公开(公告)号：US20100019397A1

公开(公告)日：2010-01-28

申请号：US12575586

申请日：2009-10-08

申请人： Sunpil Youn ,  Seok-Chan Lee

发明人： Sunpil Youn ,  Seok-Chan Lee

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L21/50

CPC分类号： H01L23/522 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/528 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48463 ,  H01L2224/49111 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated

摘要翻译： 导电线形成在包含多个电路的晶片上。 导线与晶片内形成的电路隔离。 芯片安装在晶片上，并且其芯片焊盘连接到晶片的导线。 然后可用包装树脂保护晶片，并将其切片

公开(公告)号：US08462511B2

公开(公告)日：2013-06-11

申请号：US13005101

申请日：2011-01-12

申请人： Seok-Chan Lee

发明人： Seok-Chan Lee

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K7/20 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

公开(公告)号：US20120319290A1

公开(公告)日：2012-12-20

申请号：US13530971

申请日：2012-06-22

申请人： Seok-Chan Lee ,  Min-Woo Kim

发明人： Seok-Chan Lee ,  Min-Woo Kim

IPC分类号： H01L23/48

CPC分类号： H01L23/5286 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/522 ,  H01L23/528 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49111 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/731 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012

摘要： A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip.

摘要翻译： 提供半导体芯片。 半导体芯片包括半导体衬底，衬底上的电路，形成在电路上的绝缘层，以及在半导体芯片的主表面上形成在绝缘层上的多个电浮动导体线。

公开(公告)号：US08207617B2

公开(公告)日：2012-06-26

申请号：US13154296

申请日：2011-06-06

申请人： Sunpil Youn ,  Seok-Chan Lee

发明人： Sunpil Youn ,  Seok-Chan Lee

IPC分类号： H01L29/40

CPC分类号： H01L23/522 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/528 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48463 ,  H01L2224/49111 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated.

摘要翻译： 导电线形成在包含多个电路的晶片上。 导线与晶片内形成的电路隔离。 芯片安装在晶片上，并且其芯片焊盘连接到晶片的导线。 然后可用包装树脂保护晶片，并将其切片。

公开(公告)号：US07972902B2

公开(公告)日：2011-07-05

申请号：US12575586

申请日：2009-10-08

申请人： Sunpil Youn ,  Seok-Chan Lee

发明人： Sunpil Youn ,  Seok-Chan Lee

IPC分类号： H01L21/44

CPC分类号： H01L23/522 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/528 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48463 ,  H01L2224/49111 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated.

摘要翻译： 导电线形成在包含多个电路的晶片上。 导线与晶片内形成的电路隔离。 芯片安装在晶片上，并且其芯片焊盘连接到晶片的导线。 然后可用包装树脂保护晶片，并将其切片。