LDMOS POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
    11.
    发明申请
    LDMOS POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
    LDMOS功率半导体器件及其制造方法

    公开(公告)号:US20160087084A1

    公开(公告)日:2016-03-24

    申请号:US14964130

    申请日:2015-12-09

    Abstract: Methods form an electronic semiconductor device that includes a body having a first side and a second side opposite to one another and including a first structural region facing the second side, and a second structural region extending over the first structural region and facing the first side. A body region extends in the second structural region at the first side. A source region extends inside the body region and a lightly-doped drain region faces the first side of the body. A gate electrode is formed over the body region. A trench dielectric region extends through the second structural region in a first trench conductive region immediately adjacent to the trench dielectric region. A second trench conductive region is in electrical contact with the body region and source region. An electrical contact on the body is in electrical contact with the drain region through the first structural region.

    Abstract translation: 方法形成电子半导体器件,其包括具有彼此相对的第一侧和第二侧的主体,并且包括面向第二侧的第一结构区域和在第一结构区域上延伸并面向第一侧面的第二结构区域。 身体区域在第一侧的第二结构区域中延伸。 源极区域在体区内延伸,并且轻掺杂的漏极区域面向身体的第一侧。 在主体区域上形成栅电极。 沟槽电介质区域在与沟槽电介质区域紧邻的第一沟槽导电区域中延伸穿过第二结构区域。 第二沟槽导电区域与身体区域和源区域电接触。 身体上的电接触通过第一结构区域与漏区电接触。

    ELECTRICALLY TRIMMABLE RESISTOR DEVICE AND TRIMMING METHOD THEREOF
    13.
    发明申请
    ELECTRICALLY TRIMMABLE RESISTOR DEVICE AND TRIMMING METHOD THEREOF 有权
    电动可调电阻器件及其修正方法

    公开(公告)号:US20130342264A1

    公开(公告)日:2013-12-26

    申请号:US13924159

    申请日:2013-06-21

    Abstract: An integrated circuit has a circuit part and a trimmable resistor, the resistance whereof may be modified by Joule effect. The trimmable resistor has first and second connection terminals coupled to the circuit part, and an intermediate terminal that divides the trimmable resistor into two portions. The first and the second connection terminals and the intermediate terminal are coupled to respective pads configured to receive electrical quantities designed to cause, in use, a respective trimming current flow in each portion. In this way, a substantially zero voltage drop is maintained between the first and second connection terminals while current is flowing in the resistor to change an electrical characteristic of the resistor, such as resistance or thermal coefficient.

    Abstract translation: 集成电路具有电路部分和可调整电阻,其电阻可以通过焦耳效应进行修改。 可调整电阻器具有耦合到电路部分的第一和第二连接端子以及将可调整电阻器分为两部分的中间端子。 第一和第二连接端子和中间端子耦合到相应的焊盘,其被配置成接收设计成在使用中导致每个部分中的相应修整电流的电量。 以这种方式,在第一和第二连接端子之间保持基本为零的电压降,同时电流在电阻器中流动以改变电阻器的电特性,例如电阻或热系数。

    Charge-balance power device, and process for manufacturing the charge-balance power device

    公开(公告)号:US11538903B2

    公开(公告)日:2022-12-27

    申请号:US16945220

    申请日:2020-07-31

    Abstract: A charge-balance power device includes a semiconductor body having a first conductivity type. A trench gate extends in the semiconductor body from a first surface toward a second surface. A body region has a second conductivity type that is opposite the first conductivity type, and the body region faces the first surface of the semiconductor body and extends on a first side and a second side of the trench gate. Source regions having the first conductivity type extend in the body region and face the first surface of the semiconductor body. A drain terminal extends on the second surface of the semiconductor body. The device further comprises a first and a second columnar region having the second conductivity, which extend in the semiconductor body adjacent to the first and second sides of the trench gate, and the first and second columnar regions are spaced apart from the body region and from the drain terminal.

    LDMOS power semiconductor device and manufacturing method of the same

    公开(公告)号:US10297677B2

    公开(公告)日:2019-05-21

    申请号:US15927646

    申请日:2018-03-21

    Abstract: Methods are directed to forming an electronic semiconductor device that includes a body having a first side and a second side opposite to one another and including a first structural region facing the second side, and a second structural region extending over the first structural region and facing the first side. A body region extends in the second structural region at the first side. A source region extends inside the body region and a lightly-doped drain region faces the first side of the body. A gate electrode is formed over the body region. A trench dielectric region extends through the second structural region in a first trench conductive region immediately adjacent to the trench dielectric region. A second trench conductive region is in electrical contact with the body region and source region. An electrical contact on the body is in electrical contact with the drain region through the first structural region.

Patent Agency Ranking