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公开(公告)号:US20210134375A1
公开(公告)日:2021-05-06
申请号:US16668949
申请日:2019-10-30
Applicant: SanDisk Technologies LLC
Inventor: Hiroki Yabe , Koichiro Hayashi , Takuya Ariki , Yuki Fujita , Naoki Ookuma , Kazuki Yamauchi , Masahito Takehara , Toru Miwa
Abstract: A non-volatile memory device comprising a memory cell region having a plurality of co-planar memory cell planes arranged in a plane parallel to a semiconductor substrate, with each memory cell plane comprising a plurality of sub-planes disposed adjacent one another along an axis that is parallel to the substrate. Further, each memory cell plane comprises a plurality of sense amplifier regions arranged along the axis in an alternating pattern with the sub-planes such that adjacent to each sub-plane is a sense amplifier region and each sense amplifier region is operable with respect to at least a fraction of the bit lines of the two sub-planes immediately adjacent the sense amplifier region.
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公开(公告)号:US10885984B1
公开(公告)日:2021-01-05
申请号:US16668073
申请日:2019-10-30
Applicant: SanDisk Technologies LLC
Inventor: Hiroki Yabe , Koichiro Hayashi , Takuya Ariki , Yuki Fujita , Naoki Ookuma , Kazuki Yamauchi , Masahito Takehara , Toru Miwa
IPC: G11C16/04 , G11C16/14 , H01L27/11524
Abstract: A memory device comprising a semiconductor substrate in which a memory cell region and a peripheral circuitry region are defined, wherein the memory cell region has a plurality of non-volatile memory cells arranged in one or more arrays and the peripheral circuitry region has at least one sense amplifier region comprised of at least one low voltage transistor. Further, a deep N-well region is formed in the substrate, wherein the memory cell region and the peripheral circuitry region are placed on the deep N-well region such that, in the event that a high erase voltage (VERA) is applied to the memory cell region during an erase operation, the high erase voltage is applied to all terminals of the at least one low voltage resistor, thereby protecting the low voltage transistor by preventing it from experiencing a large voltage difference between its terminals.
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公开(公告)号:US10734080B2
公开(公告)日:2020-08-04
申请号:US16213382
申请日:2018-12-07
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Hardwell Chibvongodze , Masatoshi Nishikawa , Naoki Ookuma , Takuya Ariki , Toru Miwa
IPC: G11C16/24 , H01L27/11573 , H01L27/11548 , H01L27/11575 , H01L27/11556 , H01L27/11582 , H01L27/11524 , H01L27/1157 , H01L27/11519 , H01L27/11565 , H01L29/423 , G11C16/04 , G11C16/26 , H01L27/11526 , G11C16/14 , G11C16/10
Abstract: A three-dimensional memory device includes memory stack structures in multiple memory arrays. Bit lines are split into multiple portions traversing different memory arrays. Each sense amplifier is connected to a first portion of a respective bit line via a respective first switching transistor device, and is connected to a second portion of the respective bit line via a respective second switching transistor device. The switching transistor devices connect each sense amplifier to one portion of the bit lines without connecting to another portion of the bit lines, thereby reducing the RC delay. The switching transistor devices may be provided as vertical field effect transistors located at a memory array level, or may be provided in another semiconductor chip.
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公开(公告)号:US20200185039A1
公开(公告)日:2020-06-11
申请号:US16213382
申请日:2018-12-07
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Hardwell Chibvongodze , Masatoshi Nishikawa , Naoki Ookuma , Takuya Ariki , Toru Miwa
IPC: G11C16/24 , H01L27/11526 , H01L27/11573 , H01L27/11548 , H01L27/11575 , H01L27/11556 , H01L27/11582 , H01L27/11524 , H01L27/1157 , H01L27/11519 , H01L27/11565 , H01L29/423 , G11C16/04 , G11C16/26
Abstract: A three-dimensional memory device includes memory stack structures in multiple memory arrays. Bit lines are split into multiple portions traversing different memory arrays. Each sense amplifier is connected to a first portion of a respective bit line via a respective first switching transistor device, and is connected to a second portion of the respective bit line via a respective second switching transistor device. The switching transistor devices connect each sense amplifier to one portion of the bit lines without connecting to another portion of the bit lines, thereby reducing the RC delay. The switching transistor devices may be provided as vertical field effect transistors located at a memory array level, or may be provided in another semiconductor chip.
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公开(公告)号:US09941297B2
公开(公告)日:2018-04-10
申请号:US15607837
申请日:2017-05-30
Applicant: SanDisk Technologies LLC
Inventor: Masatoshi Nishikawa , Kota Funayama , Toru Miwa , Hiroyuki Ogawa
IPC: H01L27/11582 , H01L27/11556 , H01L27/11524 , H01L27/1157
CPC classification number: H01L27/11582 , H01L21/2253 , H01L21/283 , H01L21/76883 , H01L21/76897 , H01L23/5226 , H01L23/5228 , H01L27/11524 , H01L27/11526 , H01L27/11548 , H01L27/11556 , H01L27/1157 , H01L27/11573 , H01L27/11575 , H01L27/11578 , H01L28/20
Abstract: A vertical, columnar resistor in a semiconductor device is provided, along with techniques for fabricating such a resistor. The resistor may be provided in a peripheral area of a 3D memory device which has a two-tier or other multi-tier stack of memory cells. The structure and fabrication of the resistor can be integrated with the structure and fabrication of the stack of memory cells. The resistor may comprise doped polysilicon. In an example implementation, a polysilicon pillar extends a height of a first tier of the stack and a metal pillar above the polysilicon pillar extends a height of a second tier of the stack.
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公开(公告)号:US12230335B2
公开(公告)日:2025-02-18
申请号:US17838717
申请日:2022-06-13
Applicant: SanDisk Technologies LLC
Inventor: Toru Miwa , Fumiaki Toyama
Abstract: A multi-stage method for programming an n-bit memory cell array using a fixed number of data latches is disclosed. The fixed number of data latches may be a reduced number of data latches in sense amplifier and data latch (SADL) peripheral circuitry than is required by existing programming techniques. As such, the die area taken up by the SADL circuitry can be reduced, which in turn, reduces overall chip area. The multi-stage programming method may include utilizing a first data latch to receive and store program page data and utilizing a second data latch to store bit information indicating which cells are to be targeted for the multi-stage programming. At each program stage, a respective program loop may be performed with respect to each threshold voltage distribution generated during a prior program stage to create two new threshold voltage distributions from the prior distribution.
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公开(公告)号:US20240233841A9
公开(公告)日:2024-07-11
申请号:US18357489
申请日:2023-07-24
Applicant: SanDisk Technologies LLC
Inventor: Abu Naser Zainuddin , Jiahui Yuan , Toru Miwa
CPC classification number: G11C16/3459 , G11C16/0483 , G11C16/08 , G11C16/10 , H01L25/0657
Abstract: A memory system programs memory cells connected to a selected word line by applying doses of programming and performing program-verify between doses. An efficient and low current program-verify operation includes: while scanning the results of a previous program-verify operation, ramp up voltages on the select lines for the next program-verify operation without waiting for the scan to complete and ramp up voltages on unselected word lines for the next program-verify operation following a step signal (so that voltage applied to the unselected word lines rise in steps) without waiting for the scan to complete.
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公开(公告)号:US20240128134A1
公开(公告)日:2024-04-18
申请号:US18221797
申请日:2023-07-13
Applicant: SanDisk Technologies LLC
Inventor: Toru Miwa , Takashi Murai , Hiroyuki Ogawa
IPC: H01L21/66
Abstract: A semiconductor wafer includes pairs of semiconductor dies having test pads which are electrically coupled to each other to enable testing of pairs of semiconductor dies together at the same time. In this way, even wafers having large numbers of semiconductor dies can be tested with a semiconductor test assembly in a single touch-down test process.
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公开(公告)号:US20240125846A1
公开(公告)日:2024-04-18
申请号:US18221824
申请日:2023-07-13
Applicant: SanDisk Technologies LLC
Inventor: Toru Miwa , Takashi Murai , Hiroyuki Ogawa , Nisha Padattil Kuliyampattil
IPC: G01R31/28 , G01R1/073 , H01L21/66 , H01L23/522 , H01L25/065
CPC classification number: G01R31/2884 , G01R1/07342 , H01L22/34 , H01L23/5228 , H01L25/0657 , H01L24/48 , H01L2224/48145 , H01L2224/48225 , H01L2225/06562
Abstract: A semiconductor wafer includes pairs of semiconductor dies having test pads which are electrically coupled to each other to enable testing of pairs of semiconductor dies together at the same time. In this way, even wafers having large numbers of semiconductor dies can be tested with a semiconductor test assembly in a single touch-down test process.
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公开(公告)号:US11545221B2
公开(公告)日:2023-01-03
申请号:US17360572
申请日:2021-06-28
Applicant: SanDisk Technologies LLC
Inventor: Xiang Yang , Gerrit Jan Hemink , Ken Oowada , Toru Miwa
Abstract: Technology is disclosed herein for concurrently programming the same data pattern in multiple sets of non-volatile memory cells. Voltage are applied to bit lines in accordance with a data pattern. A select voltage is applied to drain select gates of multiple sets of NAND strings. The system concurrently applies a program pulse to control gates of a different set of selected memory cells in each respective set of the multiple sets of the NAND strings while the select voltage is applied to the drain select gates of the multiple sets of the NAND strings and the voltages are applied to the plurality of bit lines to concurrently program the data pattern into each set of the selected memory cells.
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