APPARATUS AND METHOD FOR PROCESSING A HYDROPHOBIC SURFACE OF A SUBSTRATE
    12.
    发明申请
    APPARATUS AND METHOD FOR PROCESSING A HYDROPHOBIC SURFACE OF A SUBSTRATE 审中-公开
    用于处理基板的疏水表面的装置和方法

    公开(公告)号:US20080169007A1

    公开(公告)日:2008-07-17

    申请号:US11755619

    申请日:2007-05-30

    Abstract: A method of processing a substrate comprising a) supporting a substrate having a hydrophilic surface in a substantially horizontal orientation, b) rotating the substrate, c) applying a film of an aqueous solution of HF to the hydrophilic surface of the substrate for a period of time sufficient to convert the hydrophilic surface into a hydrophobic surface, wherein the concentration of HF is between about 0.1% to about 0.5% by weight of HF in water and the period of time is between about 100 and about 300 seconds, d) applying DI water to the hydrophobic surface of the substrate, and e) applying a drying fluid to the hydrophobic surface of the substrate so as to substantially dry the hydrophobic surface. The invention also is an apparatus for processing a substrate comprising a chamber having at least one wall, a rotary support member located within the chamber for supporting the substrate in a substantially horizontal position and adapted to rotate the substrate, and a first exhaust exit located within the at least one wall, wherein the first exhaust exit is tangential to a rotational direction of the substrate.

    Abstract translation: 一种处理衬底的方法,包括:a)以基本水平的方向支撑具有亲水表面的衬底; b)旋转衬底; c)将HF水溶液膜施加到衬底的亲水表面上一段时间 足以将亲水性表面转化为疏水表面的时间,其中HF的浓度在水中的HF的约0.1重量%至约0.5重量%之间,时间段为约100至约300秒,d)施加DI 水到基底的疏水表面,以及e)将干燥流体施加到基底的疏水表面,以便基本上干燥疏水性表面。 本发明还是一种用于处理基材的设备,其包括具有至少一个壁的室,位于室内的旋转支撑构件,用于将基板支撑在基本上水平的位置并适于旋转基板;以及位于内部的第一排气出口 所述至少一个壁,其中所述第一排气出口与所述基板的旋转方向相切。

    Method and device of forming a film using a coating material and method of manufacturing a semiconductor device
    13.
    发明授权
    Method and device of forming a film using a coating material and method of manufacturing a semiconductor device 失效
    使用涂料形成膜的方法和装置以及制造半导体器件的方法

    公开(公告)号:US06777350B2

    公开(公告)日:2004-08-17

    申请号:US10199328

    申请日:2002-07-22

    Applicant: Seiji Nakagawa

    Inventor: Seiji Nakagawa

    Abstract: A material film forming method is provided which comprises coating a liquid material on a surface of a substrate to form a material film of the liquid material the on the surface of the substrate, while rotating the substrate, and drying the material film, while rotating the substrate and letting air or nitrogen gas blow onto a predetermined area of the material film.

    Abstract translation: 提供了一种材料膜形成方法,其包括在基板的表面上涂覆液体材料,以在旋转基板的同时在基板的表面上形成液体材料的材料膜,并且在旋转所述材料膜的同时, 衬底并使空气或氮气吹到材料膜的预定区域上。

    Film forming method and film forming apparatus
    15.
    发明申请
    Film forming method and film forming apparatus 审中-公开
    成膜方法和成膜装置

    公开(公告)号:US20010033895A1

    公开(公告)日:2001-10-25

    申请号:US09840179

    申请日:2001-04-24

    Abstract: The present invention is a film forming method for forming a film of a coating solution on a substrate, comprising the steps of spreading the coating solution supplied to a center of the substrate by rotating the substrate, and supplying solvent vapor of the coating solution to the coating solution spread over the substrate while rotating the substrate to thin the film of the coating solution formed on the substrate. Accordingly, it becomes possible that the film of the coating solution which is formed by spreading the coating solution over the substrate is maintained at a low viscosity, and that the film can be further thinned. The necessary quantity of the coating solution can be also reduced. Moreover, since solvent vapor is supplied onto the coating film, by controlling the supply quantity or the supply position of the solvent vapor, the uniformity of the coating solution film can be obtained, and the thickness of the coating solution film can be controlled.

    Abstract translation: 本发明是一种在基板上形成涂布液的膜的成膜方法,其特征在于,包括以下步骤:通过旋转所述基板将供给到所述基板的中心的涂布液扩散,并将所述涂布液的溶剂蒸气供给到 涂布溶液在衬底上铺展,同时旋转衬底以使形成在衬底上的涂布溶液的薄膜变薄。 因此,通过将涂布液涂布在基板上而形成的涂布液的膜保持低粘度,并且可以进一步减薄膜。 所需量的涂布溶液也可以减少。 此外,由于溶剂蒸气被供给到涂膜上,通过控制溶剂蒸气的供给量或供给位置,可以获得涂布液的均匀性,并且可以控制涂布液膜的厚度。

    Solvent vapor fusion method
    17.
    发明授权
    Solvent vapor fusion method 失效
    溶剂蒸气熔融法

    公开(公告)号:US3565665A

    公开(公告)日:1971-02-23

    申请号:US3565665D

    申请日:1969-05-22

    CPC classification number: B05D3/0466 B05D2401/32

    Abstract: A METHOD FOR COATING AN ARTICLE WITH A CONTINUOUS POLYMERIC FILM INCLUDING THE STEPS OF (A) DEPOSITING AND ADHERING A LAYER OF POLYMERIC MATERIAL IN PARTICULATE FORM TO THE ARTICLES EXTERIOR SURFACE, (B) MAINTAINING THE COATED ARTICLE AT A TEMPERATURE BELOW THE BOILING POINT OF A SELECTED COMPOSITION WHICH IS A SOLVENT FOR THE POLYMERIC MATERIAL AT ITS BOILING POINT AND WITHIN A TEMPERATURE RANGE BELOW ITS BOILING POINT, AND (C) EXPOSING THE ARTICLE TO AN ATMOSPHERE CONTAINING THE SELECTED COMPOSITION IN VAPOR FORM, WHEREBY THE VAPORS CONDENCE ON THE SURFACE OF THE ARTICLE AND CAUSE THE POLYMERIC MATERIAL TO FUSE AND FORM A CONTINUOUS FILM ON THE SURFACE OF THE ARTICLE.

    SUBSTRATE TREATING METHOD AND TREATMENT LIQUID

    公开(公告)号:US20240339317A1

    公开(公告)日:2024-10-10

    申请号:US18551302

    申请日:2022-01-20

    Abstract: This disclosure relates to a substrate treating method and a treatment liquid. The substrate treating method includes a treatment liquid supplying step, a solidified film forming step, and a sublimation step. In the treatment liquid supplying step, a treatment liquid is supplied to a substrate. The treatment liquid contains a sublimable substance, a solvent, and a surfactant. In the solidified film forming step, the solvent and the surfactant evaporate from the treatment liquid on the substrate. In the solidified film forming step, a solidified film containing the sublimable substance is formed on the substrate. In the sublimation step, the solidified film sublimates. The surfactant has an octanol-water partition coefficient LOGPow of −1 or more and 1 or less. Vapor pressure Pc of the surfactant at room temperature is 0.9 times or more and 3 times or less vapor pressure Pb of the solvent at room temperature.

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