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    DEVICE FOR LASER STRUCTURING HUBS OF VALVE TRAIN COMPONENTS
    11.
    发明申请
    DEVICE FOR LASER STRUCTURING HUBS OF VALVE TRAIN COMPONENTS 审中-公开
    用于激光结构的火焰组件的装置

    公开(公告)号：US20160221119A1

    公开(公告)日：2016-08-04

    申请号：US15011203

    申请日：2016-01-29

    Applicant: Mahle International GmbH

    Inventor： Ralf Rieger ,  Christoph Unrath

    IPC: B23K26/03 ,  B23K26/02 ,  B23K26/00

    CPC classification number: B23K26/032 ,  B23K26/02 ,  B23K26/0861 ,  B23K26/352 ,  B23K26/355 ,  B23K26/3584 ,  B23K37/0452 ,  B23K2101/005

    Abstract: A laser structuring device for a hub of a valve train component may include at least one load carrier for storing and providing at least two valve train components, at least one laser for laser structuring a hub of at least one valve train component, and at least one robot arm having a gripping device for gripping, positioning and holding the at least one valve train component during the laser structuring. The at least one robot arm may be movable to position the at least one valve train component into a machining position.

    Abstract translation: 用于阀列组件的轮毂的激光结构装置可以包括至少一个负载载体，用于存储和提供至少两个气门机构部件，至少一个激光器，用于激光结构化至少一个气门机构部件的轮毂，并且至少 一个机器人臂具有用于在激光结构化期间夹持，定位和保持所述至少一个气门机构部件的夹持装置。 所述至少一个机器人臂可以是可移动的，以将所述至少一个气门机构部件定位到加工位置。

    LASER MACHINING METHOD, LASER MACHINING APPARATUS, AND LASER MACHINING PROGRAM
    15.
    发明申请
    LASER MACHINING METHOD, LASER MACHINING APPARATUS, AND LASER MACHINING PROGRAM 有权
    激光加工方法，激光加工设备和激光加工程序

    公开(公告)号：US20150021304A1

    公开(公告)日：2015-01-22

    申请号：US13945509

    申请日：2013-07-18

    Applicant: Hitachi Via Mechanics, Ltd.

    Inventor： Hidekatsu OZAWA

    IPC: G06Q10/04 ,  B23K26/38 ,  H05K3/00

    CPC classification number: G06Q10/043 ,  B23K26/02 ,  B23K26/04 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  H05K3/00 ,  H05K3/0005 ,  H05K3/0008 ,  H05K3/0026

    Abstract: Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S4).

    Abstract translation: 即使设置最短的加工路径，并且加工质量得到改善，由于加热效果而导致的孔径的变化被最小化。 由激光束扫描的印刷电路板被划分为多个扫描区域（S1）。 对扫描区域内的钻孔顺序进行排序，得到距离最短的扫描路线（S2）。 如果确定第N孔和第（N + 1）孔之间的距离（这里为N（N + 1））孔，则在每个扫描区域中交替排列第（N + 1）孔和第（N + 是1＆nlE范围内的整数; N＆nlE;“区域”-1“中要钻孔的最大数量）小于预定阈值，并且N + 1不对应于最大孔数 在扫描区域中钻（S3）。 对扫描区域进行加工，然后加工每个扫描区域，特别是在第（N + 1）孔加工一段预定的散热时间后，如果确定第N个孔和 （N + 1）个孔小于预定阈值。 随后，进行加工（S4）。

    Laser-assisted micromachining system and method
    17.
    发明授权
    Laser-assisted micromachining system and method 有权
    激光辅助微加工系统及方法

    公开(公告)号：US08847114B1

    公开(公告)日：2014-09-30

    申请号：US12116768

    申请日：2008-05-07

    Applicant: Yung C. Shin

    Inventor： Yung C. Shin

    IPC: B23K26/06 ,  B23K26/02

    CPC classification number: B23K26/02 ,  B23K26/0093 ,  B23K26/06 ,  B23P25/006

    Abstract: A novel apparatus and method for laser-assisted micro-milling. The disclosed laser-assisted micro-milling system and method provides unique micro-milling capabilities for very difficult-to-machine materials, such as ceramics, high temperature alloys and composites. A low power laser beam is focused at a very small spot, thus producing a very high power density, the spot being located just ahead of a mechanical micro-milling cutter to preheat the material prior to machining. This localized heating thermally weakens the workpiece resulting in lower cutting forces, improved surface finish, and longer tool life. The system is capable of micro-milling difficult-to-machine materials that may be conductive or non-conductive with high material removal rates compared to existing systems and methods.

    Abstract translation: 一种用于激光辅助微铣削的新颖设备和方法。 所公开的激光辅助微研磨系统和方法为非常难加工的材料如陶瓷，高温合金和复合材料提供独特的微研磨能力。 低功率激光束聚焦在非常小的位置，从而产生非常高的功率密度，该光点位于机械微铣刀前面，用于在加工前预热材料。 这种局部加热使工件加热变薄，导致切削力降低，表面光洁度提高，刀具寿命更长。 该系统能够与现有的系统和方法相比，以高的材料去除速率对可能导电或不导电的难加工材料进行微铣削。

    PRODUCTION PROCESS FOR AN INTERFACE UNIT AND A GROUP OF SUCH INTERFACE UNITS
    18.
    发明申请
    PRODUCTION PROCESS FOR AN INTERFACE UNIT AND A GROUP OF SUCH INTERFACE UNITS 审中-公开
    接口单元的生产过程和一个这样的界面单元组

    公开(公告)号：US20140063492A1

    公开(公告)日：2014-03-06

    申请号：US14076023

    申请日：2013-11-08

    Applicant: Claudia Gorschboth ,  Jing Li ,  Klaus Vogler ,  Olaf Kittelmann ,  Thomas Deisinger ,  Gerhard Robi

    Inventor： Claudia Gorschboth ,  Jing Li ,  Klaus Vogler ,  Olaf Kittelmann ,  Thomas Deisinger ,  Gerhard Robi

    IPC: B23K26/02

    CPC classification number: B23K26/02 ,  A61F9/009 ,  Y10T29/49826 ,  Y10T156/10

    Abstract: A process for producing an interface unit and also a group of such interface units are specified. The interface unit exhibits a first reference surface for beaming in radiation, a second reference surface for emitting the radiation, and an axis extending in the direction from the first to the second reference surface. The production process comprises the steps of setting an optical path length of the interface unit between the first and second reference surfaces along the axis and the fixing of the set optical path length of the interface unit. The optical path length of the interface unit is set in such a way that radiation of a defined numerical aperture beamed in at the first reference surface exhibits a focus location that is predetermined with respect to the second reference surface in the direction of the axis. A precise and uniform focus location with respect to the second reference surface is obtained.

    Abstract translation: 指定了用于生成接口单元以及一组这样的接口单元的处理。 接口单元呈现用于辐射辐射的第一参考表面，用于发射辐射的第二参考表面和沿从第一参考表面到第二参考表面的方向延伸的轴线。 生产过程包括以下步骤：沿着轴线设置第一和第二参考表面之间的界面单元的光路长度以及固定接口单元的设定的光程长度。 接口单元的光路长度被设定为使得在第一基准表面上射出的限定数值孔径的辐射表现出相对于第二参考表面在轴线方向上预定的聚焦位置。 获得相对于第二参考表面的精确且均匀的焦点位置。

    METHOD FOR MARKING ON METALLIC MEMBER
    19.
    发明申请
    METHOD FOR MARKING ON METALLIC MEMBER 有权
    金属会员标识方法

    公开(公告)号：US20140027412A1

    公开(公告)日：2014-01-30

    申请号：US14037759

    申请日：2013-09-26

    Applicant: NGK INSULATORS, LTD.

    Inventor： Kenji KATO ,  Kenji ISAKA

    IPC: B23K26/00

    CPC classification number: B23K26/02 ,  B21C51/00 ,  B21C51/005 ,  B23K26/00 ,  B23K26/0006 ,  B23K26/18 ,  B23K26/352 ,  B23K26/355 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/14 ,  B23K2103/15 ,  B41M5/262

    Abstract: Provided is a method for marking on a pressed metallic component whose visibility and corrosion resistance in a marking target is ensured. The method includes a step of irradiating a base treatment target region including a marking target region with a laser beam on a first irradiation condition, and a step of irradiating the marking target region with the laser beam on a second irradiation condition, in which a charged energy of the laser beam is set to be smaller on the first irradiation condition than the second irradiation condition, thereby providing between the marking pattern and a non-irradiation region, a base region having a residual stress greater than that of the non-irradiation region and a residual stress smaller than that of the marking pattern, so as to ensure a visibility. Furthermore, a corrosion resistance is ensured by using a metallic member which is heat-treated to enhance the hardness.

    Abstract translation: 提供了一种在确保标记目标的可见性和耐腐蚀性的压制金属部件上进行标记的方法。 该方法包括在第一照射条件下用激光束照射包括标记对象区域的基底处理对象区域的步骤，以及在第二照射条件下照射具有激光束的标记对象区域的步骤， 激光束的能量在第一照射条件下被设定为比第二照射条件小，从而在标记图案和非照射区域之间提供具有大于非照射区域的残余应力的基底区域 并且残留应力小于标记图案的残余应力，以确保可视性。 此外，通过使用经过热处理以提高硬度的金属构件来确保耐腐蚀性。

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