公开(公告)号：US20120134762A1

公开(公告)日：2012-05-31

申请号：US13044910

申请日：2011-03-10

Applicant: Jen-Ji Wang ,  En-Sheng Chang ,  Chih-Ming Chen

Inventor： Jen-Ji Wang ,  En-Sheng Chang ,  Chih-Ming Chen

IPC: B23C1/06 ,  B23C1/14

CPC classification number: B23Q11/0028 ,  Y10T29/5114 ,  Y10T409/305712 ,  Y10T409/307672 ,  Y10T409/308288

Abstract: A moving beam type machine tool is disclosed, having a dynamic phase balancing weight set and a spindle saddle. The spindle saddle has at least one X-axis location feedback device. When the spindle saddle along the X-axis traverse, the at least one X-axis location feedback device is able to locate the spindle saddle and inform a controlling unit. The controlling unit changes the output pressure of the dynamic phase balancing weight set depending on the location of the spindle saddle, so that a crossbeam is able to maintain in a balancing state. The moving beam type machine tool is able to increase accurate, sensitivity of pressure response, withstanding weight and balancing state.

Abstract translation: 公开了一种具有动态相位平衡重量组和主轴鞍座的移动梁式机床。 主轴座具有至少一个X轴定位反馈装置。 当主轴沿X轴移动时，至少一个X轴位置反馈装置能够定位主轴鞍座并通知控制单元。 控制单元根据主轴鞍座的位置改变动态相位平衡重量的输出压力，使得横梁能够保持平衡状态。 移动梁式机床能够提高压力响应的精度，灵敏度，承受重量和平衡状态。

公开(公告)号：US08047649B2

公开(公告)日：2011-11-01

申请号：US12687249

申请日：2010-01-14

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: G02C1/00

CPC classification number: G02C11/08 ,  G02C2200/08

Abstract: The invention relates to a pair of eyeglasses which include a lens stand and a pair of gaskets. Each gasket can be detachably connected to the lens stand. Each gasket has an inner edge that protrudes forwards to accommodate the lens. The degree of the curve of the lens is smaller than that of the lens stand relative to the horizontal direction, so that the size of the lens can be efficiently reduced, and hence the lens with diopter can be used easily and aberration can be efficiently eliminated. Furthermore, after the gaskets are connected to the lens stand, the upper portion of the gaskets may generate gas permeable holes so as to prevent the lens from fogging up.

公开(公告)号：US07919116B2

公开(公告)日：2011-04-05

申请号：US11713143

申请日：2007-03-02

Applicant: Chih-Ming Chen ,  Xiu Xiu Cheng ,  Steve Jan ,  Joseph Chou

Inventor： Chih-Ming Chen ,  Xiu Xiu Cheng ,  Steve Jan ,  Joseph Chou

IPC: A61K9/22 ,  A61K31/155

CPC classification number: A61K9/2866 ,  A61K9/0004 ,  A61K9/2072 ,  A61K9/282 ,  A61K9/2886 ,  A61K31/155

Abstract: Sustained release pharmaceutical formulations comprising an antihyperglycemic drug or a pharmaceutically acceptable salt thereof are disclosed. The formulations provide therapeutic plasma levels of the antihyperglycemic drug to a human patient over a 24 hour period after administration.

Abstract translation: 公开了包含抗高血糖药物或其药学上可接受的盐的缓释药物制剂。 制剂在给药后24小时内向人类患者提供抗高血糖药物的治疗血浆水平。

公开(公告)号：US20110065737A1

公开(公告)日：2011-03-17

申请号：US12559818

申请日：2009-09-15

Applicant: Chen-Fu Liu ,  Kuang-Yuan Lee ,  Pei-Chin Cheng ,  Yo-Chin Liu ,  Pin Lo ,  Kuo-Feng Tseng ,  Chih-Ming Chen ,  Chi-Hsin Richard King ,  Chu-Chung Lin

Inventor： Chen-Fu Liu ,  Kuang-Yuan Lee ,  Pei-Chin Cheng ,  Yo-Chin Liu ,  Pin Lo ,  Kuo-Feng Tseng ,  Chih-Ming Chen ,  Chi-Hsin Richard King ,  Chu-Chung Lin

IPC: A61K31/519 ,  A61K31/4355 ,  A61P31/12 ,  C07D245/00

CPC classification number: C07K5/0804 ,  A61K31/4355 ,  A61K31/519 ,  A61K38/00 ,  C07D491/048 ,  C07D519/00

Abstract: This invention relates to macrocyclic compounds of formula (I) shown in the specification. These compounds can be used to treat hepatitis C virus infection.

Abstract translation: 本发明涉及说明书中所示的式（I）的大环化合物。 这些化合物可用于治疗丙型肝炎病毒感染。

公开(公告)号：US07701050B2

公开(公告)日：2010-04-20

申请号：US11954679

申请日：2007-12-12

Applicant: Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

Inventor： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

IPC: H01L23/48 ,  H01L29/267 ,  H01L29/22 ,  H01L31/0232 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

Abstract: A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

Abstract translation: 侧视光二极管封装安装在至少具有焊料凸块的印刷电路板上。 侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。 硅衬底具有第一表面和第二表面。 保持空间在第一表面具有顶部开口，在其上具有用于保持光二极管的底部。 接合表面设置在硅衬底的侧面并且结合到印刷电路板上。 该定位结构在接合面的至少一侧具有焊料接收部，与焊料凸块对应。 焊锡凸块在焊接过程中熔化并被接收在焊料接收部分中，从而便于将硅衬底定位在印刷电路板上。

公开(公告)号：US07613205B1

公开(公告)日：2009-11-03

申请号：US11388444

申请日：2006-03-24

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: H04L12/42

CPC classification number: H04L63/1416 ,  H04L63/0227

Abstract: A token-assignment network implemented out of existing computers that are interconnected in an Ethernet network. The token-assignment mode ensures that each computer in the token-assignment network has a turn at transmitting, thus preventing starvation of any particular computer in the token-assignment network. In this manner, computers of the token-assignment network are able to continue functioning even during a virus outbreak, thereby enabling business to continue and/or virus remedial actions to be taken via the network.

Abstract translation: 在以太网网络中互连的现有计算机中实现的令牌分配网络。 令牌分配模式确保令牌分配网络中的每个计算机具有发送的转弯，从而防止令牌分配网络中任何特定计算机的饥饿。 以这种方式，即使在病毒爆发期间，令牌分配网络的计算机也能够继续运行，从而使业务能够通过网络进行继续和/或病毒补救动作。

公开(公告)号：US07525185B2

公开(公告)日：2009-04-28

申请号：US11725827

申请日：2007-03-19

Applicant: Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

Inventor： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu ,  Chih-Ming Chen

IPC: H01L23/02

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die.

Abstract translation: 本发明提供一种具有并排配置的多芯片的半导体器件封装，包括：具有通孔的基板，其中，所述基板具有通孔，连接通孔结构和上表面上的第一接触焊盘;以及第二接触焊盘， 基质。 具有第一接合焊盘的第一管芯和具有第二接合焊盘的第二管芯分别设置在管芯接收通孔内。 第一粘合材料形成在第一模具和第二模具和基板之下，并且第二粘合材料填充在第一和第二模具之间的间隙中以及接收基板的贯穿孔的模具的侧壁。 此外，形成接合线以在第二接合焊盘和第一接触焊盘之间在第一接合焊盘和第一接触焊盘之间耦合。 在接合线，第一和第二管芯和基板上形成介电层。 在基板的下表面和第一和第二模具的背面上形成堆积层。

公开(公告)号：US20090027276A1

公开(公告)日：2009-01-29

申请号：US12149798

申请日：2008-05-08

Applicant: Ming-Tsan Tseng ,  Chun-Chih Yang ,  Yueh-Pi Huang ,  Chih-Ming Chen ,  Kuan-Sung Lee

Inventor： Ming-Tsan Tseng ,  Chun-Chih Yang ,  Yueh-Pi Huang ,  Chih-Ming Chen ,  Kuan-Sung Lee

IPC: H01Q1/38

CPC classification number: H01Q9/0407 ,  H01Q1/38

Abstract: A linear polarized patch antenna structure receives circular polarized signals and offsets polarization loss to improve receiving signals quality. The structure includes a body made of ceramic, a main plate is set on an upper end surface of the body, a ground plate is set on a lower end surface of the body and is insulated from the main plate, and a signal transmitting terminal goes through the body and electronically connects with the main plate. Thus, elements are miniaturized and electric demands of signals received by the antenna are satisfied.

Abstract translation: 线性极化贴片天线结构接收圆偏振信号并抵消偏振损耗，以改善接收信号质量。 该结构包括陶瓷体，主体设置在主体的上端面上，接地板设置在主体的下端面上，与主板绝缘，信号发送端子 通过身体与主板电子连接。 因此，元件小型化，并且满足由天线接收的信号的电力需求。

公开(公告)号：US07481529B1

公开(公告)日：2009-01-27

申请号：US11902672

申请日：2007-09-25

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: G02C1/00

CPC classification number: G02C5/02 ,  G02C1/06 ,  G02C11/08 ,  G02C2200/08

Abstract: A pair of glasses includes two lenses received in two lens receiving portions of a frame. A groove is defined in the frame and between tops of the lens receiving portions. Each lens receiving portion includes outer and rear stops for retaining the lenses. A movable stop includes two legs movably coupled with lower ends of inner sides of the lens receiving portions. The movable stop is movable between an engaged position in which a top portion of the movable stop is engaged with the groove and in which forward inclination of the lenses are stopped by the legs and a disengaged position in which the top portion of the movable stop is disengaged from the groove of the frame and in which insertion or removal of the lenses into or from the lens receiving portions is allowed.

Abstract translation: 一对眼镜包括接收在框架的两个透镜接收部分中的两个透镜。 在框架中和在透镜容纳部分的顶部之间限定凹槽。 每个透镜接收部分包括用于保持透镜的外部和后部止动件。 可动止动器包括可移动地与透镜接收部分的内侧的下端连接的两个腿。 可移动止动件可在可动止动件的顶部与凹槽接合的接合位置和透镜的向前倾斜被腿部停止的接合位置和可移动止动件的顶部的脱离位置 与框架的凹槽脱离，并且允许将透镜插入或移出透镜接收部分。

公开(公告)号：US20080116466A1

公开(公告)日：2008-05-22

申请号：US11641797

申请日：2006-12-20

Applicant: Chih-Ming Chen ,  Wen-Lung Su ,  Hsiang-Cheng Hsieh

Inventor： Chih-Ming Chen ,  Wen-Lung Su ,  Hsiang-Cheng Hsieh

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A high-powered diode holder and a package thereof are disclosed. The high-powered diode holder includes a base and a plurality of metal electrodes. The base is made of ceramic. In the interior part of one end of the base, there is a functional area that is indented inwards. In the functional area, there are a plurality of through-hole units and a plurality of conducting areas whose polarities are different. The second end of the base is connected with a heat-conducting base. The metal electrodes are individually connected with the base, and the metal electrodes are electrically connected with the corresponding conducting areas respectively. In the functional area, there are a plurality of LED chips that correspond to the through-hole units respectively. The LED chips and the conducting areas are connected with conducting-wires respectively, and a package resin element covers the functional areas of the base.

Abstract translation: 公开了一种高功率二极管保持器及其封装。 高功率二极管保持器包括基座和多个金属电极。 基座由陶瓷制成。 在底座一端的内部，有一个向内凹进的功能区域。 在功能区域中，存在多个通孔单元和极性不同的多个导电区域。 基座的第二端与导热基座连接。 金属电极与基座分别连接，金属电极分别与相应的导电区域电连接。 在功能区域中，分别对应于通孔单元的多个LED芯片。 LED芯片和导电区域分别与导线连接，封装树脂元件覆盖基座的功能区域。