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公开(公告)号：US20240092631A1
公开(公告)日：2024-03-21
申请号：US18463708
申请日：2023-09-08
Applicant: ROHM CO., LTD.
Inventor： Yoshiyuki INUI , Toma FUJITA
CPC classification number: B81B3/0051 , B81C3/001 , B81B2201/0235 , B81B2203/0315 , B81B2203/04 , B81C2203/019 , B81C2203/035
Abstract: The present disclosure provides a MEMS sensor. The MEMS sensor includes a first substrate having a cavity and a second substrate bonded to the first substrate. The first substrate is provided with an electrode movably disposed in the cavity and a sealed member coupling to the second substrate. The second substrate is provided with a stop member for restricting a movement of the electrode toward the second substrate and a sealing member coupling to the sealed member. The sealed member is formed by a first metal layer on the first substrate. The sealing member is formed by a second metal layer on the second substrate. A polycrystalline layer is formed on the stop member. The polycrystalline layer is disposed between the second substrate and the second metal layer.
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公开(公告)号：US20240083741A1
公开(公告)日：2024-03-14
申请号：US18460885
申请日：2023-09-05
Applicant: ROHM CO., LTD.
Inventor： Daisuke NISHINOHARA , Hideaki HASHIMOTO , Toma FUJITA
IPC: B81B3/00
CPC classification number: B81B3/0051 , B81B2201/0235 , B81B2201/0264 , B81B2201/042 , B81B2201/052 , B81B2203/0118 , B81B2203/0346
Abstract: The present disclosure provides a MEMS device having a movable portion. The MEMS device includes: a substrate; a recess, disposed in the substrate; the movable portion, hollowly supported in the recess; and a bump stop, hollowly supported in the recess and configured to restrict a movement of the movable portion by contacting the movable portion. The bump stop includes: a protruding portion, configured to contact the movable portion; and a shock absorbing portion, disposed between the protruding portion and the substrate and configured to absorb at least a part of an impact force applied to the protruding portion by elastic deformation.
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公开(公告)号：US20240040932A1
公开(公告)日：2024-02-01
申请号：US18378664
申请日：2023-10-11
Inventor： Jia Jie Xia
CPC classification number: H10N30/306 , B81B3/0067 , G01P15/09 , B81B3/0021 , H10N30/05 , H10N30/50 , B81B2201/0235
Abstract: A method of forming micro-electromechanical system (MEMS) device, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer. The piezoelectric stacking structure is disposed on the composite substrate, with the piezoelectric stacking structure having a suspended region over the cavity. The proof mass is disposed in the cavity to connect to the piezoelectric stacking structure.
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公开(公告)号：US11860185B2
公开(公告)日：2024-01-02
申请号：US18072836
申请日：2022-12-01
Applicant: SEIKO EPSON CORPORATION
Inventor： Yusuke Kinoshita , Nobuyuki Imai
CPC classification number: G01P15/18 , G01C21/165 , G01C21/18 , G01S19/47 , G01S19/49 , B81B2201/0235 , B81B2201/0242
Abstract: An inertia measurement device, which is used in combination with a satellite positioning receiver that outputs a positioning result at every T seconds in a positioning system equipped on a vehicle, when a Z-axis angular velocity sensor, a position error P[m] based on the detection signal of the Z-axis angular velocity sensor while the vehicle moves at a moving speed V[m/sec] for T seconds satisfies Pp≥P=(V/Bz)×(1−cos(Bz×T)) (where, a bias error of the Z-axis angular velocity sensor is Bz[deg/sec] and a predetermined allowable maximum position error during movement for T seconds is Pp[m]), and a bias error Bx and By of the Y-axis angular velocity sensor satisfies Bz
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公开(公告)号：US11860184B2
公开(公告)日：2024-01-02
申请号：US17447876
申请日：2021-09-16
Applicant: Robert Bosch GmbH
Inventor： Cristian Nagel , Johannes Classen , Lars Tebje , Rolf Scheben , Rudy Eid
IPC: G01P15/08 , G01P15/125 , B81B3/00
CPC classification number: G01P15/0802 , B81B3/001 , B81B3/0051 , G01P15/125 , B81B2201/0235 , B81B2203/0163 , B81B2203/04 , G01P2015/0831 , G01P2015/0862 , G01P2015/0871
Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.
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Patent Agency Ranking
公开(公告)号：US11825750B2
公开(公告)日：2023-11-21
申请号：US17083337
申请日：2020-10-29
Inventor： Jia Jie Xia
CPC classification number: H10N30/306 , B81B3/0021 , B81B3/0067 , G01P15/09 , H10N30/05 , H10N30/50 , B81B2201/0235
Abstract: A micro-electromechanical system (MEMS) device and a method of forming the same, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer. The piezoelectric stacking structure is disposed on the composite substrate, with the piezoelectric stacking structure having a suspended region over the cavity. The proof mass is disposed in the cavity to connect to the piezoelectric stacking structure.
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公开(公告)号：US20230365399A1
公开(公告)日：2023-11-16
申请号：US18316410
申请日：2023-05-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Petteri KILPINEN
CPC classification number: B81B7/0041 , B81C1/00293 , B81B2201/0235 , B81B2201/0242 , B81C2203/0145
Abstract: A microelectromechanical is provided that includes a support layer, a device layer and a cap layer, a first cavity and a second cavity. The first cavity and the second cavity are delimited by the support layer, the device layer and the cap layer. Moreover, the cap layer includes a through-hole that extends from the top surface of the cap layer to the first cavity. The microelectromechanical component includes a plug inside the through-hole and that seals the first cavity.
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公开(公告)号：US11768221B2
公开(公告)日：2023-09-26
申请号：US17447764
申请日：2021-09-15
Applicant: Robert Bosch GmbH
Inventor： Andrea Visconti , Artjom Kosov , Jochen Hahn , Johannes Classen , Timo Giesselmann
CPC classification number: G01P15/18 , B81B7/02 , B81B2201/0235 , B81B2207/03
Abstract: A micromechanical sensor, including a micromechanical chip having a first micromechanical structure, a first evaluation chip, having a first application-specific integrated circuit, and a second evaluation chip having a second application-specific integrated circuit. The first evaluation chip and the micromechanical chip are situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip and the first evaluation chip being directly electrically conductively connected with the second evaluation chip. The first application-specific integrated circuit primarily includes analog circuit elements and the second application-specific circuit primarily includes digital circuit elements.
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公开(公告)号：US20230294980A1
公开(公告)日：2023-09-21
申请号：US17697957
申请日：2022-03-18
CPC classification number: B81C1/00571 , B81B3/0021 , B81C2201/014 , B81C2201/0197 , B81C2201/0181 , B81C2201/0176 , B81C2201/0104 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315
Abstract: A micro-electro-mechanical system (MEMS) device includes a supporting substrate, a cavity disposed in the supporting substrate, a stopper, and a MEMS structure. The stopper is disposed between the supporting substrate and the cavity, and an inner sidewall of the stopper is in contact with the cavity. The stopper includes a filling material surrounding a periphery of the cavity, and a liner wrapping around the filling material. The MEMS structure is disposed over the cavity and attached on the stopper and the supporting substrate.
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公开(公告)号：US11760627B2
公开(公告)日：2023-09-19
申请号：US17343919
申请日：2021-06-10
Applicant: InvenSense, Inc.
Inventor： Roberto Brioschi , Benyamin Gholami Bazehhour , Milena Vujosevic , Kazunori Hayata
CPC classification number: B81B7/0048 , B81C1/00325 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/042 , B81B2207/012
Abstract: A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.
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