公开(公告)号：US11805026B2

公开(公告)日：2023-10-31

申请号：US16993678

申请日：2020-08-14

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Stanley Ames Lackey, Jr. ,  Damon Tohidi ,  Gerald R. Talbot ,  Edoardo Prete

IPC: H04L41/147 ,  H04L43/50 ,  H04L43/0852 ,  H04L7/10 ,  H04L43/0823 ,  H04L25/14 ,  H04L7/06 ,  H04L7/00 ,  H04L7/04

CPC classification number: H04L41/147 ,  H04L7/06 ,  H04L7/10 ,  H04L25/14 ,  H04L43/0823 ,  H04L43/0852 ,  H04L43/50 ,  H04L7/0041 ,  H04L7/043

Abstract: Systems, apparatuses, and methods for utilizing training sequences on a replica lane are described. A transmitter is coupled to a receiver via a communication channel with a plurality of lanes. One of the lanes is a replica lane used for tracking the drift in the optimal sampling point due to temperature variations, power supply variations, or other factors. While data is sent on the data lanes, test patterns are sent on the replica lane to determine if the optimal sampling point for the replica lane has drifted since a previous test. If the optimal sampling point has drifted for the replica lane, adjustments are made to the sampling point of the replica lane and to the sampling points of the data lanes.

公开(公告)号：US11804479B2

公开(公告)日：2023-10-31

申请号：US16586309

申请日：2019-09-27

Applicant: Advanced Micro Devices, Inc.

Inventor： John J. Wuu ,  Milind S. Bhagavat ,  Brett P. Wilkerson ,  Rahul Agarwal

IPC: H01L25/18 ,  H01L23/48 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L23/481 ,  H01L23/528 ,  H01L24/05 ,  H01L24/08 ,  H01L2224/0557 ,  H01L2224/08146

Abstract: Systems, apparatuses, and methods for routing traffic through vertically stacked semiconductor dies are disclosed. A first semiconductor die has a second die stacked vertically on top of it in a three-dimensional integrated circuit. The first die includes a through silicon via (TSV) interconnect that does not traverse the first die. The first die includes one or more metal layers above the TSV, which connect to a bonding pad interface through a bonding pad via. If the signals transferred through the TSV of the first die are shared by the second die, then the second die includes a TSV aligned with the bonding pad interface of the first die. If these signals are not shared by the second die, then the second die includes an insulated portion of a wafer backside aligned with the bonding pad interface.

公开(公告)号：US11803734B2

公开(公告)日：2023-10-31

申请号：US15849617

申请日：2017-12-20

Applicant: Advanced Micro Devices, Inc.

Inventor： Daniel I. Lowell ,  Sergey Voronov ,  Mayank Daga

IPC: G06N3/063 ,  G06N3/08

CPC classification number: G06N3/063 ,  G06N3/08

Abstract: Methods, devices, systems, and instructions for adaptive quantization in an artificial neural network (ANN) calculate a distribution of ANN information; select a quantization function from a set of quantization functions based on the distribution; apply the quantization function to the ANN information to generate quantized ANN information; load the quantized ANN information into the ANN; and generate an output based on the quantized ANN information. Some examples recalculate the distribution of ANN information and reselect the quantization function from the set of quantization functions based on the resampled distribution if the output does not sufficiently correlate with a known correct output. In some examples, the ANN information includes a set of training data. In some examples, the ANN information includes a plurality of link weights.

公开(公告)号：US11803385B2

公开(公告)日：2023-10-31

申请号：US17548105

申请日：2021-12-10

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Sateesh Lagudu ,  Arun Vaidyanathan Ananthanarayan ,  Michael Mantor ,  Allen H. Rush

IPC: G06F9/30 ,  G06F9/32 ,  G06F15/80 ,  G06F9/38 ,  G06T1/20

CPC classification number: G06F9/321 ,  G06F9/3004 ,  G06F9/30087 ,  G06F9/30098 ,  G06F9/30145 ,  G06F9/3887 ,  G06F15/80 ,  G06T1/20

Abstract: An array processor includes processor element arrays (PEAs) distributed in rows and columns. The PEAs are configured to perform operations on parameter values. A first sequencer received a first direct memory access (DMA) instruction that includes a request to read data from at least one address in memory. A texture address (TA) engine requests the data from the memory based on the at least one address and a texture data (TD) engine provides the data to the PEAs. The PEAs provide first synchronization signals to the TD engine to indicate availability of registers for receiving the data. The TD engine provides second synchronization signals to the first sequencer in response to receiving acknowledgments that the PEAs have consumed the data.

公开(公告)号：US11803311B2

公开(公告)日：2023-10-31

申请号：US17218700

申请日：2021-03-31

Applicant: Advanced Micro Devices, Inc.

Inventor： Johnathan Alsop ,  Nuwan Jayasena ,  Shaizeen Aga ,  Andrew McCrabb

IPC: G06F3/06

CPC classification number: G06F3/064 ,  G06F3/0604 ,  G06F3/0644 ,  G06F3/0659 ,  G06F3/0679

Abstract: Methods and apparatuses to control digital data transfer via a memory channel between a memory module and a processor are disclosed. At least one of the memory module or the processor coalesces a plurality of short data words into multicast coalesced block data comprising a single data block for transfer via the memory channel. Each of the plurality of short data words pertains to one of at least two partitioned memory submodules in the memory module. The multicast coalesced block data is communicated over the memory channel.

公开(公告)号：US20230342528A1

公开(公告)日：2023-10-26

申请号：US17990005

申请日：2022-11-18

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： David Akselrod ,  Shi Han Zhang ,  Chun Fung Lam

IPC: G06F30/3308 ,  G06F30/3323 ,  G06N20/00

CPC classification number: G06F30/3308 ,  G06F30/3323 ,  G06N20/00

Abstract: Techniques for implementing a mixed signal feedback design for verification that reduce production and verification time by enabling piecemeal verification of components of a circuit design selectively, accurately, and exhaustively before a final, overall circuit design is completed are disclosed. Circuit nodes in an emulation model are selected and mixed signal feedback is provided to the nodes in response to signals detected at the nodes such that behavior of unavailable or unverified components to be located at the nodes can be simulated. Mixed signal feedback can be provided to the node to enable verification of the emulation model without having to wait for the unverified or unavailable components to be provided or verified. A request for manufacture may be generated including aspects of the emulation model to enable verification of a fabricated circuit in a similar or identical manner to those used to verify the emulation model.

公开(公告)号：US20230342325A1

公开(公告)日：2023-10-26

申请号：US18216908

申请日：2023-06-30

Applicant: ATI Technologies ULC ,  Advanced Micro Devices, Inc.

Inventor： Gordon Caruk ,  Maurice B. Steinman ,  Gerald R. Talbot ,  Joseph D. Macri

IPC: G06F13/42 ,  G06F13/16

CPC classification number: G06F13/4282 ,  G06F13/1689 ,  G06F2213/0026

Abstract: A link controller includes a Peripheral Component Interconnect Express (PCIe) physical layer circuit for coupling to a communication link and providing a data path over the communication link, a first data link layer controller which operates according to a PCIe protocol, and a second data link layer controller which operates according to a non-PCIe protocol. A multiplexer-demultiplexer selectively connects both data link layer controllers to the PCIe physical layer circuit. A protocol translation circuit is coupled between the multiplexer-demultiplexer and the second data link layer controller, the protocol translation circuit receiving traffic data from the second data link layer controller in a non-PCIe format, encapsulating the non-PCIe format in a PCIe format, and passing traffic data to the multiplexer-demultiplexer circuit.

公开(公告)号：US11797369B2

公开(公告)日：2023-10-24

申请号：US17864804

申请日：2022-07-14

Applicant: Advanced Micro Devices, Inc.

Inventor： James R. Magro ,  Kedarnath Balakrishnan ,  Vilas Sridharan

IPC: G06F11/07 ,  G06F3/06 ,  G06F11/14

CPC classification number: G06F11/0772 ,  G06F3/0679 ,  G06F11/073 ,  G06F11/141

Abstract: A memory controller includes a memory channel controller adapted to receive memory access requests and dispatch associated commands addressable in a system memory address space to a non-volatile storage class memory (SCM) module. The non-volatile error reporting circuit identifies error conditions associated with the non-volatile SCM module and maps the error conditions from a first number of possible error conditions associated with the non-volatile SCM module to a second, smaller number of virtual error types for reporting to an error monitoring module of a host operating system, the mapping based at least on a classification that the error condition will or will not have a deleterious effect on an executable process running on the host operating system.

公开(公告)号：US20230315171A1

公开(公告)日：2023-10-05

申请号：US17704912

申请日：2022-03-25

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Amitabh Mehra ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K5/0213 ,  H05K5/0239 ,  H05K7/20209

Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

公开(公告)号：US20230310995A1

公开(公告)日：2023-10-05

申请号：US17709904

申请日：2022-03-31

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Mehdi Saeedi ,  Ian Charles Colbert ,  Thomas Daniel Perry ,  Gabor Sines

IPC: A63F13/56

CPC classification number: A63F13/56

Abstract: Systems, apparatuses, and methods for detecting personal-space violations in artificial intelligence (AI) based non-player characters (NPCs) are disclosed. An AI engine creates a NPC that accompanies and/or interacts with a player controlled by a user playing a video game. During gameplay, measures of context-dependent personal space around the player and/or one or more NPCs are generated. A control circuit monitors the movements of the NPC during gameplay and determines whether the NPC is adhering to or violating the measures of context-dependent personal space. The control circuit can monitor the movements of multiple NPCs simultaneously during gameplay, keeping a separate score for each NPC. After some amount of time has elapsed, the scores of the NPCs are recorded, and then the scores are provided to a machine learning engine to retrain the AI engines controlling the NPCs.