公开(公告)号：US20240015939A1

公开(公告)日：2024-01-11

申请号：US18372298

申请日：2023-09-25

申请人： BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Yaya QI ,  Dianzheng DONG ,  Yan YAN ,  Xiao WANG ,  Xue WANG ,  Tingting WANG ,  Xiaoying LI ,  Zhiqiang MA

IPC分类号： H05K1/02 ,  H05K9/00

CPC分类号： H05K1/0259 ,  H05K9/0067 ,  H05K1/0215

摘要： The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.

公开(公告)号：US20230309234A1

公开(公告)日：2023-09-28

申请号：US17898967

申请日：2022-08-30

申请人： Kioxia Corporation

发明人： Kazuyuki Niitsuma

IPC分类号： H05K1/18 ,  H05K1/02

CPC分类号： H05K1/181 ,  H05K1/0215 ,  H05K1/0298 ,  H05K2201/1034 ,  H05K2201/10159

摘要： A substrate includes a first connector fittable to a connector of a host device. The first connector includes a plurality of connector terminals arranged in a first direction and a substrate portion including a surface S1 provided with the plurality of connector terminals and extending in the first direction. The substrate portion includes a surface S3 perpendicular to the surface S1, a first protrusion provided on the surface S3 and protruding in the first direction, a surface S4 located on an opposite side of the surface S3, and a second protrusion provided on the surface S4 and protruding in a direction opposite to the first direction.

公开(公告)号：US20230275061A1

公开(公告)日：2023-08-31

申请号：US18144376

申请日：2023-05-08

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC分类号： H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H05K1/02 ,  H05K7/10 ,  H01L23/31

CPC分类号： H01L24/49 ,  H01L23/66 ,  H01L23/49811 ,  H01L23/552 ,  H05K1/0215 ,  H05K7/10 ,  H01L23/3128 ,  H01L2224/48091 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/115

摘要： An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

公开(公告)号：US20230240021A1

公开(公告)日：2023-07-27

申请号：US18193823

申请日：2023-03-31

申请人： Harman International Industries, Incorporated

发明人： Jianing Chen ,  Jon Curry ,  David Jia

IPC分类号： H05K3/34 ,  H05K1/02

CPC分类号： H05K3/3457 ,  H05K1/0215 ,  H05K5/0008

摘要： An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

公开(公告)号：US11646290B2

公开(公告)日：2023-05-09

申请号：US17340350

申请日：2021-06-07

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC分类号： H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H05K1/02 ,  H05K7/10 ,  H01L23/31 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L24/49 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/552 ,  H01L23/66 ,  H05K1/0215 ,  H05K7/10 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10287 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

公开(公告)号：US20180350751A1

公开(公告)日：2018-12-06

申请号：US15973541

申请日：2018-05-08

申请人： MEDIATEK INC.

发明人： Ruey-Bo Sun ,  Wen-Chou Wu

IPC分类号： H01L23/552 ,  H01L23/373 ,  H01L23/06 ,  H01L23/64 ,  H01L25/065

CPC分类号： H01L23/66 ,  H01L23/552 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K7/20454 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/1056

摘要： A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.

公开(公告)号：US20180279514A1

公开(公告)日：2018-09-27

申请号：US15920989

申请日：2018-03-14

申请人： Japan Display Inc.

发明人： Masanori MAEMUKO

IPC分类号： H05K9/00 ,  H05K1/02 ,  G02F1/1333 ,  H01R4/34 ,  H05K1/11 ,  F21V8/00

CPC分类号： H05K9/0026 ,  G02B6/0088 ,  G02F1/133308 ,  G02F2001/133314 ,  G02F2001/133334 ,  H01L51/5237 ,  H01R4/34 ,  H05K1/0215 ,  H05K1/117 ,  H05K1/147 ,  H05K9/0054 ,  H05K9/0058 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10371 ,  H05K2201/10409

摘要： According to an aspect, a display device includes: a display panel; a housing; a printed circuit board; a boss that penetrates a first through hole in the printed circuit board and protrudes from a surface of the housing, the surface being attached to the printed circuit board; a shield cover; and a male screw. The shield cover includes: a top plate; side plates; and a contact piece formed by folding a part of one of the side plates inward and including a protrusion in contact with a ground pattern of the printed circuit board and a claw facing the top plate. The protrusion causes the claw to protrude toward the printed circuit board. The male screw is fastened to the boss from the outside of the top plate.

公开(公告)号：US10082842B1

公开(公告)日：2018-09-25

申请号：US15674461

申请日：2017-08-10

申请人： Super Micro Computer, Inc.

发明人： Dwight Looi

IPC分类号： G06F1/18 ,  H05K1/02

CPC分类号： G06F1/185 ,  G06F13/00 ,  G06F13/4081 ,  G06F13/409 ,  H05K1/0215 ,  H05K1/029 ,  H05K1/141 ,  H05K3/301 ,  H05K3/368 ,  H05K7/142 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/2036

摘要： One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.

公开(公告)号：US10082312B2

公开(公告)日：2018-09-25

申请号：US14266528

申请日：2014-04-30

申请人： Honeywell International Inc.

发明人： Jan Vozenilek ,  Jan Pospisil ,  Cary Leen

IPC分类号： H05K7/14 ,  H05K13/00 ,  H05K1/02 ,  H02H9/04 ,  G05D23/19 ,  F24F11/76 ,  F24F11/52 ,  F24F11/30 ,  F21V8/00 ,  G05B21/00 ,  F24F11/053

CPC分类号： F24F11/62 ,  F24F11/30 ,  F24F11/52 ,  F24F11/76 ,  F24F13/20 ,  G02B6/0031 ,  G02B6/0088 ,  G05D23/19 ,  G05D23/1904 ,  G05D23/1917 ,  G05D23/1919 ,  H02H9/04 ,  H05K1/0215 ,  H05K7/1427 ,  H05K13/00 ,  Y10T29/49117 ,  Y10T29/49126

摘要： An HVAC controller including a controller and a display operatively coupled to the controller. The display may include a first region and a second region. The first region of the display may have an array of pixels arranged in a plurality of rows and a plurality of columns for displaying an image in a dot matrix format. The second region of the display may have a plurality of predefined fixed segment graphical icons. The controller may be configured to sequentially display two or more installer set up items. Illustratively, each of the installer setup items may include an installer set up item number displayed in the second region of the display, an installer setup item name that may be displayed in the first region of the display, and an installer setup item value that may be displayed in the first region of the display.

公开(公告)号：US20180210297A1

公开(公告)日：2018-07-26

申请号：US15567181

申请日：2017-05-08

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

发明人： Jingyi Xu ,  Kunpeng Zhang ,  Yanwei Ren ,  Yanyan Zhao ,  Yi Fan ,  Yu Liu

IPC分类号： G02F1/1362 ,  H01R12/61 ,  H05K1/02

CPC分类号： G02F1/136204 ,  H01R12/613 ,  H01R13/6594 ,  H05K1/0215 ,  H05K1/0259

摘要： Embodiments of the present disclosure pertain to a circuit board, a display panel and a display device. The circuit board includes a ground protection circuit, disposed in a peripheral area of the circuit board. The ground protection circuit includes one or more first wires arranged in parallel, a bridging connection part and a plurality of second wires arranged in parallel, where one end of each first wire is grounded and the other end connects to the bridging connection part electrically, while one end of each second wire connects to the bridging connection part electrically and the other end is grounded. The display panel includes the circuit board and the display device includes the display panel.