公开(公告)号：US20080050524A1

公开(公告)日：2008-02-28

申请号：US11733195

申请日：2007-04-09

Applicant: Ananda Kumar ,  Jorge Albarran ,  Adam Cohen ,  Kieun Kim ,  Michael Lockard ,  Uri Frodis ,  Dennis Smalley

Inventor： Ananda Kumar ,  Jorge Albarran ,  Adam Cohen ,  Kieun Kim ,  Michael Lockard ,  Uri Frodis ,  Dennis Smalley

IPC: B05D1/38 ,  B05D3/00

CPC classification number: B81C1/00666 ,  C25D5/022

Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

公开(公告)号：US20070238978A1

公开(公告)日：2007-10-11

申请号：US11761561

申请日：2007-06-12

Applicant: Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

Inventor： Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

IPC: A61B5/05

CPC classification number: G01R33/287 ,  A61B5/055 ,  A61B10/0275 ,  A61B34/20 ,  A61B2034/2051 ,  A61B2090/374 ,  A61B2090/3958 ,  G01R33/34084 ,  G01R33/341 ,  G01R33/3628 ,  G01R33/3657

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract translation: 这里公开了一种磁共振成像天线，其包括内部导体，可相对于内部导体可滑动地移位的外部屏蔽，以及将内部导体与外部屏蔽电绝缘的绝缘体。 本文公开了一种活检针状天线，包括具有外屏蔽的磁共振成像天线和通过电介质与外屏蔽电绝缘的内导体; 以及活组织检查针，其电连接到所述内部导体并且通过所述电介质与所述外部屏蔽层电绝缘。 本文公开了一种获得具有磁共振成像引导的样本的方法，包括提供采样针磁共振成像天线，将天线推进到要从其获取样本的结构，通过天线检测磁共振数据，以及耦合 样品到天线。

公开(公告)号：US07236816B2

公开(公告)日：2007-06-26

申请号：US10131601

申请日：2002-04-24

Applicant: Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

Inventor： Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

IPC: A61B5/055

CPC classification number: G01R33/287 ,  A61B5/055 ,  A61B10/0275 ,  A61B34/20 ,  A61B2034/2051 ,  A61B2090/374 ,  A61B2090/3958 ,  G01R33/34084 ,  G01R33/341 ,  G01R33/3628 ,  G01R33/3657

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract translation: 这里公开了一种磁共振成像天线，其包括内部导体，可相对于内部导体可滑动地移位的外部屏蔽，以及将内部导体与外部屏蔽电绝缘的绝缘体。 本文公开了一种活检针状天线，包括具有外屏蔽的磁共振成像天线和通过电介质与外屏蔽电绝缘的内导体; 以及活组织检查针，其电连接到所述内部导体并且通过所述电介质与所述外部屏蔽层电绝缘。 本文公开了一种获得具有磁共振成像引导的样本的方法，包括提供采样针磁共振成像天线，将天线推进到要从其获取样本的结构，通过天线检测磁共振数据，以及耦合 样品到天线。

公开(公告)号：US20050215023A1

公开(公告)日：2005-09-29

申请号：US11029221

申请日：2005-01-03

Applicant: Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

Inventor： Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

IPC: G01R31/02 ,  H01L21/20

CPC classification number: G01R1/06716 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/0483 ,  G01R1/07357 ,  G01R31/2886

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

公开(公告)号：US5209817A

公开(公告)日：1993-05-11

申请号：US748445

申请日：1991-08-22

Applicant: Umar M. Ahmad ,  Daniel G. Berger ,  Ananda Kumar ,  Susan J. LaMaire ,  Keshav B. Prasad ,  Sudipta K. Ray ,  Kwong H. Wong

Inventor： Umar M. Ahmad ,  Daniel G. Berger ,  Ananda Kumar ,  Susan J. LaMaire ,  Keshav B. Prasad ,  Sudipta K. Ray ,  Kwong H. Wong

IPC: H01L23/498 ,  H01L23/522 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4644 ,  H01L23/49827 ,  H01L23/5226 ,  H05K3/4605 ,  H05K3/465 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2203/0597 ,  H05K2203/072 ,  H05K3/0023 ,  H05K3/061 ,  H05K3/108 ,  H05K3/184 ,  H05K3/388 ,  H05K3/4661

Abstract: In a multi-level wiring structure wires and vias are formed by an isotropic deposition of a conductive material, such as copper, on a dielectric base, such as a polyimide. In a preferred embodiment of the invention copper is electroplated to a thin seed conducting layer deposited on the surface of the dielectric base in which via openings have been formed. Openings in a resist formed on the surface of the dielectric base over the seed layer forms a pattern defining the wiring and via conductor features. Electroplated copper fills the via openings and wire pattern openings in the resist isotropically so that the upper surfaces of the wiring and vias are co-planar when the plating step is complete. In adding subsequent wiring levels, the resist is removed and the via conductor and wiring pattern covered with another dielectric layer which both encapsulates the conductors of the previous layer and serves as the base for the next level which is formed in the same manner as the previous level.

Abstract translation: 在多层布线结构中，通过诸如铜之类的导电材料的各向同性的沉积，形成导线和通孔，在诸如聚酰亚胺的电介质基底上。 在本发明的一个优选实施例中，将铜电镀到沉积在已经形成通孔开口的电介质基底的表面上的薄种子传导层。 在种子层上形成在电介质基底表面上的抗蚀剂中的开口形成限定布线和通孔导体特征的图案。 电镀铜在各向同性地填充抗蚀剂中的通孔开口和线图案开口，使得当电镀步骤完成时，布线和通孔的上表面是共面的。 在添加其后的布线层次时，去除抗蚀剂，并且通孔导体和布线图案被另一个介电层覆盖，该介质层既封装了前一层的导体并用作下一层的基底，其形成方式与前述 水平。

公开(公告)号：US20110056532A1

公开(公告)日：2011-03-10

申请号：US12556357

申请日：2009-09-09

Applicant: Tirunelveli S. Ravi ,  Ananda Kumar ,  Kramadhati V. Ravi

Inventor： Tirunelveli S. Ravi ,  Ananda Kumar ,  Kramadhati V. Ravi

IPC: H01L31/042 ,  H01L31/18

CPC classification number: H01L31/1804 ,  H01L31/0488 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/1896 ,  Y02E10/547 ,  Y02P70/521

Abstract: A method for fabricating a photovoltaic (PV) cell panel wherein each of a plurality of silicon donor wafers has a separation layer formed on its upper surface, e.g., porous anodically etched silicon. On each donor wafer, a PV cell is then partially completed including at least part of inter-cell interconnect, after which plural donor wafers are laminated to a backside substrate or frontside. All of the donor wafers are then separated from the partially completed PV cells in an exfoliation process, followed by simultaneous completion of the remaining PV cell structures on PV cells. Finally, a second lamination to a frontside glass or a backside panel completes the PV cell panel. The separated donor wafers may be reused in forming other PV cells. Use of epitaxial deposition to form the layers of the PV cells enables improved dopant distributions and sharper junction profiles for improved PV cell efficiency.

Abstract translation: 一种用于制造光伏（PV）电池板的方法，其中多个硅供体晶片中的每一个具有在其上表面上形成的分离层，例如多孔阳极蚀刻的硅。 在每个施主晶片上，PV单元然后部分地完成，包括至少部分单元间互连，之后将多个施主晶片层压到背面基板或前侧。 然后将所有供体晶片在剥离过程中与部分完成的PV电池分离，随后在PV电池上同时完成剩余的PV电池结构。 最后，向前侧玻璃或后侧面板的第二层压完成PV电池面板。 分离的供体晶片可以重新用于形成其它PV电池。 使用外延沉积来形成PV电池的层可以改善掺杂剂分布和更清晰的接线图，以提高PV电池效率。

公开(公告)号：US20110037468A1

公开(公告)日：2011-02-17

申请号：US12879430

申请日：2010-09-10

Applicant: Paul A. Bottomley ,  Ananda Kumar

Inventor： Paul A. Bottomley ,  Ananda Kumar

IPC: G01R33/44

CPC classification number: G01R33/3415 ,  G01R33/3678

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer≧1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about nλ/4, where n is an integer≧1 and λ is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract translation: 特色是用于激发核的NMR或MRI信号以及相关设备，系统和方法的设备。 该装置包括带状阵列天线，其包括一个或多个导体和N个非反应调谐组件，其中N是整数≥1，N个无功分量中的至少一个电耦合到一个或多个导体中的每一个以及接地/ 虚拟地面。 导体的表观电长度用无功调谐分量进行调谐，因此等于大约nλ/ 4，其中n是整数≧1，λ是待检测信号的波长。 条的长度也基本上在感兴趣深度的1.3倍的近似范围内。 带状导体也与环形线圈组合以形成正交检测器。

公开(公告)号：US20080105355A1

公开(公告)日：2008-05-08

申请号：US11929597

申请日：2007-10-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: B32B37/00 ,  B23K31/02

CPC classification number: G01R3/00 ,  G01R1/06761 ,  G01R1/07307 ,  Y10T29/49002 ,  Y10T156/10

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。

公开(公告)号：US20060053625A1

公开(公告)日：2006-03-16

申请号：US11177798

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01R43/16 ,  H01R43/00

CPC classification number: G01R3/00 ,  C25D1/003 ,  G01R1/073 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US20050202180A1

公开(公告)日：2005-09-15

申请号：US11029165

申请日：2005-01-03

Applicant: Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

Inventor： Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

IPC: B05D1/38 ,  C08K3/00 ,  C25D3/30 ,  C25D3/38 ,  C25D3/48 ,  C25D5/02 ,  C25D5/10 ,  C25D21/12 ,  H01L21/288 ,  H01L21/301 ,  H01L21/302 ,  H01L21/4763 ,  H01L21/768

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and/or pre-machining depositions to within a small increment of desired surface level (e.g. using lapping or a rough cutting operation) and then using diamond fly cutting to complete he process, and/or forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.

Abstract translation: 公开了用于形成单层和多层中尺度和微结构的电化学制造方法，其包括使用金刚石加工（例如飞切或车削）来平坦化层。 一些实施例集中于可用于电化学制造的牺牲和结构材料的系统，并且可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn， 和Au和Sn-Pb），其中第一材料或材料是结构材料，第二材料是牺牲材料）。 一些实施例着重于在使用金刚石加工以平面化使用难以加工的材料进行电化学制造的结构（例如，通过沉积难以机械材料选择性且潜在地具有少量多余电镀厚度和/或预加工沉积 到所需表面水平的小增量（例如使用研磨或粗切割操作），然后使用金刚石飞切切割来完成其加工，和/或从硬质材料的薄壁区域形成结构或部分结构 而不是结构材料的宽固体区域。