FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
    13.
    发明申请
    FORMATION OF VERTICAL DEVICES BY ELECTROPLATING 有权
    通过电镀形成垂直装置

    公开(公告)号:US20090294989A1

    公开(公告)日:2009-12-03

    申请号:US12538782

    申请日:2009-08-10

    IPC分类号: H01L23/48

    摘要: The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures.

    摘要翻译: 本发明涉及通过电镀形成垂直导电结构的方法。 具体地,首先形成模板结构,其包括衬底,位于衬底表面上的离散金属接触焊盘,分立金属接触焊盘和衬底两者之间的级间电介质(ILD)层,以及金属通孔结构 延伸穿过ILD层到分立的金属接触垫上。 接下来,在模板结构中形成垂直通孔,其延伸穿过ILD层到分立的金属接触垫上。 然后通过电镀在垂直通孔中形成垂直导电结构,电镀通过通过金属通孔结构将电镀电流施加到离散的金属接触焊盘来进行。 优选地,模板结构包括多个分立的金属接触焊盘,多个金属通孔结构以及用于形成多个垂直导电结构的多个垂直通孔。

    OHMIC CONTACT OF THIN FILM SOLAR CELL
    14.
    发明申请
    OHMIC CONTACT OF THIN FILM SOLAR CELL 审中-公开
    薄膜太阳能电池的OHMIC接触

    公开(公告)号:US20140030843A1

    公开(公告)日:2014-01-30

    申请号:US13558383

    申请日:2012-07-26

    IPC分类号: H01L31/0264 B82Y40/00

    摘要: A chalcogen-resistant material including at least one of a carbon nanotube layer and a high work function material layer is deposited on a transition metal layer on a substrate. A semiconductor chalcogenide/kesterite material layer is deposited over the chalcogen-resistant material. The carbon nanotubes, if present, can reduce contact resistance by providing direct electrically conductive paths from the transition metal layer through the chalcogen-resistant material and to the semiconductor chalcogenide material. The high work function material layer, if present, can reduce contact resistance by reducing chalcogenization of the transition metal in the transition metal layer. Reduction of the contact resistance can enhance efficiency of a solar cell including the chalcogenide semiconductor material.

    摘要翻译: 包含碳纳米管层和高功函数材料层中的至少一种的耐硫属材料沉积在基板上的过渡金属层上。 半导体硫族化物/凯斯特石材料层沉积在抗硫属材料上。 碳纳米管(如果存在)可以通过提供从过渡金属层通过硫属元素抵抗材料和半导体硫族化物材料的直接导电路径来降低接触电阻。 如果存在高功函数材料层,则可以通过减少过渡金属层中的过渡金属的硫族化来降低接触电阻。 降低接触电阻可以提高包括硫族化物半导体材料的太阳能电池的效率。

    Vertical nanowire FET devices
    15.
    发明授权
    Vertical nanowire FET devices 有权
    垂直纳米线FET器件

    公开(公告)号:US08637849B2

    公开(公告)日:2014-01-28

    申请号:US12984653

    申请日:2011-01-05

    IPC分类号: H01L29/06

    摘要: A Vertical Field Effect Transistor (VFET) formed on a substrate, with a conductive bottom electrode formed thereon. A bottom dielectric spacer layer and a gate dielectric layer surrounded by a gate electrode are formed thereabove. Thereabove is an upper spacer layer. A pore extends therethrough between the electrodes. A columnar Vertical Semiconductor Nanowire (VSN) fills the pore and between the top and bottom electrodes. An FET channel is formed in a central region of the VSN between doped source and drain regions at opposite ends of the VSN. The gate dielectric structure, that is formed on an exterior surface of the VSN above the bottom dielectric spacer layer, separates the VSN from the gate electrode.

    摘要翻译: 形成在衬底上的垂直场效应晶体管(VFET),其上形成有导电底电极。 在其上方形成由栅电极包围的底部电介质隔离层和栅介质层。 以上是上隔离层。 孔在电极之间延伸穿过。 柱状垂直半导体纳米线(VSN)填充孔和顶部和底部电极之间。 在VSN的相对端处的掺杂源极和漏极区域之间的VSN的中心区域中形成FET沟道。 在底部电介质间隔层上方的VSN的外表面上形成的栅极电介质结构将VSN与栅电极分离。

    METHOD OF FABRICATING A FLEXIBLE PHOTOVOLTAIC FILM CELL WITH AN IRON DIFFUSION BARRIER LAYER
    16.
    发明申请
    METHOD OF FABRICATING A FLEXIBLE PHOTOVOLTAIC FILM CELL WITH AN IRON DIFFUSION BARRIER LAYER 有权
    利用铁扩散障碍层制作柔性光伏电池的方法

    公开(公告)号:US20130074915A1

    公开(公告)日:2013-03-28

    申请号:US13245016

    申请日:2011-09-26

    摘要: A method of fabricating a flexible photovoltaic film cell with an iron diffusion barrier layer. The method includes: providing a foil substrate including iron; forming an iron diffusion barrier layer on the foil substrate, where the iron diffusion barrier layer prevents the iron from diffusing; forming an electrode layer on the iron diffusion barrier layer; and forming at least one light absorber layer on the electrode layer. A flexible photovoltaic film cell is also provided, which cell includes: a foil substrate including iron; an iron diffusion barrier layer formed on the foil substrate to prevent the iron from diffusing; an electrode layer formed on the iron diffusion barrier layer; and at least one light absorber layer formed on the electrode layer.

    摘要翻译: 一种制造具有铁扩散阻挡层的柔性光伏电池的方法。 该方法包括:提供包括铁的箔基板; 在所述箔基板上形成铁扩散阻挡层,其中所述铁扩散阻挡层防止所述铁扩散; 在铁扩散阻挡层上形成电极层; 以及在所述电极层上形成至少一个光吸收层。 还提供了一种柔性光伏电池,该电池包括:包含铁的箔基材; 形成在所述箔基板上以防止铁扩散的铁扩散阻挡层; 形成在铁扩散阻挡层上的电极层; 以及形成在电极层上的至少一个光吸收层。