公开(公告)号：US10607779B2

公开(公告)日：2020-03-31

申请号：US15492109

申请日：2017-04-20

Applicant: ROHM CO., LTD.

Inventor： Keishi Watanabe ,  Yasuhiro Kondo

IPC: H01G4/30 ,  H01G4/33 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232

Abstract: A chip capacitor includes a substrate having a main surface, a first conductive film including a first connecting region and a first capacitor forming region and formed on the main surface of the substrate, a dielectric film covering the first capacitor forming region of the first conductive film, a second conductive film including a second connecting region facing to the first capacitor forming region of the first conductive film across the dielectric film, and a second capacitor forming region facing to the first capacitor forming region of the first conductive film across the dielectric film, a first external electrode electrically connected to the first connecting region of the first conductive film, and a second external electrode electrically connected to the second connecting region of the second conductive film.

公开(公告)号：US10128163B2

公开(公告)日：2018-11-13

申请号：US15383336

申请日：2016-12-19

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo

IPC: H01L29/06 ,  H01L23/31 ,  H01L21/3065 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L29/34

Abstract: A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.

公开(公告)号：US09530546B2

公开(公告)日：2016-12-27

申请号：US14368757

申请日：2012-12-18

Applicant: ROHM CO., LTD.

Inventor： Eiji Nukaga ,  Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Katsuya Matsuura

IPC: H01C7/18 ,  H01C7/00 ,  H01C13/02 ,  H01C17/06 ,  H01C17/242 ,  H01C17/00 ,  H01G2/06

CPC classification number: H01C17/006 ,  H01C7/00 ,  H01C7/006 ,  H01C13/02 ,  H01C17/06 ,  H01C17/08 ,  H01C17/242 ,  H01F27/402 ,  H01G2/065 ,  H01G4/38 ,  H01G4/40 ,  H01L21/3065 ,  H01L21/78 ,  H01L23/5256 ,  H01L23/528 ,  H01L29/6609 ,  H01L29/861 ,  Y10T29/49082

Abstract: [Subject]To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor.[Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.

Abstract translation: 芯片电阻器（1）包括：具有器件形成表面（2A）的板（2），与器件形成表面（2A）相对的后表面（2B）和连接器件形成表面的侧表面（2C-2F） 装置形成面（2A）到背面（2B），设置在器件形成面（2A）上的电阻部（56），设置在器件形成上的第一连接电极（3）和第二连接电极（4） 表面（2A）并与电阻部分（56）电连接;以及第一连接电极（3）和第二连接电极（4）暴露于其上的覆盖器件形成表面（2A）的树脂膜（24）。 背面（2B）与侧面（2C-2F）相交的板（2）的交叉部分（11）各自具有圆形。

公开(公告)号：US09484135B2

公开(公告)日：2016-11-01

申请号：US14376417

申请日：2013-01-08

Applicant: ROHM CO., LTD.

Inventor： Yasuhiro Kondo ,  Hiroshi Tamagawa ,  Hiroki Yamamoto

IPC: H01C10/00 ,  H01C10/50 ,  H01C1/14 ,  H01C13/02 ,  H01C17/06 ,  H01G4/40 ,  H01G2/16 ,  H01C17/00 ,  H01F27/40 ,  H01G5/38 ,  H01L27/02 ,  H01L27/08

CPC classification number: H01C13/02 ,  H01C1/14 ,  H01C10/50 ,  H01C17/006 ,  H01C17/06 ,  H01F27/402 ,  H01F29/00 ,  H01G2/16 ,  H01G4/40 ,  H01G5/019 ,  H01G5/38 ,  H01L23/5256 ,  H01L27/0207 ,  H01L27/0814 ,  H01L28/20 ,  H01L2224/16225 ,  Y10T29/49099

Abstract: [Subject] To provide a highly-reliable and small-size chip component, e.g., a chip resistor having an accurate resistance value.[Solution] The chip resistor (10) includes: a substrate (11); a plurality of resistor elements each having a resistive film portion (20) provided on the substrate (11) and an aluminum-containing interconnection film portion (21) provided in contact with the resistive film portion (20); electrodes (12, 13) provided on the substrate (11); and a plurality of fuses (F) each having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portion of the resistor element and disconnectably connecting the resistor element to the electrodes (12, 13).[Effect] The resistance of the chip resistor can be adjusted at a desired resistance value by selectively disconnecting desired ones of the fuses. Since the fuses are formed in a minute layout pattern from an aluminum-containing interconnection film, the processing accuracy is improved in the disconnecting step.

Abstract translation: [效果]通过选择性地断开所需的保险丝，可以将片式电阻器的电阻调节到期望的电阻值。 由于保险丝以含有铝的互连膜的分布图形式形成，所以在断开步骤中提高了加工精度。

公开(公告)号：US11769705B2

公开(公告)日：2023-09-26

申请号：US17091031

申请日：2020-11-06

Applicant: ROHM Co., LTD.

Inventor： Katsuya Matsuura ,  Yasuhiro Kondo ,  Hideaki Yamaji

IPC: H01L23/31 ,  H01L21/78 ,  H01L21/56 ,  H01L29/866 ,  H01L49/02

CPC classification number: H01L23/3185 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3192 ,  H01L23/3178 ,  H01L28/20 ,  H01L28/60 ,  H01L29/866

Abstract: Disclosed is a chip component including a substrate having a first surface and a second surface on an opposite side from the first surface, and a third surface connecting the first surface and the second surface to each other, an external surface resin configured to cover at least the third surface of the substrate, and a terminal electrode formed on the first surface of the substrate and exposed from the external surface resin. A recessed portion is formed in an end portion of the third surface of the substrate, the end portion being on the first surface side. The external surface resin is embedded in the recessed portion.

公开(公告)号：US10833145B2

公开(公告)日：2020-11-10

申请号：US16250453

申请日：2019-01-17

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Yasuhiro Fuwa ,  Hiroyuki Okada ,  Eiji Nukaga ,  Katsuya Matsuura

IPC: H01C1/14 ,  H01C13/02 ,  H01L49/02 ,  H01L27/08 ,  H01L21/308 ,  H01L27/06 ,  H01L21/3065 ,  H01C17/242 ,  H01C17/00 ,  H05K3/34

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US10586774B2

公开(公告)日：2020-03-10

申请号：US15795511

申请日：2017-10-27

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo

IPC: H01L23/66 ,  H01L27/01 ,  H01L49/02 ,  H05K3/10 ,  H05K1/02 ,  H05K1/16 ,  H05K3/14

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US10410772B2

公开(公告)日：2019-09-10

申请号：US15454864

申请日：2017-03-09

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo

IPC: H01C1/16 ,  H01C1/012 ,  H01C17/00 ,  H01C17/23 ,  H05K3/34 ,  H01L27/01 ,  H01L49/02 ,  H01C10/50 ,  H01C1/14 ,  H01L27/02

Abstract: A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.

公开(公告)号：US10361182B2

公开(公告)日：2019-07-23

申请号：US14581460

申请日：2014-12-23

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Hiroki Yamamoto

IPC: H05K1/02 ,  H01L27/01 ,  H01G4/30 ,  H01G4/33 ,  H01C1/14 ,  H01C1/142 ,  H01C7/00 ,  H01C17/00 ,  H01G4/012 ,  H05K1/16 ,  H01L27/08 ,  H01L49/02

Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.

公开(公告)号：US10342138B2

公开(公告)日：2019-07-02

申请号：US15670627

申请日：2017-08-07

Applicant: ROHM CO., LTD.

Inventor： Yasuhiro Kondo ,  Katsuya Matsuura ,  Hiroshi Tamagawa

IPC: H01L23/31 ,  H05K3/00 ,  H01L21/71 ,  H01L21/78 ,  H05K3/04 ,  B23K1/005 ,  H05K13/02 ,  H01L23/66 ,  H01L23/00 ,  H01L21/683 ,  H05K1/02 ,  H01L21/66

Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.