形成可变形的支撑层。 独立电介质层被层压到第一元件的第一表面的至少一部分上并且到达第二元件的第一表面的至少一部分上，使得电介质层的一部分在第一元件的第一表面之间延伸 第一元件和第二元件的第一表面。