公开(公告)号：US4090045A

公开(公告)日：1978-05-16

申请号：US783684

申请日：1977-04-01

Applicant: Richard E. Marsh

Inventor： Richard E. Marsh

IPC: H01H13/702 ,  H01H13/785 ,  H01H13/80 ,  H01H13/70 ,  H01H1/18

CPC classification number: H01H13/785 ,  H01H13/702 ,  H01H13/80 ,  H01H2201/002 ,  H01H2201/004 ,  H01H2201/03 ,  H01H2203/01 ,  H01H2203/054 ,  H01H2209/016 ,  H01H2219/014 ,  H01H2219/028 ,  H01H2221/042 ,  H01H2231/024

Abstract: A strip switch assembly or switch array formed in a flat configuration with minimal depth and of relatively small size wherein the array is formed of a number of individual switches and the switches are formed of components used in common, and wherein the number of components in the array effectively revolves itself into less than one component per switch.

Abstract translation: 一种带状开关组件或开关阵列，其形成为具有最小深度和相对较小尺寸的平坦构型，其中所述阵列由多个单独的开关形成，并且所述开关由共同使用的部件形成，并且其中所述组件的数量 阵列有效地将其自身转换为每个交换机少于一个组件。

公开(公告)号：US4028509A

公开(公告)日：1977-06-07

申请号：US608852

申请日：1975-08-29

Applicant: Rudolf F. Zurcher

Inventor： Rudolf F. Zurcher

IPC: G04G99/00 ,  G04C3/00 ,  G04G17/06 ,  G04G21/00 ,  G06F3/02 ,  G06F15/02 ,  H01H13/702 ,  H01H13/785 ,  H01H13/84 ,  G04B47/06 ,  G04B19/30 ,  H01H9/00 ,  H01H13/02

CPC classification number: H01H13/785 ,  G04C3/005 ,  H01H13/702 ,  H01H13/84 ,  H01H2201/03 ,  H01H2207/004 ,  H01H2209/006 ,  H01H2209/01 ,  H01H2217/026 ,  H01H2219/028 ,  H01H2223/034 ,  H01H2227/002 ,  H01H2227/018 ,  H01H2229/026 ,  H01H2229/034 ,  H01H2229/038 ,  H01H2231/028

Abstract: A tabulator keyboard of simplified design may be fabricated from a single flexible circuit and a minimum of other mechanical structures. The flexible circuit combines in one piece an array of deformable upper contacts, an array of stationary lower contacts, as well as the required interconnections between the elements of these arrays and the electronics module. The flexible circuit may be made of a reasonable transparent dielectric film (e.g. polyamide). The flexible circuit is folded in use such that the lower stationary array has its conductive surface opposite the upper deformable array. Means are provided for making electrical contact between a selected element in said lower array with a selected element in said upper array.

Abstract translation: 简单设计的制表键盘可以由单个柔性电路和最少的其他机械结构制成。 柔性电路将可变形的上触点阵列，固定下触点的阵列以及这些阵列的元件和电子模块之间所需的互连结合在一起。 柔性电路可以由合理的透明电介质膜（例如聚酰胺）制成。 柔性电路在使用中折叠使得下固定阵列具有与上可变形阵列相对的导电表面。 提供了用于在所述下阵列中的所选元件与所述上阵列中的选定元件之间进行电接触的装置。

公开(公告)号：US3995126A

公开(公告)日：1976-11-30

申请号：US564912

申请日：1975-04-03

Applicant: Willis August Larson

Inventor： Willis August Larson

IPC: H01H13/702 ,  H01H13/703 ,  H01H13/785 ,  H01H13/00

CPC classification number: H01H13/785 ,  H01H13/702 ,  H01H13/703 ,  H01H2201/03 ,  H01H2203/032 ,  H01H2207/012 ,  H01H2211/034 ,  H01H2213/01 ,  H01H2215/006 ,  H01H2215/03 ,  H01H2219/028 ,  H01H2223/034 ,  H01H2227/008 ,  H01H2227/018 ,  H01H2227/022 ,  H01H2229/028

Abstract: Membrane keyboard apparatus is disclosed including an insulator having a conductive sheet thereon providing a plurality of first electrode members in the form of an array of apertures, and a plurality of second electrode members located concentrically within and spaced from the periphery of the apertures of the first electrodes to form an array of individual switching units. The height of the conductive sheet is greater than the height of the second electrode members whereby the level of the top surfaces of the plurality of first electrode members is vertically spaced above the level of the top surfaces of the second electrode members. A flexible, conductive member is disposed in a spaced relation above and adjacent to the level of the top surfaces of the pluralities of first and second electrode members. An identification member having an array of indicia corresponding to the array of individual switching units is disposed in a spaced relation above and adjacent to the flexible conductor. A threshold member is included in the form of an array of elastic bubble members corresponding to the array of individual switching units and including air escape means for the bubble members to avoid problems with trapped air. The bubble members are actuable by the touch which causes the selected bubble member to be deflected into the flexible conductive member to provide a conductive path between the associated first and second electrode members of the underlying switching units.

Abstract translation: 公开了一种膜键盘装置，其包括：绝缘体，其上具有导电片，其上提供多个孔阵列形式的第一电极构件;以及多个第二电极构件，其同心地位于与第一 电极以形成各个开关单元的阵列。 导电片的高度大于第二电极构件的高度，由此多个第一电极构件的顶表面的高度垂直间隔高于第二电极构件的顶表面的高度。 柔性导电构件以多个第一和第二电极构件的顶表面的高度并且相邻的间隔设置。 具有对应于各个开关单元的阵列的标记阵列的识别构件以与柔性导体上方相邻的间隔关系设置。 阈值构件被包括为对应于各个开关单元的阵列的弹性气泡构件阵列的形式，并且包括用于气泡构件的空气逸出装置以避免被困空气的问题。 气泡构件通过触摸致动，这使得所选择的气泡构件偏转到柔性导电构件中，以在下面的开关单元的相关联的第一和第二电极构件之间提供导电路径。

公开(公告)号：US3969595A

公开(公告)日：1976-07-13

申请号：US508477

申请日：1974-09-23

Applicant: Wendell C. Johnson

Inventor： Wendell C. Johnson

IPC: G06F3/02 ,  H01H1/06 ,  H01H13/00 ,  H01H13/702 ,  H01H13/785 ,  H01H13/80 ,  H01H13/807 ,  H01H13/70

CPC classification number: H01H13/807 ,  H01H13/702 ,  H01H13/785 ,  H01H13/80 ,  H01H2201/004 ,  H01H2201/03 ,  H01H2205/006 ,  H01H2205/01 ,  H01H2205/032 ,  H01H2205/036 ,  H01H2215/004 ,  H01H2215/028 ,  H01H2215/04 ,  H01H2225/002 ,  H01H2227/018 ,  H01H2229/016 ,  H01H2229/05 ,  H01H2229/06 ,  H01H2239/006 ,  Y10T29/49105 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A multiple switching apparatus comprising two spring-like switching members disposed in a tandem array with each integral with its metallic support base. The central area of each of the switching members is defined by a plurality of slots formed in the support base with the length and displacement of the slots defining the force-displacement characteristics of each switching member and, accordingly, of the tandem array. The top switching member moves downward until it produces a first switching function, with further movement of the top switching member effecting movement of the second switching member such that a second switching function is produced.

Abstract translation: 一种多重切换装置，包括设置在串联阵列中的两个类似弹簧的切换构件，每个与其金属支撑基座成一体。 每个切换构件的中心区域由形成在支撑基座中的多个槽限定，其中槽的长度和位移限定每个开关构件的力 - 位移特性，并且因此限定串联阵列。 顶部切换构件向下移动直到其产生第一切换功能，顶部切换构件的进一步移动影响第二切换构件的运动，使得产生第二切换功能。

公开(公告)号：US3594522A

公开(公告)日：1971-07-20

申请号：US3594522D

申请日：1969-07-24

Applicant: IBM

Inventor： COLGLAZIER DONALD F ,  SNESRUD MYRON E

IPC: H01H35/34 ,  H01H13/702 ,  H01H13/785 ,  H01L35/34

CPC classification number: H01H13/785 ,  H01H13/702 ,  H01H2201/03 ,  H01H2203/022 ,  H01H2203/05 ,  H01H2207/012 ,  H01H2209/006 ,  H01H2213/002 ,  H01H2221/02 ,  H01H2229/044

Abstract: An elastic diaphragm switch has a diaphragm assembly formed as an airtight interface between a substantially rigid substrate material and a diaphragm of highly flexible film to which is adhered a copper conductive pattern designed to withstand large deflections without fatigue. This is accomplished by an extended length conductor such as a spiral conductor path extending from the diaphragm supported contact to a stationary conductor. Thus the diaphragm switch may be formed of a single thin film and activated by very low-pressure levels.

公开(公告)号：US20180350530A1

公开(公告)日：2018-12-06

申请号：US15610725

申请日：2017-06-01

Applicant: Siemens Industry, Inc.

Inventor： Hai Chen ,  Mario Munoz ,  Jesus Hernandez

IPC: H01H1/06 ,  H01H1/22 ,  H01H1/02

CPC classification number: H01H1/06 ,  H01H1/02 ,  H01H1/22 ,  H01H2201/03 ,  H01H2203/00

Abstract: An electrical contact apparatus having low silver content and defined thickness and length geometry. The electrical contact apparatus has a contact body made of a silver-containing alloy having SC≤60 wt. %, and having L/T≥5.4, wherein L is a longest contact length dimension of the contact body, T is a maximum contact thickness dimension of the contact body, SC is the silver content in wt. %, and L/T is a contact dimension ratio. Electrical contact assemblies, circuit breaker electrical contact subassemblies, and methods of operating a circuit breaker electrical contact subassembly are disclosed, as are other aspects.

公开(公告)号：US09543099B2

公开(公告)日：2017-01-10

申请号：US14746732

申请日：2015-06-22

Applicant: LSIS CO., LTD.

Inventor： Jung Sik An

IPC: H01H67/02 ,  H01H50/38 ,  H01H9/44 ,  H01H50/54 ,  H01H50/18 ,  H01H51/22 ,  H01H1/54

CPC classification number: H01H50/38 ,  H01H9/443 ,  H01H50/18 ,  H01H50/54 ,  H01H50/546 ,  H01H51/2209 ,  H01H2001/545 ,  H01H2051/2218 ,  H01H2201/008 ,  H01H2201/03

Abstract: The present invention relates to a direct current relay, and more particularly, to a direct current relay capable of reducing an electronic repulsive force generated between a fixed contact and a movable contact by a permanent magnet installed to extinguish an arc. The direct current relay includes: a frame; first and second fixed contacts spaced from each other with a predetermined distance there between; first and second magnetic substances formed to enclose a lower part of the first and second fixed contacts; a movable contact movable to contact or to be separated from the first and second fixed contacts, having a first movable contact contactable to the first fixed contact, and having a second movable contact contactable to the second fixed contact; and a pair of permanent magnets installed on long sides of the frame.

Abstract translation: 直流继电器技术领域本发明涉及一种直流继电器，更具体地说，涉及一种直流继电器，该直流继电器能够通过安装为消除电弧的永磁体来减少在固定触头和可动触点之间产生的电子排斥力。 直流继电器包括：一个框架; 第一和第二固定触点彼此隔开预定距离; 形成为包围第一和第二固定触点的下部的第一和第二磁性物质; 可移动接触件，其能够接触或与第一和第二固定触头分离，具有可接触第一固定触头的第一可动触头，以及具有可接触第二固定触头的第二可动触点; 以及安装在框架的长边上的一对永久磁铁。

公开(公告)号：US20160372276A1

公开(公告)日：2016-12-22

申请号：US14896403

申请日：2014-09-15

Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD

Inventor： Huisheng HAN ,  HONGMEI ZHANG ,  YANG DING ,  ZHIHONG DONG ,  CHENG HUANG

IPC: H01H1/02 ,  C23C18/16 ,  C25D5/48 ,  C25D3/48 ,  C25D3/46 ,  C25D5/02 ,  H01H11/04 ,  C23C18/42

CPC classification number: H01H1/02 ,  C23C18/1605 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/42 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D5/022 ,  C25D5/12 ,  C25D5/48 ,  H01H1/023 ,  H01H1/06 ,  H01H11/04 ,  H01H2011/046 ,  H01H2201/016 ,  H01H2201/024 ,  H01H2201/03 ,  H01H2229/014 ,  H01H2229/016

Abstract: This invention discloses a preparation method for precious metal switching contact components by means of plating masking, plating and etching processes. The plating masking process is performed by using a plating mask ink with or without a photo exposure machine. Plating of precious metals is performed by electroless plating or electro plating methods. Etching is carried out with etching solutions containing weak organic acids, weak inorganic acids or acidic buffering agents. Improvement of the etched surface gloss and prevention of the side etching are realized with the sulfur-contained compounds. The dust- and oil stain-resistances of the switch contacts are improved by increasing the etching depth. The switch contacts made by this invention are featured with the advantages of good reliability, good resistance to dust and oil stain, short contact bounce time, long service life, low cost of raw materials and so on.

Abstract translation: 本发明公开了一种通过电镀掩模，电镀和蚀刻工艺制备贵金属开关接触元件的方法。 通过使用具有或不具有照相曝光机的电镀掩模油墨进行镀覆掩模处理。 通过化学镀或电镀方法进行贵金属的镀覆。 用含有弱有机酸，弱无机酸或酸性缓冲剂的蚀刻溶液进行蚀刻。 用含硫化合物实现蚀刻表面光泽的改善和侧面蚀刻的防止。 通过增加蚀刻深度可以改善开关触点的防尘防油性。 本发明制造的开关触点具有可靠性好，耐灰尘，油污，触点反弹时间短，使用寿命长，原材料成本低等优点。

公开(公告)号：US20160141126A1

公开(公告)日：2016-05-19

申请号：US14900240

申请日：2014-09-05

Applicant: Hitachi, Ltd.

Inventor： Shigeru KIKUCHI ,  Kunihiko TOMIYASU ,  Kenji TSUCHIYA ,  Takashi SATO ,  Ayumu MORITA

IPC: H01H33/664 ,  C22C27/04 ,  C22C30/02 ,  B22F3/26 ,  B22F1/00 ,  B22F5/12 ,  B22F3/02 ,  H01H33/666 ,  C22C9/00

CPC classification number: H01H33/6643 ,  B22F1/0003 ,  B22F3/02 ,  B22F3/26 ,  B22F5/12 ,  B22F2201/10 ,  B22F2201/20 ,  B22F2301/10 ,  B22F2301/20 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/04 ,  C22C1/0425 ,  C22C1/045 ,  C22C9/00 ,  C22C27/04 ,  C22C30/02 ,  H01H33/664 ,  H01H33/666 ,  H01H2201/03 ,  H01H2205/002 ,  B22F2201/01

Abstract: In an electrical contact in which aggregation phases including Cu are dispersed in a matrix phase including Mo, Cr, and Cu, a maximum grain size of the aggregation phases falls in a range of 4 to 20 μm and, when the total Cu content in the electrical contact is denoted by Wt, the Cu content in the matrix phase is expressed by C×Wt, where C ranges from 0.54 to 0.81. A process for producing an electrical contact including Mo, Cr, and Cu includes a step of compacting mixed Mo and Cr powders, thus forming a powder-compression compact and a step of making the powder-compression compact infiltrated with molten Cu.

Abstract translation: 在其中包含Cu的聚集相分散在包括Mo，Cr和Cu的基质相中的电接触中，聚集相的最大晶粒尺寸落在4至20μm的范围内，并且当Cu 电接触由Wt表示，基质相中的Cu含量由C×Wt表示，C为0.54〜0.81。 用于制造包括Mo，Cr和Cu的电接触的方法包括压实混合的Mo和Cr粉末的步骤，从而形成粉末压缩压块，以及使熔融的Cu浸渍的粉末压缩压块的步骤。

公开(公告)号：US08111522B2

公开(公告)日：2012-02-07

申请号：US12150684

申请日：2008-04-29

Applicant: Fletcher R. Rothkopf ,  Teodor Dabov ,  Richard Hung Minh Dinh ,  Jun Sun ,  Michael Rosenblatt

Inventor： Fletcher R. Rothkopf ,  Teodor Dabov ,  Richard Hung Minh Dinh ,  Jun Sun ,  Michael Rosenblatt

IPC: H05K7/02 ,  A01H9/18

CPC classification number: H05K3/323 ,  H01H13/48 ,  H01H13/7006 ,  H01H13/78 ,  H01H13/785 ,  H01H2201/024 ,  H01H2201/03 ,  H01H2203/038 ,  H01H2205/016 ,  H01H2207/008 ,  H01H2207/014 ,  H05K1/141 ,  H05K2201/10053

Abstract: An electrical contact area on a printed circuit board (“PCB”), that would otherwise be subject to abrasion and possibly also corrosion, can be protected by covering it with another, more durable contact structure that is bonded to the first-mentioned contact area using an anistropic conductive adhesive (“ACA”). The more durable contact structure may include a member of PCB material or the like with electrically connected electrical contacts on its upper and lower surfaces. At least the upper one of these contacts (which is exposed for the service that involves possible abrasion and/or corrosion) may be given high durability by plating it with hard gold. The lower of these contacts is adhered to the main PCB via the above-mentioned ACA.

Abstract translation: 印刷电路板（“PCB”）上的电接触区域可以通过用另一种更耐用的接合结构来覆盖，该接触区域被粘合到首先提及的接触区域 使用不导电导电粘合剂（“ACA”）。 更耐用的接触结构可以包括在其上表面和下表面上具有电连接的电触点的PCB材料等的构件。 至少这些触点中的上部（为了可能的磨损和/或腐蚀而被暴露的服务）可以通过用硬金镀覆来获得高耐久性。 这些触点的下部通过上述ACA粘附到主PCB。