公开(公告)号：US10815574B2

公开(公告)日：2020-10-27

申请号：US15862867

申请日：2018-01-05

Applicant: ND Industries, Inc.

Inventor： Gerald F. Snow ,  Christopher T. Hable ,  Scot Wickham

IPC: C23F11/173 ,  C09D177/02 ,  C09D7/63 ,  C09D5/08 ,  C09D7/40 ,  C09D5/03 ,  C09D177/06 ,  C09D163/00 ,  B05D1/12 ,  B05D3/02 ,  C08K7/24

Abstract: A coated article comprises an article comprising a surface and a galvanic barrier coating disposed on the surface. The galvanic barrier coating is formed from a galvanic barrier coating composition comprising (a) a thermoplastic resin, (b) an epoxy-based resin, (c) a curing agent, and (d) non-compressible, non-marring microsphere particles. Methods of preparing and using the coated article are also disclosed.

公开(公告)号：US10508193B2

公开(公告)日：2019-12-17

申请号：US15613962

申请日：2017-06-05

Applicant: FIRESTONE BUILDING PRODUCTS CO., LLC

Inventor： Wensheng Zhou ,  Michael J. Hubbard ,  Joseph Carr

IPC: B32B5/16 ,  B32B37/24 ,  C08K3/016 ,  C08K3/04 ,  E04D5/10 ,  C08K7/24 ,  B32B15/06 ,  B32B15/08 ,  B32B25/08 ,  B32B25/10 ,  B32B25/18 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/30 ,  B32B9/04 ,  B32B9/00 ,  C09J7/38 ,  C09J7/40 ,  C09J7/22 ,  B32B5/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/082 ,  B32B15/085 ,  B32B15/20 ,  B32B25/04 ,  B32B25/06 ,  B32B25/12 ,  B32B25/14 ,  B32B25/16 ,  B32B25/20 ,  B32B27/06 ,  B32B27/10 ,  B32B27/22 ,  B32B27/28 ,  B32B27/32 ,  B32B27/36 ,  B32B29/00 ,  B32B37/12 ,  B32B37/26

Abstract: A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

公开(公告)号：US20190322816A1

公开(公告)日：2019-10-24

申请号：US16462981

申请日：2017-12-18

Applicant: ADEKA CORPORATION

Inventor： Atsushi KOBAYASHI ,  Ryo TANIUCHI ,  Tomoaki SAIKI

IPC: C08J3/09 ,  C08J3/11 ,  C08K5/521 ,  C08K3/32 ,  C08K3/04 ,  C08K3/30 ,  C08K7/00 ,  C08K7/24

Abstract: A solution is prepared that contains (A) a polymer compound that includes at least one of a hydrolyzable polymer compound or a thermally-decomposable polymer compound, (B) an oxoacid-based compound that includes at least one of a phosphate-based compound, a sulfate-based compound, a sulfonate-based compound, or a perchlorate-based compound, and (C) a laminate of layered substances, and the solution is irradiated with at least one of sonic waves or radio waves, or the solution is heated.

公开(公告)号：US10442739B2

公开(公告)日：2019-10-15

申请号：US15221903

申请日：2016-07-28

Applicant: NGK INSULATORS, LTD.

Inventor： Hiroharu Kobayashi

IPC: C04B38/00 ,  C08K7/24 ,  F02F1/42 ,  C04B35/488 ,  C04B35/622 ,  C04B35/626 ,  C04B35/638 ,  C04B35/48 ,  C04B35/634 ,  C04B38/06 ,  C09K21/02 ,  F01N13/08 ,  F01N13/14 ,  C04B111/00 ,  C04B111/28

Abstract: Provided is a porous plate-shaped filler that can be used as a material for a heat-insulation film having excellent heat insulation performance. In a porous plate-shaped filler 1 having a plate shape, an aspect ratio is 3 or higher, a minimum length is 0.5 to 50 μm, and an overall porosity is 20 to 90%, and the porosity is lower in the circumferential part than in the center part. When this porous plate-shaped filler 1 of the present invention is contained in a heat-insulation film, the infiltration of a matrix into the filler is reduced, and thus the thermal conductivity can be lowered. Therefore, even a thin heat-insulation film can have a greater heat-insulation effect than before.

公开(公告)号：US10415127B2

公开(公告)日：2019-09-17

申请号：US14917106

申请日：2014-08-11

Applicant: Harry F. Miller ,  H. Allan Kidd

Inventor： Harry F. Miller ,  H. Allan Kidd

IPC: C22C49/14 ,  C08K7/24 ,  B22D25/06 ,  B22D27/11 ,  B22D27/15 ,  C22C47/08 ,  C22C47/14 ,  C22C49/06 ,  C22C49/08 ,  C22C49/11 ,  B22F5/00 ,  B22F5/04 ,  C22C1/10 ,  C22C26/00 ,  B22D19/14 ,  C01B32/168

Abstract: A turbomachine component and method for fabricating the turbomachine component are provided. The turbomachine component may include a matrix material and carbon nanotubes combined with the matrix material. The matrix material may include a metal or a polymer. The carbon nanotubes may be contacted with the metal to form a metal-based carbon nanotube composite, and the metal-based carbon nanotube composite may be processed to fabricate the turbomachine component.

公开(公告)号：US20190255822A1

公开(公告)日：2019-08-22

申请号：US16240619

申请日：2019-01-04

Applicant: HANWHA AZDEL, INC.

Inventor： Ruomiao Wang

IPC: B32B27/08 ,  C08L23/12 ,  C08K7/24 ,  C08J5/04 ,  C08K3/016 ,  C08K3/04 ,  C08K3/22 ,  B32B27/18 ,  B32B5/18 ,  E04B9/04 ,  E04B9/00

Abstract: A thermoplastic composite article comprising a porous core layer and an open cell skin disposed on a first surface of the core layer is described. The composite article comprises a noise reduction coefficient of at least 0.5 as tested by ASTM C423-17 and a flame spread index of less than 25 and a smoke development index of less than 150 as tested by ASTM E84 dated 2009.

公开(公告)号：US10381533B2

公开(公告)日：2019-08-13

申请号：US15206615

申请日：2016-07-11

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

IPC: H01L29/08 ,  H01L33/60 ,  C08K3/22 ,  C08K7/24 ,  C08K7/28 ,  C08L63/00 ,  C08L63/06 ,  B29C45/00 ,  B29C45/02 ,  C08G59/40 ,  C08G59/42 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  C08K3/013 ,  B29L11/00

Abstract: Disclosed is an optical semiconductor device having an optical semiconductor mounting element including a recess. On an inner side face of the recess is a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100° C. to 200° C., molding pressure of not more than 20 MPa, and molding time of 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%.

公开(公告)号：US10236092B2

公开(公告)日：2019-03-19

申请号：US15471160

申请日：2017-03-28

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

IPC: H01B1/22 ,  C08K3/04 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/00 ,  B82Y30/00 ,  B82Y40/00

Abstract: A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

公开(公告)号：US20180340100A1

公开(公告)日：2018-11-29

申请号：US16004028

申请日：2018-06-08

Applicant: James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu ,  INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

IPC: C09J9/00 ,  H01L25/00 ,  C09J11/04 ,  H01L23/00 ,  H01L23/48 ,  H01L21/768 ,  H01L21/683 ,  C09J183/04 ,  C09J179/08 ,  C09J179/04 ,  C09J11/06 ,  H01L25/065 ,  C08K7/24 ,  C08K5/548 ,  C08K5/5465 ,  C08K5/544 ,  C08K5/5425 ,  B82Y40/00 ,  B82Y30/00 ,  C08K3/04

Abstract: The present invention related to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

公开(公告)号：US10131752B2

公开(公告)日：2018-11-20

申请号：US14776026

申请日：2014-03-14

Applicant: RELIANCE INDUSTRIES LIMITED

Inventor： Allen David Clauss ,  Brian Jeffrey Koth ,  Guiquan Pan ,  Nicholas Richard Wietfeldt ,  Matthew Clayton Hall

IPC: C08J3/205 ,  C08J5/00 ,  C08K3/04 ,  C08K7/24 ,  C08J3/20 ,  C08J3/215 ,  B82Y30/00

Abstract: Provided herein is technology relating to polymer nanocomposites, and particularly, but not exclusively, to polymer nanocomposites comprising two or more nanomaterials and methods of producing nanocomposites comprising two or more nanomaterials.