公开(公告)号：US10236428B2

公开(公告)日：2019-03-19

申请号：US15541464

申请日：2015-12-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Weng Chung Tan ,  Rodello Cadiz Sigalat ,  Hussen Mohd Hanifah ,  Tobias Gebuhr

IPC: H01L33/62 ,  H01L25/075

Abstract: A lead frame is disclosed. In an embodiment, the lead frame includes a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in one longitudinal side includes an imprint, and wherein the imprint bolsters stability of the longitudinal side against sagging.

公开(公告)号：US09978918B2

公开(公告)日：2018-05-22

申请号：US14902834

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provided. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

公开(公告)号：US20170317233A1

公开(公告)日：2017-11-02

申请号：US15649987

申请日：2017-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Gatzhammer ,  Martin Brandl ,  Tobias Gebuhr

IPC: H01L33/10 ,  H05K1/11 ,  H01L33/00

CPC classification number: H01L33/105 ,  H01L33/005 ,  H01L33/486 ,  H01L33/62 ,  H05K1/111

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including first and second electrical contacts, a first leadframe section including a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, the first and second leadframe sections are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible at an underside, and a solder stop element is arranged at the underside of the housing, the solder stop element extending between the first soldering contact pad and the second soldering contact pad.

公开(公告)号：US09780271B2

公开(公告)日：2017-10-03

申请号：US14346673

申请日：2012-12-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Michael Zitzlsperger

IPC: H01L21/56 ,  H01L27/15 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L21/66 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L22/32 ,  H01L24/97 ,  H01L27/15 ,  H01L33/005 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.

公开(公告)号：US20170222092A1

公开(公告)日：2017-08-03

申请号：US15487277

申请日：2017-04-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knoerr ,  Klaus Mueller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L23/498 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

公开(公告)号：US09515015B2

公开(公告)日：2016-12-06

申请号：US14423835

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Thomas Schwarz ,  Michael Zitzlsperger

IPC: H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L21/48 ,  H01L51/52 ,  H01L33/64

CPC classification number: H01L23/49586 ,  H01L21/4839 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/647 ,  H01L51/5212 ,  H01L51/5228 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0033 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A housing includes a lead frame formed from electrically conductive material having first and second sides, a contact section contacting an electronic component at the first side, and at least one receiving section arranging the electronic component at the first side, wherein the contact and receiving sections are separated and the contact section is formed thinner than the receiving section in a direction perpendicular, a molding material having an opening, the receiving and contact regions exposed in the opening, and into which the leadframe is embedded such that part of the molding material is formed between the contact and receiving sections and the second side is covered by the molding material in the contact section, and the second side is free of molding material in the receiving section, wherein the molding material at the second side has at least one opening filled with the electrically insulating material.

Abstract translation: 壳体包括由导电材料形成的引线框架，该引线框架具有第一和第二侧面，接触部分与第一侧面处的电子部件接触，以及至少一个接收部分，其在第一侧布置电子部件，其中接触部分和接收部分 被分离，并且接触部分在垂直方向上比接收部分形成得更薄，具有开口的成型材料，接触和接触区域暴露在开口中，并且引线框架被嵌入其中，使得部分成型材料为 形成在接触部分和接收部分之间的第二面被接触部分中的成型材料覆盖，并且第二侧在接收部分中没有成型材料，其中第二侧的成型材料具有至少一个开口 与电绝缘材料。

公开(公告)号：US20160172559A1

公开(公告)日：2016-06-16

申请号：US14902834

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provide. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

Abstract translation: 可以使用一种方法来制造光电器件。 提供了具有组件的第一个引线框架部分。 该部件被设计成在发射侧发射电磁辐射。 发射侧背离载体。 提供了第二引线框部分。 在第一方法步骤中，组件和两个引线框架部分以第一封装材料封装，使得部件和引线框架部分嵌入灌封体中，但是其中部件的至少部分的发射区域保持 没有第一灌封材料，并且至少在组件的发射区域上方在灌封体中形成切口。 在第二方法步骤中，将第二灌封材料模制到灌封体的切口中，使得部件的出射侧被第二灌封材料覆盖。

公开(公告)号：US20150214446A1

公开(公告)日：2015-07-30

申请号：US14410956

申请日：2013-06-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Markus Pindl ,  Tobias Gebuhr ,  Simon Jerebic ,  Martin Brandl

IPC: H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L23/498 ,  H01L21/78 ,  H01L33/58 ,  H01L23/29

CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/49811 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2924/00014

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。

公开(公告)号：US10411157B2

公开(公告)日：2019-09-10

申请号：US15649987

申请日：2017-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Gatzhammer ,  Martin Brandl ,  Tobias Gebuhr

IPC: H01L33/10 ,  H01L33/48 ,  H01L33/00 ,  H05K1/11 ,  H01L33/62

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including first and second electrical contacts, a first leadframe section including a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, the first and second leadframe sections are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible at an underside, and a solder stop element is arranged at the underside of the housing, the solder stop element extending between the first soldering contact pad and the second soldering contact pad.

公开(公告)号：US20190214536A1

公开(公告)日：2019-07-11

申请号：US16315319

申请日：2017-07-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/60 ,  H01L33/56 ,  H01L33/00 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method of producing an optoelectronic component includes providing a carrier; arranging a structured reflector above a top side of the carrier; arranging an optoelectronic semiconductor chip including a top side and an underside opposite the top side in an opening of the reflector, wherein the underside of the optoelectronic semiconductor chip faces the top side of the carrier; arranging an embedding material above the top side of the carrier, wherein the optoelectronic semiconductor chip is at least partly embedded into the embedding material, as a result of which a composite body including the optoelectronic semiconductor chip, the reflector and the embedding material is formed; and detaching the composite body from the carrier.