公开(公告)号：US5298548A

公开(公告)日：1994-03-29

申请号：US885965

申请日：1992-05-20

申请人： Toshio Shiobara ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Hisashi Shimizu ,  Takashi Tsuchiya

发明人： Toshio Shiobara ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Hisashi Shimizu ,  Takashi Tsuchiya

IPC分类号： C08G59/24 ,  C08G59/00 ,  C08G59/20 ,  C08G59/32 ,  C08G59/38 ,  C08G59/62 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31 ,  C08G59/22

CPC分类号： H01B3/40 ,  C08G59/3218 ,  C08G59/38 ,  C08L63/00

摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

摘要翻译： 包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性， 弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。

公开(公告)号：US5179176A

公开(公告)日：1993-01-12

申请号：US649027

申请日：1991-02-01

申请人： Toshio Shiobara ,  Hisashi Shimizu ,  Takayuki Aoki

发明人： Toshio Shiobara ,  Hisashi Shimizu ,  Takayuki Aoki

IPC分类号： C07D303/27 ,  C08G8/12 ,  C08G59/08 ,  C08G59/32 ,  C08L63/00 ,  C08L79/08

CPC分类号： C08L63/00 ,  C08G59/08 ,  C08G59/3218 ,  C08G8/12 ,  C08L79/085

摘要： An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

公开(公告)号：US20120295514A1

公开(公告)日：2012-11-22

申请号：US13574341

申请日：2011-01-24

申请人： Willem Steven Paul Keppens ,  Tim Bollens ,  Felix Leopold Wackers ,  Hidetoshi Yokoi ,  Masahiro Yoneda ,  Takayuki Aoki

发明人： Willem Steven Paul Keppens ,  Tim Bollens ,  Felix Leopold Wackers ,  Hidetoshi Yokoi ,  Masahiro Yoneda ,  Takayuki Aoki

IPC分类号： A01K47/06

CPC分类号： A01K47/06

摘要： This invention relates to a nest box (1) for bumblebees that provides sufficient ventilation inside the nest box (1). The provided nest box (1) with a bumblebees hive (2) inside resolves the problems of insufficient ventilation, by being mounted with a ventilation panel (14), comprising ventilation holes (13) in size(s) that enable ventilation but at the same time bumblebees from passing through.

摘要翻译： 本发明涉及一种用于在巢箱（1）内提供充分通气的用于大黄蜂的巢箱（1）。 所提供的具有大黄蜂蜂巢（2）的巢箱（1）通过安装有通风面板（14）来安装通风的问题，解决了通风不足的问题，该通风面板包括通风孔（13），其具有能够通风的通风孔， 同一时间的大黄蜂通过。

公开(公告)号：US08129020B2

公开(公告)日：2012-03-06

申请号：US12066057

申请日：2006-09-14

申请人： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

发明人： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

IPC分类号： C08J9/16 ,  B32B1/00

CPC分类号： B01J13/20 ,  B29C44/3461 ,  C08J9/143 ,  C08J9/32 ,  C08J2333/18 ,  Y10T428/2982 ,  Y10T428/2984 ,  Y10T428/2985 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Heat-expanded microspheres having high packing efficiency are produced by expanding heat-expandable microspheres, which include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.

摘要翻译： 具有高填充效率的热膨胀微球通过膨胀热膨胀性微球来制造，该微球包括热塑性树脂壳和封装在其中的发泡剂，其沸点不高于热塑性树脂的软化点，并且具有平均粒径 1至100微米，温度不低于其膨胀起始温度，热膨胀微球体的空隙率不高于0.70。

公开(公告)号：US07943706B2

公开(公告)日：2011-05-17

申请号：US11386667

申请日：2006-03-23

申请人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

发明人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

IPC分类号： C08F283/00 ,  B32B27/38 ,  C08G59/50

CPC分类号： H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

摘要： An epoxy resin composition comprising(A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210,(B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and(C) an inorganic filler,the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

摘要翻译： 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US20100180995A1

公开(公告)日：2010-07-22

申请号：US12091538

申请日：2006-10-24

申请人： Hiroyuki Teratani ,  Toshiaki Masuda ,  Kenichi Kitano ,  Katsushi Miki ,  Takayuki Aoki ,  Takeshi Inohara

发明人： Hiroyuki Teratani ,  Toshiaki Masuda ,  Kenichi Kitano ,  Katsushi Miki ,  Takayuki Aoki ,  Takeshi Inohara

IPC分类号： B60C5/12 ,  B32B1/00 ,  B01J13/18 ,  B60C19/00

CPC分类号： B01J13/185 ,  B29D30/04 ,  B60C17/01 ,  B60C17/066 ,  Y10T152/10054 ,  Y10T428/1397 ,  Y10T428/2998

摘要： In heat-expandable microspheres as a starting material for hollow fine particles, which have excellent performances required for giving not only a durability in steady running region but also a durability in high-speed running region to a tire-rim assembly, and each consisting of an outer shell made of a thermoplastic resin obtained by polymerizing a monomer component in the presence of a polymerization initiator, and a foaming agent encapsulated in the outer shell and having a boiling point not higher than a softening point of the thermoplastic resin, the polymerization initiator comprises a peroxydicarbonate as an essential component, and the foaming agent comprises a fluorine-containing compound having an ether structure and a carbon number of 2-10 and containing no chlorine atom and bromine atom.

摘要翻译： 在作为中空微粒的原料的热膨胀性微球中，其具有优异的性能，其不仅在稳定运行区域中不仅具有耐久性，而且在高速运行区域中对轮胎 - 轮辋组件的耐久性，并且各自由 由在聚合引发剂存在下聚合单体成分而获得的热塑性树脂制成的外壳和封装在外壳中并且沸点不高于热塑性树脂的软化点的发泡剂，聚合引发剂 以过氧化二碳酸酯为必须成分，发泡剂含有具有醚结构，碳数为2-10且不含氯原子和溴原子的含氟化合物。

公开(公告)号：US20090280328A1

公开(公告)日：2009-11-12

申请号：US12066057

申请日：2006-09-14

申请人： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

发明人： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

IPC分类号： B32B1/00 ,  C08J9/16

CPC分类号： B01J13/20 ,  B29C44/3461 ,  C08J9/143 ,  C08J9/32 ,  C08J2333/18 ,  Y10T428/2982 ,  Y10T428/2984 ,  Y10T428/2985 ,  Y10T428/2991 ,  Y10T428/2998

摘要： The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.

摘要翻译： 本发明提供具有高填充效率的热膨胀微球及其制造方法。 热膨胀微球体是通过膨胀包含热塑性树脂壳和封装在其中的沸点不高于热塑性树脂的软化点的发泡剂的热膨胀性微球而制成的，平均粒径为1〜100 微米，其温度不低于其膨胀起始温度，热膨胀微球导致不高于0.70的空隙率。

公开(公告)号：US20080255283A1

公开(公告)日：2008-10-16

申请号：US12026433

申请日：2008-02-05

申请人： Takayuki Aoki ,  Tadaharu Ikeda

发明人： Takayuki Aoki ,  Tadaharu Ikeda

IPC分类号： C08K3/36 ,  C08K5/05 ,  H01L23/29 ,  C08K5/06

CPC分类号： H01L23/293 ,  C08K3/013 ,  C08K5/0008 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermosetting epoxy resin composition is provided comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. In one embodiment, (B) an internal parting agent having a melting point of 50-90° C. is included. In another embodiment, (I) inorganic whisker fibers having an average fineness of 0.05-50 μm and an average length of 1.0-1,000 μm are included.

摘要翻译： 提供一种热固性环氧树脂组合物，其包含（A）通过三嗪衍生的环氧树脂与酸酐反应获得的反应产物，（C）反射剂，（D）无机填料和（E）固化催化剂。 在一个实施方案中，包括（B）熔点为50-90℃的内部脱模剂。 在另一个实施方案中，包括（I）平均纤度为0.05-50μm，平均长度为1.0-1,000μm的无机须须纤维。

公开(公告)号：US06723452B2

公开(公告)日：2004-04-20

申请号：US10196222

申请日：2002-07-17

申请人： Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

发明人： Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L23/293 ,  C08G59/20 ,  C08G59/245 ,  C08G59/3218 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L2666/22 ,  H01L2924/00

摘要： Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

摘要翻译： 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。

公开(公告)号：US06177489B1

公开(公告)日：2001-01-23

申请号：US09003517

申请日：1998-01-06

申请人： Satoshi Okuse ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Takayuki Aoki ,  Eiichi Asano ,  Shigeki Ino

发明人： Satoshi Okuse ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Takayuki Aoki ,  Eiichi Asano ,  Shigeki Ino

IPC分类号： C08L6302

CPC分类号： H01L23/295 ,  C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08K5/20 ,  C08K5/5397 ,  C08K5/54 ,  C08L63/00 ,  C09K21/14 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/22 ,  H01L2924/00

摘要： A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.

摘要翻译： 适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个 酚羟基和（C）二氧化硅。 组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。 固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。