公开(公告)号：US20050242355A1

公开(公告)日：2005-11-03

申请号：US11119403

申请日：2005-04-29

申请人： Ewald Karl Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

发明人： Ewald Karl Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L21/00 ,  H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L29/16

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).

摘要翻译： 本发明涉及一种具有至少一个LED芯片（11）的LED装置，该LED芯片（11）包括辐射去耦表面（12），在LED芯片（11）中产生的大部分电磁辐射通过该去耦合表面被去耦合。 布置在辐射去耦表面（12）上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层（13）。 壳体（17）包围LED芯片（11）的部分和荧光体层（13）。

公开(公告)号：US20070166853A1

公开(公告)日：2007-07-19

申请号：US11686525

申请日：2007-03-15

申请人： Ewald Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

发明人： Ewald Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

IPC分类号： H01L21/52

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

摘要翻译： 本发明涉及一种具有至少一个LED芯片的LED装置，其包括辐射去耦表面，通过该辐射去耦表面在LED芯片中产生的大部分电磁辐射被去耦合。 布置在辐射去耦表面上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层。 壳体包围LED芯片和荧光体层的部分。

公开(公告)号：US20060022212A1

公开(公告)日：2006-02-02

申请号：US11202424

申请日：2005-08-11

申请人： Gunter Waitl ,  Robert Lutz ,  Herbert Brunner

发明人： Gunter Waitl ,  Robert Lutz ,  Herbert Brunner

IPC分类号： H01L33/00 ,  H01L31/0232

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.

摘要翻译： 一种用于制造表面安装光电子部件的方法包括以下步骤：利用布置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部， 并将光学装置放置在基体上，由此光学装置与铸塑料接触。

公开(公告)号：US5985696A

公开(公告)日：1999-11-16

申请号：US48561

申请日：1998-03-26

申请人： Herbert Brunner ,  Heinz Haas ,  Gunter Waitl

发明人： Herbert Brunner ,  Heinz Haas ,  Gunter Waitl

IPC分类号： H01L31/0203 ,  H01L33/48 ,  H01L33/58 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L27/15

CPC分类号： H01L33/483 ,  H01L31/0203 ,  H01L33/58 ,  H01L2224/48247

摘要： The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened with predetermined alignment of its optical axis. A plastic base part supports the chip carrier. The semiconductor chip is electrically conductively connected to at least two electrode terminals routed through the base part, and a lens is disposed above the semiconductor chip on top of the base part. The lens is formed with an independently configured cap produced from plastic material. The cap is mechanically form-locked to a support of the base part. When the cap is placed onto the base part, a holder of the cap and the support engage with one another. The holder and the support are configured such that when the cap is placed onto the base part, the two parts are automatically positioned with respect to one another in such a way that the optical axes of the lens and of the semiconductor chip coincide.

公开(公告)号：US20080315227A1

公开(公告)日：2008-12-25

申请号：US11631058

申请日：2005-05-18

申请人： Georg Bogner ,  Stefan Grotsch ,  Gunter Waitl ,  Mario Wanninger

发明人： Georg Bogner ,  Stefan Grotsch ,  Gunter Waitl ,  Mario Wanninger

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.

摘要翻译： 公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

公开(公告)号：US20060011928A1

公开(公告)日：2006-01-19

申请号：US10519347

申请日：2003-06-04

申请人： Jorg Sorg ,  Georg Bogner ,  Gunter Waitl ,  Reinhold Brunner

发明人： Jorg Sorg ,  Georg Bogner ,  Gunter Waitl ,  Reinhold Brunner

IPC分类号： H01L31/0203 ,  H01L33/00 ,  H01L31/0232

CPC分类号： H01L33/62 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/12041 ,  H05K1/0203 ,  H05K3/3442 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe (16) is formed by a flexible multi-layered sheet (12, 14).

摘要翻译： 一种具有芯片封装的表面贴装微型发光二极管，其具有引线框架（16）和半导体芯片（22），所述引线框架和半导体芯片（22）布置在所述引线框架（16）上并且与所述引线框架（16）电接触并且包含有源辐射 地区。 引线框架（16）由柔性多层板（12,14）形成。

公开(公告)号：US20050212098A1

公开(公告)日：2005-09-29

申请号：US11052712

申请日：2005-01-31

申请人： Georg Bogner ,  Jorg Sorg ,  Gunter Waitl

发明人： Georg Bogner ,  Jorg Sorg ,  Gunter Waitl

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 μm. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).

摘要翻译： 具有半导体芯片（1）的表面安装半导体部件，至少两个外部电连接（31/314/41,32/324/42），其导电地连接到半导体芯片（1）的至少两个电触头 ）和封装材料（50）。 两个外部电连接被布置在厚度小于或等于100μm的膜（2）上。 半导体芯片（1）固定在膜（2）的第一主表面（22）上，并且封装材料（50）被施加在第一表面（22）上。

公开(公告)号：US20090052178A1

公开(公告)日：2009-02-26

申请号：US12288376

申请日：2008-10-20

申请人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

发明人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC分类号： F21V29/00

CPC分类号： H01L25/0753 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00012

摘要： A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

摘要翻译： 包括多个LED模块的多个LED模块的配置，每个LED模块各自包含具有第一主区域，第二主区域和至少一个半导体层的载体，其中第一主区域具有平面配置。 LED模块还包括施加在载体的第一主区域上的多个LED半导体体。 此外，多个LED模块包括公共散热器，其中每种情况下LED模块的载体连接到第二主区域上的公共散热器。

公开(公告)号：US20070290383A1

公开(公告)日：2007-12-20

申请号：US11894569

申请日：2007-08-20

申请人： Georg Bogner ,  Wolfgang Gramann ,  Patrick Kromotis ,  Werner Marchl ,  Werner Spath ,  Gunter Waitl

发明人： Georg Bogner ,  Wolfgang Gramann ,  Patrick Kromotis ,  Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC分类号： B29D11/00

CPC分类号： G02B3/0031 ,  B29D11/00278 ,  B29D11/00365 ,  F21V5/04 ,  F21Y2115/10 ,  G02B3/0056 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.

摘要翻译： 公开了一种用于制造适于制造微透镜领域的透镜模具的方法。 该方法包括从由六边形安装件保持的紧密包装的球的一组模制模制透镜模具的步骤。

公开(公告)号：US20060147151A1

公开(公告)日：2006-07-06

申请号：US11314150

申请日：2005-12-21

申请人： Mario Wanninger ,  Markus Hofmann ,  Gunter Waitl ,  Alexander Wilm

发明人： Mario Wanninger ,  Markus Hofmann ,  Gunter Waitl ,  Alexander Wilm

IPC分类号： G02B6/10

CPC分类号： G02B6/003 ,  B60Q1/2611 ,  F21S43/14 ,  F21S43/237 ,  F21S43/245 ,  F21S43/247 ,  F21W2103/00 ,  F21W2103/20 ,  F21W2111/00 ,  F21Y2115/10 ,  G02B6/0038 ,  G02B6/0046 ,  G02B6/0055 ,  G02B6/008

摘要： A lighting device is disclosed comprising a plurality of semiconductor light sources disposed on a carrier, wherein the light from the light sources is coupled into assigned lightguides at a set angle to the surface normals of the carrier and the lightguides are provided with reflecting and light exit faces such that the envelope of the light outcoupling faces forms a curved surface segment.

摘要翻译： 公开了一种照明装置，其包括设置在载体上的多个半导体光源，其中来自光源的光以与载体的表面法线成设定的角度耦合到指定的光导中，并且光导设置有反射和光出射 使得光输出耦合面的外壳形成曲面段。