公开(公告)号：US08247731B2

公开(公告)日：2012-08-21

申请号：US12165074

申请日：2008-06-30

Applicant: Dennis R. Alexander ,  John Bruce, III

Inventor： Dennis R. Alexander ,  John Bruce, III

IPC: B23K26/00

CPC classification number: B23K26/0604 ,  B23K26/0617 ,  B23K26/0619 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/1224 ,  B23K26/16

Abstract: Disclosed are systems and methods for directing laser energy to surfaces of materials via elements which have sharp points, and for reducing the adverse effects of particles which become dislodged by scribing and laser machining of materials.

Abstract translation: 公开了通过具有尖锐点的元件将激光能量引导到材料表面的系统和方法，以及用于减少通过划线和激光加工材料而脱落的颗粒的不利影响。

公开(公告)号：US08173930B2

公开(公告)日：2012-05-08

申请号：US12591500

申请日：2009-11-20

Applicant: Jeong Kweon Park

Inventor： Jeong Kweon Park

IPC: B23K26/16 ,  B23K26/06

CPC classification number: B23K26/0676 ,  B23K26/032 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0876 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  C03B33/0222 ,  G02F1/133351 ,  Y02P40/57 ,  Y10T83/04

Abstract: An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.

Abstract translation: 一种用于切割基板的设备包括产生飞秒激光束的激光振荡器，将飞秒激光束分成第一和第二飞秒激光束的第一分束分离器，接收第一飞秒激光束并将第一飞秒激光束 具有第一焦点深度，接收第二飞秒激光束的第二聚光透镜，并且将第二飞秒激光束聚光以具有不同于第一焦深的第二焦深，以及接收和分割第一飞秒激光的第二分束器 通过第一聚光透镜冷凝的光束和通过第二聚光透镜会聚的第二飞秒激光束，并且在被切割的基板上的不同位置照射分割的第一和第二飞秒激光束。

公开(公告)号：US20110095003A1

公开(公告)日：2011-04-28

申请号：US12908305

申请日：2010-10-20

Applicant: Tutomu Sakurai ,  Seiji Kumazawa ,  Hidenao Kataoka

Inventor： Tutomu Sakurai ,  Seiji Kumazawa ,  Hidenao Kataoka

IPC: B23K26/00

CPC classification number: B23K26/0617 ,  B23K1/0056

Abstract: A fusion welding method includes the steps of: generating a hybrid laser beam obtained by mixing a low-intensity laser beam with a first high-intensity laser beam and a second high-intensity laser beam; moving the hybrid laser beam along a gap between a first member and a second member; and melting the first member and the second member in the periphery of the gap with the hybrid laser beam, and filling the gap with the melt of the first member and the melt of the second member to weld the first member and the second member, wherein the first high-intensity laser beam is applied to the area of the first member to which the low-intensity laser beam is applied, and the second high-intensity laser beam is applied to the area of the second member to which the low-intensity laser beam is applied.

Abstract translation: 融合焊接方法包括以下步骤：产生通过将低强度激光束与第一高强度激光束和第二高强度激光束混合而获得的混合激光束; 沿着第一构件和第二构件之间的间隙移动混合式激光束; 并且利用所述混合激光束在所述间隙周边中熔化所述第一构件和所述第二构件，并且用所述第一构件的熔体和所述第二构件的熔体填充所述间隙以焊接所述第一构件和所述第二构件，其中 将第一高强度激光束施加到施加低强度激光束的第一部件的区域，并且将第二高强度激光束施加到低强度激光束的第二部件的区域 应用激光束。

公开(公告)号：US07858901B2

公开(公告)日：2010-12-28

申请号：US10559026

申请日：2004-05-27

Applicant: Venkatakrishnan Krishnan ,  Tan Bo

Inventor： Venkatakrishnan Krishnan ,  Tan Bo

IPC: B23K26/067 ,  B23K26/36 ,  H01L21/82

CPC classification number: B23K26/0617 ,  B23K26/067 ,  B23K26/364 ,  B23K26/38 ,  B23K2101/40 ,  H01L21/78

Abstract: A Plate polarising beam splitter 22 splits an incident laser beam 21 to form a first laser beam 24 and a second laser beam 25. The first laser beam is optically modified using an arcuate reflector 23 so that the first laser beam has a different divergence or convergence from that of the second laser beam. The first laser beam 24 is focussed at a first focus 27 on an optical axis of a focussing lens 26 and the second laser beam is focussed at a second focus 28 on the optical axis for machining a workpiece. The apparatus is suitable for machining with the laser beams steered by a galvanometer scanner.

Abstract translation: 板偏振分束器22分割入射激光束21以形成第一激光束24和第二激光束25.第一激光束使用弧形反射器23进行光学修改，使得第一激光束具有不同的发散度或会聚 与第二激光束的距离。 第一激光束24聚焦在聚焦透镜26的光轴上的第一焦点27上，第二激光束聚焦在用于加工工件的光轴上的第二焦点28上。 该设备适用于用电流计扫描仪转向的激光束进行加工。

公开(公告)号：US20100176102A1

公开(公告)日：2010-07-15

申请号：US12601927

申请日：2008-05-23

Applicant: Dirk Petring ,  Frank Schneider ,  Wolfgang Schulz ,  Markus Niessen

Inventor： Dirk Petring ,  Frank Schneider ,  Wolfgang Schulz ,  Markus Niessen

IPC: B23K26/00

CPC classification number: B23K26/0617 ,  B23K26/0604 ,  B23K26/382 ,  B23K26/384 ,  B23K26/389

Abstract: A method and device for machining material uses laser radiation, in which the unfocused laser radiation is focused through a focusing optics to a smaller beam cross section. The optical axis of the focused laser radiation, referred to as beam axis, is directed at the material surface. The beam waist, which results from the focusing operation, of the focused laser radiation is held in the region of the interface, which forms of laser radiation and material. The laser radiation is partially absorbed on the interface such that due to induced material removal or induced material displacement the interface and thus also the laser radiation penetrate into the material. The spacing of the beam waist from the upper or lower side of the interface in the axial direction corresponds at most to triple the value of the penetration depth of the interface into the material. The focusing operation is effected such that components of the laser radiation are made divergent not just in the propagation direction downstream of the beam waist but also in the beam waist and/or also in the propagation direction upstream of the beam waist and are thus directed away from the beam axis. These components and angles of divergence are larger than those of the effects of imaging errors, which are inadvertently produced using standard optics and are tolerated.

Abstract translation: 用于加工材料的方法和装置使用激光辐射，其中未聚焦的激光辐射通过聚焦光学器件聚焦到较小的束横截面。 被称为束轴的聚焦激光辐射的光轴指向材料表面。 由聚焦操作产生的聚焦激光辐射的束腰被保持在形成激光辐射和材料的界面的区域中。 激光辐射被部分地吸收在界面上，使得由于感应材料去除或引起的材料位移界面，因此激光辐射也渗透到材料中。 光束腰部与界面的上侧或下侧在轴向方向上的间隔对应于至多为接口材料穿透深度的三倍。 进行聚焦操作，使得激光辐射的部件不仅在波束腰的下游的传播方向上发散，而且在束腰和/或在波束腰的上游的传播方向上发散，并且因此被引导 从光束轴。 这些分量和发散角大于成像误差的影响，这些误差是使用标准光学器件无意中产生的并且是容忍的。

公开(公告)号：US20050206041A1

公开(公告)日：2005-09-22

申请号：US10916316

申请日：2004-08-11

Applicant: Stephen Temple ,  Philip Rumsby

Inventor： Stephen Temple ,  Philip Rumsby

IPC: B41J2/135 ,  B23K26/06 ,  B23K26/067 ,  B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  B41J2/16 ,  H01S3/00

CPC classification number: B23K26/0604 ,  B23K26/0608 ,  B23K26/0617 ,  B23K26/066 ,  B23K26/067 ,  B23K26/382 ,  B23K26/384 ,  B23K26/389 ,  B23K2101/18 ,  B23K2103/42 ,  B23K2103/50 ,  B41J2/162 ,  B41J2/1634

Abstract: A nozzle in a nozzle plate for an inkjet printhead is formed by directing a laser beam at a nozzle plate. Accurate control of the divergence of the beam is achieved by splitting the beam into sub-beams, each sub-beam having divergence with an origin lying apart from the point at which the beam is created by splitting, and thereafter recombining the sub-beams. Greater accuracy in the taper and inlet shape of the manufactured nozzle is thereby obtained.

Abstract translation: 用于喷墨打印头的喷嘴板中的喷嘴通过在喷嘴板处引导激光束而形成。 通过将光束分成子光束来实现光束发散的精确控制，每个子光束具有发散，原点与通过分裂产生光束的点分开，然后重新组合子光束。 从而获得制造喷嘴的锥形和入口形状的更高精度。

公开(公告)号：US20040228004A1

公开(公告)日：2004-11-18

申请号：US10782741

申请日：2004-02-19

Inventor： Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

IPC: G02B003/00 ,  G02B009/00 ,  G02B013/08

CPC classification number: G03F7/70383 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0736 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/50

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract translation: 使用具有变形射束输送系统的激光器形成可变散光焦点光斑。 可变散光焦点光斑可以用于切割应用，例如划刻诸如发光二极管（LED）晶片的半导体晶片。 示例性变形射束输送系统包括一系列光学部件，其有意地引入散光以产生分离成两个主经线（即垂直和水平）的焦点。 像散焦点导致了一个不对称但是集中的束斑，其包括锋利的前缘和后缘。 调整散光焦点会改变压缩光束斑点的长宽比，从而可以调节目标处的能量密度，而不影响激光输出功率。 用适当优化的能量和功率密度划分晶片可以提高划线速度，同时最大限度地减少过热和附带材料损坏。

公开(公告)号：US06521864B2

公开(公告)日：2003-02-18

申请号：US09755051

申请日：2001-01-08

Applicant: Christophe Bertez ,  Jean Hamy ,  Olivier Matile

Inventor： Christophe Bertez ,  Jean Hamy ,  Olivier Matile

IPC: B23K2600

CPC classification number: B23K26/0617 ,  B23K26/0604 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/123 ,  B23K26/125 ,  B23K2103/04 ,  B23K2103/05

Abstract: Method and apparatus for cutting a workpiece made of structural steel or mild steel, i.e. alloy or non-alloy steels, by the use of a transparent or reflecting optical unit for focusing a laser beam, and of an assist gas for the laser beam. The optical unit is of the multifocus type and is chosen from lenses, mirrors and combinations thereof. The assist gas is nitrogen or a nitrogen/oxygen mixture. The method of the invention makes it possible to obtain a low or almost zero oxidation of the cut face and to do so while increasing the cutting performance by about 40% compared with a laser cutting method using nitrogen or a nitrogen/oxygen mixture.

Abstract translation: 用于通过使用用于聚焦激光束的透明或反射光学单元和用于激光束的辅助气体来切割由结构钢或软钢（即合金或非合金钢）制成的工件的方法和装置。 光学单元是多焦点类型，并且选自透镜，反射镜及其组合。 辅助气体是氮气或氮气/氧气混合物。 与使用氮或氮/氧混合物的激光切割方法相比，本发明的方法使得可以获得切割面的低或几乎零氧化并且同时将切割性能提高约40％。

公开(公告)号：US11972993B2

公开(公告)日：2024-04-30

申请号：US17320646

申请日：2021-05-14

Applicant: CORNING INCORPORATED

Inventor： Rachel Eileen Dahlberg ,  Tian Huang ,  Yuhui Jin ,  Garrett Andrew Piech ,  Daniel Ohen Ricketts

IPC: H01L23/15 ,  B23K26/00 ,  B23K26/06 ,  B23K26/062 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  C03C15/00 ,  C03C23/00 ,  H01L21/48 ,  H01L23/498 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/073 ,  B23K26/36 ,  B23K103/00 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L23/15 ,  B23K26/0006 ,  B23K26/06 ,  B23K26/062 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  C03C15/00 ,  C03C23/0025 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/0738 ,  B23K26/36 ,  B23K2103/54 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T428/24273

Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

公开(公告)号：US20180354075A1

公开(公告)日：2018-12-13

申请号：US16003263

申请日：2018-06-08

Applicant: Illinois Tool Works Inc.

Inventor： Shuang Liu ,  Erik Miller

IPC: B23K26/342 ,  B23K26/082 ,  B23K26/06 ,  B23K26/14 ,  B23K26/60 ,  B23K26/70 ,  B23K26/064 ,  B23K26/073

CPC classification number: B23K26/342 ,  B23K9/1093 ,  B23K26/0608 ,  B23K26/0617 ,  B23K26/064 ,  B23K26/0676 ,  B23K26/073 ,  B23K26/082 ,  B23K26/14 ,  B23K26/1464 ,  B23K26/1476 ,  B23K26/34 ,  B23K26/348 ,  B23K26/60 ,  B23K26/704 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

Abstract: A laser processing head includes first and second contact points connected to a power source. The power source generates a current to flow through an electrode wire between the first and second contact points to heat the electrode wire. A laser source generates one or more laser beams having lasing power sufficient to at least partially melt the electrode wire. A coaxial laser head focuses the one or more laser beams at one or more focal points on a workpiece to at least partially melt the electrode wire.