摘要:
A thermally conductive polymer composite material and an article including the same. The thermally conductive polymer composite material includes 15 to 20 parts by weight of a wholly aromatic liquid crystalline polyester resin; and 80 to 85 parts by weight of a thermally conductive additive.
摘要:
The invention relates to a method of preparing wholly aromatic polyester including: mixing monomers, introducing the mixed monomers into a reactor having a rectangular or trapezoidal plate type stirring impeller, and polymerizing the introduced monomers through esterification with a power per unit volume of 10˜60 kW/m3, a length (L) to diameter (D) ratio of the stirring impeller is 1˜3:1, and a distance between the bottom of the reactor and a lower portion of the stirring impeller is 1/100˜ 1/15 times of the diameter (D); b) pulverizing the obtained polymer; and c) solid state polymerizing the pulverized polymer. The present invention also relates to a method of preparing wholly aromatic polyester having excellent heat resistant properties in which byproduct is effectively discharged by controlling a heating rate and reaction holding time between the weight loss initiating temperature and the melting point of a low molecular weight polymer generated in a melt polymerization in a solid state polymerization, adhesion does not occur, and discoloration due to heating does not occur.
摘要:
Provided is a wholly aromatic liquid crystalline polyester resin compound. The wholly aromatic liquid crystalline polyester resin compound includes a wholly aromatic liquid crystalline polyester resin having a high melting point and mica having a predetermined size.
摘要:
Provided is a wholly aromatic liquid crystalline polyester resin compound. The wholly aromatic liquid crystalline polyester resin compound includes a wholly aromatic liquid crystalline polyester resin having a high melting point and mica having a predetermined size.
摘要:
Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B′) derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.
摘要:
Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B′) derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.
摘要:
Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.
摘要:
Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.
摘要:
Disclosed are a production method for a wholly aromatic liquid crystalline polyester resin, a wholly aromatic liquid crystalline polyester resin produced using the method, and a compound of the wholly aromatic liquid crystalline polyester resin. The disclosed production method for a wholly aromatic liquid crystalline polyester resin comprises the steps of synthesizing a wholly aromatic liquid crystalline polyester resin by synthesizing a wholly aromatic liquid crystalline polyester prepolymer by a condensation polymerization of a monomer and then reducing the pressure inside a reaction vessel containing the synthesized prepolymer at a predetermined internal pressure reduction rate of the reaction vessel.
摘要:
Provided is a method of preparing a wholly aromatic liquid crystalline polyester resin and a wholly aromatic liquid crystalline polyester resin prepared by the method, and a compound of the wholly aromatic liquid crystalline polyester resin. The disclosed method of preparing the wholly aromatic liquid crystalline polyester resin includes a step (a first temperature increasing step) of increasing the temperature of a reaction mixture including at least one monomer at a first temperature increasing rate up to a first temperature; a step (an isothermal maintaining step) of maintaining the reaction mixture that passed through the first temperature increasing step at the first temperature for a first time; and a step (a second temperature increasing step) of increasing the temperature of the reaction mixture that passed through the isothermal maintaining step at a second temperature increasing rate.