公开(公告)号：US20130135834A1

公开(公告)日：2013-05-30

申请号：US13677432

申请日：2012-11-15

Applicant: TDK CORPORATION

Inventor： Yuhei Horikawa ,  Shin Fujita ,  Kenichi Yoshida ,  Hisayuki Abe ,  Makoto Orikasa ,  Hideyuki Seike

IPC: H05K1/11 ,  H01R43/00 ,  H01R4/02

CPC classification number: H05K1/11 ,  H01R4/02 ,  H01R43/00 ,  H05K1/111 ,  H05K1/141 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49204

Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.

Abstract translation: 电子设备包括端子结构和包括端子结构的印刷电路板。 端子结构包括放置在布线导体上的焊点导体区域，与导体区域接触的中间层以及与中间层接触的焊料区域。 中间层包括包含锡和铜和镍中的至少一种作为主要成分的金属间化合物。 当导体区域的压痕弹性模量为E1，中间层的压痕弹性模量为E2时，E1与E2的比例等于或大于0.8且等于或小于1.5。

公开(公告)号：US11613100B2

公开(公告)日：2023-03-28

申请号：US16876560

申请日：2020-05-18

Applicant: TDK CORPORATION

Inventor： Takashi Yamada ,  Atsushi Sato ,  Makoto Orikasa

IPC: B32B15/01 ,  B32B7/025

Abstract: A noise suppression sheet comprises a pair of metal magnetic layers and a non-magnetic metal layer interposed between the pair of metal magnetic layers, and can achieve high magnetic shield characteristics on both surfaces.

公开(公告)号：US11466368B2

公开(公告)日：2022-10-11

申请号：US16046422

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hiroki Ashizawa ,  Miho Mori ,  Misaki Tamura

IPC: C23C18/16 ,  C23C18/31 ,  H05K1/03 ,  H05K3/06 ,  H05K3/18 ,  B32B15/00 ,  C23C18/38 ,  C23C18/30 ,  C23C18/32

Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

公开(公告)号：US10304779B2

公开(公告)日：2019-05-28

申请号：US15791888

申请日：2017-10-24

Applicant: TDK Corporation

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Hisayuki Abe ,  Yoshihiro Kanbayashi

IPC: H01L23/552 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/288 ,  H01L23/31 ,  H01L23/00

Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.

公开(公告)号：US20180174748A1

公开(公告)日：2018-06-21

申请号：US15840243

申请日：2017-12-13

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01F41/04 ,  H01F41/10 ,  C23C18/16 ,  C25D13/12 ,  C25D13/22

CPC classification number: H01F41/043 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/1653 ,  C25D5/48 ,  C25D13/12 ,  C25D13/22 ,  G06K19/07783 ,  H01F41/04 ,  H01F41/041 ,  H01F41/045 ,  H01F41/10 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q9/27 ,  H05K3/181 ,  H05K3/188 ,  H05K3/241 ,  H05K3/242 ,  H05K3/246

Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

公开(公告)号：US09293421B2

公开(公告)日：2016-03-22

申请号：US14591427

申请日：2015-01-07

Applicant: TDK CORPORATION

Inventor： Miyuki Yanagida ,  Makoto Orikasa ,  Susumu Taniguchi ,  Hisayuki Abe

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06537 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Abstract translation: 根据本发明的电子部件模块设置有电子部件，密封电子部件的密封树脂和覆盖密封树脂的表面的金属膜。 密封树脂含有氧化物颗粒的填料。 密封树脂中的填料的一部分暴露于密封树脂的表面。 暴露于密封树脂表面的填料的至少一部分包括从填料的暴露表面延伸到内部的裂纹。 该裂纹填充有构成金属膜的至少一种金属。

公开(公告)号：US11419250B2

公开(公告)日：2022-08-16

申请号：US16876882

申请日：2020-05-18

Applicant: TDK CORPORATION

Inventor： Takashi Yamada ,  Atsushi Sato ,  Makoto Orikasa ,  Hideharu Moro

IPC: H05K9/00

Abstract: A noise suppression sheet comprises a non-magnetic metal layer, a plurality of metal magnetic layers, and a plurality of insulating layers, and the metal magnetic layer and the insulating layer are alternately laminated on the non-magnetic metal layer. The noise suppression sheet can absorb and suppress noise generated from a circuit or the like in an electronic component by being mounted on the electronic component or the like. In the noise suppression sheet, noise is absorbed by each of the metal magnetic layers. Noise that is transmitted without being absorbed by the metal magnetic layer can be reflected by the non-magnetic metal layer and can be absorbed again by the metal magnetic layer, and hence the noise suppression sheet can suppress noise effectively.

公开(公告)号：US10968519B2

公开(公告)日：2021-04-06

申请号：US16046359

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe

IPC: C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  B32B27/08 ,  B32B27/36 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15 ,  B32B27/18 ,  C23C18/30 ,  H01L23/498 ,  C23F1/02 ,  H01L33/62 ,  H01L23/14 ,  H01L25/075

Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US10784122B2

公开(公告)日：2020-09-22

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  C23C18/20 ,  H01L33/62 ,  G03F7/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  H01L23/00 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US10374301B2

公开(公告)日：2019-08-06

申请号：US15840192

申请日：2017-12-13

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01Q7/00 ,  H01Q1/38 ,  H04B5/00 ,  H01Q1/22

Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.