公开(公告)号：US09455351B1

公开(公告)日：2016-09-27

申请号：US14841731

申请日：2015-09-01

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhibiao Zhou ,  Shao-Hui Wu ,  Chi-Fa Ku ,  Chen-Bin Lin ,  Chun-Yuan Wu

IPC: H01L29/786 ,  H01L29/66 ,  H01L27/12 ,  H01L29/417

CPC classification number: H01L29/7869 ,  H01L27/1225 ,  H01L27/1259 ,  H01L29/41733 ,  H01L29/66969

Abstract: An oxide semiconductor field effect transistor (OS FET) device includes a first dielectric layer formed on a substrate, an oxide semiconductor (OS) island formed on the first dielectric layer, a first gate electrode formed on the OS island, a gate dielectric layer formed in between the first gate electrode and the OS island, a patterned hard mask layer formed on a top surface of the first gate electrode, an etch stop layer covering a top surface of the patterned hard mask layer and sidewalls of the first gate electrode, and a source electrode and a drain electrode formed on the OS island. At least one of the source electrode and the drain electrode partially overlaps the etching stop layer on the sidewalls of the first gate electrode.

Abstract translation: 一种氧化物半导体场效应晶体管（OS FET）器件包括形成在基板上的第一介电层，形成在第一介电层上的氧化物半导体（OS）岛，形成在OS岛上的第一栅电极，形成的栅介质层 在第一栅电极和OS岛之间，形成在第一栅电极的顶表面上的图案化硬掩模层，覆盖图案化硬掩模层的顶表面和第一栅电极的侧壁的蚀刻停止层，以及 形成在OS岛上的源电极和漏电极。 源极电极和漏极电极中的至少一个部分地与第一栅电极的侧壁上的蚀刻停止层重叠。

公开(公告)号：US10102907B2

公开(公告)日：2018-10-16

申请号：US15382755

申请日：2016-12-19

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhibiao Zhou ,  Chen-Bin Lin ,  Chi-Fa Ku ,  Shao-Hui Wu

IPC: H01L27/108 ,  H01L29/786 ,  G11C14/00 ,  H01L49/02 ,  H01L27/12 ,  H01L21/02

Abstract: A method for fabricating a semiconductor memory device is disclosed. A semiconductor substrate having a main surface is prepared. At least a first dielectric layer is formed on the main surface of the semiconductor substrate. A first OS FET device and a second OS FET device are formed on the first dielectric layer. At least a second dielectric layer is formed to cover the first dielectric layer, the first OS FET device, and the second OS FET device. A first MIM capacitor and a second MIM capacitor are formed on the second dielectric layer. The first MIM capacitor is electrically coupled to the first OS FET device, thereby constituting a DOSRAM cell. The second MIM capacitor is electrically coupled to the second OS FET device, thereby constituting a NOSRAM cell.

公开(公告)号：US20180138316A1

公开(公告)日：2018-05-17

申请号：US15853875

申请日：2017-12-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： ZHIBIAO ZHOU ,  Ding-Lung Chen ,  Chen-Bin Lin ,  SANPO WANG ,  Chung-Yuan Lee ,  Chi-Fa Ku

IPC: H01L29/786 ,  H01L29/792 ,  H01L29/788

CPC classification number: H01L29/78609 ,  H01L29/42328 ,  H01L29/42344 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/788 ,  H01L29/7881 ,  H01L29/792

Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a first dielectric layer covering on the oxide-semiconductor layer and the source/drain regions, a second gate between the two source/drain regions and partially covering the oxide-semiconductor layer, and a charge storage structure between the first gate electrode and the oxide-semiconductor layer.

公开(公告)号：US09851780B2

公开(公告)日：2017-12-26

申请号：US14829644

申请日：2015-08-19

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhibiao Zhou ,  Shao-Hui Wu ,  Chi-Fa Ku ,  Chen-Bin Lin

IPC: G06F1/32 ,  G06F3/06 ,  H01L27/10 ,  H01L27/06 ,  H01L27/07 ,  H01L27/108 ,  G11C16/00 ,  G11C7/10 ,  G11C5/14

CPC classification number: G06F1/3293 ,  G06F1/324 ,  G06F1/3275 ,  G06F1/3287 ,  G11C5/141 ,  G11C7/1006 ,  G11C16/00 ,  G11C2211/4016 ,  H01L27/06 ,  H01L27/07 ,  H01L27/108

Abstract: A semiconductor device includes a main processor, a normally-off processor, and at least one oxide semiconductor random access memory (RAM). The normally-off processor includes at least one oxide semiconductor transistor. The main processor is connected to the normally-off processor, and a clock rate of the main processor is higher than a clock rate of the normally-off processor. The oxide semiconductor RAM is connected to the normally-off processor. An operating method of the semiconductor includes backing up data from the main processor to the normally-off processor and/or the oxide semiconductor RAM.

公开(公告)号：US20170170256A1

公开(公告)日：2017-06-15

申请号：US14996244

申请日：2016-01-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： ZHIBIAO ZHOU ,  Shao-Hui Wu ,  Chi-Fa Ku ,  Chen-Bin Lin

IPC: H01L49/02

CPC classification number: H01L28/91

Abstract: A method for fabricating capacitor is disclosed. The method includes the steps of: providing a material layer; forming a first conductive layer, a first dielectric layer, and a second conductive layer on the material layer; patterning the first dielectric layer and the second conductive layer to form a patterned first dielectric layer and a middle electrode; forming a second dielectric layer on the first conductive layer and the middle electrode; removing part of the second dielectric layer to form a patterned second dielectric layer; forming a third conductive layer on the first conductive layer and the patterned second dielectric layer, wherein the third conductive layer contacts the first conductive layer directly; and removing part of the third conductive layer to expose part of the patterned second dielectric layer.

公开(公告)号：US09620649B1

公开(公告)日：2017-04-11

申请号：US14960041

申请日：2015-12-04

Applicant: United Microelectronics Corp.

Inventor： Hai-Biao Yao ,  Shao-Hui Wu ,  Chi-Fa Ku ,  Chen-Bin Lin ,  Zhi-Biao Zhou

IPC: H01L29/06 ,  H01L29/78 ,  H01L29/786 ,  H01L29/66 ,  H01L21/02 ,  H01L21/033 ,  H01L29/51

CPC classification number: H01L29/7869 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/02565 ,  H01L21/0332 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66795 ,  H01L29/66969 ,  H01L29/785 ,  H01L29/78606 ,  H01L29/78696

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes an oxide semiconductor protrusion, a source, a drain, an oxide semiconductor layer, a first O-barrier layer, a gate electrode, a second O-barrier layer, and an H-barrier layer. The oxide semiconductor protrusion is disposed on an oxide substrate. The source and the drain are respectively disposed on opposite ends of the oxide semiconductor protrusion. The oxide semiconductor layer is disposed on the oxide substrate and covers the oxide semiconductor protrusion, the source, and the drain. The first O-barrier layer is disposed on the oxide semiconductor layer. The gate electrode is disposed on the first O-barrier layer and across the oxide semiconductor protrusion. The second O-barrier layer is disposed on the gate electrode. The H-barrier layer is disposed on the oxide substrate and covers the second O-barrier layer.

公开(公告)号：US11011649B2

公开(公告)日：2021-05-18

申请号：US16027386

申请日：2018-07-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhibiao Zhou ,  Shao-Hui Wu ,  Chen-Bin Lin ,  Ding-Lung Chen ,  Chi-Fa Ku

IPC: H01L29/10 ,  H01L29/786 ,  H01L29/66 ,  H01L21/426 ,  H01L27/12 ,  H01L29/49

Abstract: An oxide semiconductor device and a method for manufacturing the same are provided in the present invention. The oxide semiconductor device includes a back gate, an oxide semiconductor film, a pair of source and drain electrodes, a gate insulating film, a gate electrode on the oxide semiconductor film with the gate insulating film therebetween, an insulating layer covering only over the gate electrode and the pair of source and drain electrodes, and a top blocking film over the insulating layer.

公开(公告)号：US20180331233A1

公开(公告)日：2018-11-15

申请号：US16027386

申请日：2018-07-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： ZHIBIAO ZHOU ,  Shao-Hui Wu ,  Chen-Bin Lin ,  Ding-Lung Chen ,  Chi-Fa Ku

IPC: H01L29/786 ,  H01L21/426 ,  H01L29/66

CPC classification number: H01L29/78696 ,  H01L21/426 ,  H01L27/1225 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78609 ,  H01L29/78648 ,  H01L29/7869

Abstract: An oxide semiconductor device and a method for manufacturing the same are provided in the present invention. The oxide semiconductor device includes a back gate, an oxide semiconductor film, a pair of source and drain electrodes, a gate insulating film, a gate electrode on the oxide semiconductor film with the gate insulating film therebetween, an insulating layer covering only over the gate electrode and the pair of source and drain electrodes, and a top blocking film over the insulating layer.

公开(公告)号：US09935099B2

公开(公告)日：2018-04-03

申请号：US14956398

申请日：2015-12-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhibiao Zhou ,  Chen-Bin Lin ,  Su Xing ,  Chi-Chang Shuai ,  Chung-Yuan Lee

IPC: H01L27/06 ,  H01L23/535 ,  H01L29/22 ,  H01L29/861 ,  H01L29/10 ,  H01L29/24 ,  H01L49/02 ,  H01L29/06

CPC classification number: H01L27/0629 ,  H01L23/535 ,  H01L27/0727 ,  H01L28/00 ,  H01L28/40 ,  H01L29/0603 ,  H01L29/1079 ,  H01L29/22 ,  H01L29/24 ,  H01L29/861

Abstract: The present invention provides a semiconductor device including a semiconductor substrate, a first well, a second well, a gate electrode, an oxide semiconductor structure and a diode. The first well is disposed in the semiconductor substrate and has a first conductive type, and the second well is also disposed in the semiconductor substrate, adjacent to the first well, and has a second conductive type. The gate electrode is disposed on the first well. The oxide semiconductor structure is disposed on the semiconductor substrate and electrically connected to the second well. The diode is disposed between the first well and the second well.

公开(公告)号：US09887293B2

公开(公告)日：2018-02-06

申请号：US15191542

申请日：2016-06-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zhibiao Zhou ,  Ding-Lung Chen ,  Chen-Bin Lin ,  Sanpo Wang ,  Chung-Yuan Lee ,  Chi-Fa Ku

IPC: H01L29/78 ,  H01L29/786 ,  H01L29/792 ,  H01L29/788

CPC classification number: H01L29/78609 ,  H01L29/42328 ,  H01L29/42344 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/788 ,  H01L29/7881 ,  H01L29/792

Abstract: A semiconductor device is provided in the present invention, which includes a substrate, an oxide-semiconductor layer, source/drain regions, a dielectric layer, a first gate electrode, a second gate electrode and a charge storage structure. The oxide-semiconductor layer is disposed on the first gate electrode on the substrate. The source/drain regions are disposed on the oxide-semiconductor layer. The first dielectric layer covers on the oxide-semiconductor layer and source/drain regions. A second gate electrode is disposed between source/drain regions and partially covers the oxide-semiconductor layer. The oxide-semiconductor layer may be optionally disposed between the first gate electrode and the oxide-semiconductor layer or be disposed on the second gate electrode.