公开(公告)号：US06808745B2

公开(公告)日：2004-10-26

申请号：US10225846

申请日：2002-08-22

Applicant: Zhihao Yang

Inventor： Zhihao Yang

IPC: C23C1600

CPC classification number: B81C1/0096 ,  B05D1/60 ,  B81B3/0005 ,  B81C2201/0176 ,  B81C2201/112 ,  B82Y30/00 ,  C09D4/00 ,  C08G77/24 ,  C08G77/04

Abstract: A method for coating a micro-electromechanical systems device with a silane coupling agent by a) mixing the silane coupling agent with a low volatile matrix material in a coating source material container; b) placing the micro-electromechanical systems device in a vacuum deposition chamber which in connection with the coating source material container; c) pumping the vacuum deposition chamber to a predetermined pressure; and maintaining the pressure of the vacuum deposition chamber for a period of time in order to chemically vapor deposit the silane coupling agent on the surface of the micro-electromechanical systems device.

Abstract translation: 一种通过以下步骤涂覆具有硅烷偶联剂的微机电系统装置的方法：a）将硅烷偶联剂与低挥发性基质材料混合在涂料源材料容器中; b）将微机电系统装置放置在与涂料源材料容器相连的真空沉积室中; c）将真空沉积室泵送至预定压力; 并且将真空沉积室的压力保持一段时间，以便在微机电系统装置的表面上化学气相沉积硅烷偶联剂。

公开(公告)号：US20040071863A1

公开(公告)日：2004-04-15

申请号：US10269682

申请日：2002-10-11

Inventor： Xiaoyang Zhu ,  Yongseok Jun ,  Hongwei Yan

IPC: B05D005/12 ,  C23C016/00

CPC classification number: C23C14/12 ,  B05D1/185 ,  B05D1/60 ,  B05D2401/90 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/112 ,  B82Y30/00 ,  B82Y40/00

Abstract: A chemical approach for the attachment of molecules on a surface of a MEMS device, preferably, to provide a monolayer film thereon of relatively low surface energy.

Abstract translation: 用于在MEMS器件的表面上附着分子的化学方法，优选地在其上提供具有相对低的表面能的单层膜。

公开(公告)号：US20040033372A1

公开(公告)日：2004-02-19

申请号：US10446583

申请日：2003-05-27

Inventor： Lutz Mueller ,  Kersten Kehr ,  Markus Ulm

IPC: B32B009/04

CPC classification number: B81B3/0005 ,  B05D1/62 ,  B05D5/083 ,  B81C2201/019 ,  B81C2201/112 ,  C09D4/00 ,  C09D183/08 ,  C23C28/00 ,  C23C28/42 ,  C23C28/44 ,  Y10T428/31663 ,  C08G77/24

Abstract: A micromechanical component includes an anti-adhesive layer, formed from at least one fluorine-containing silane, applied to at least parts of its surface for reducing surface forces. To increase mechanical and thermal load capacity, the anti-adhesive layer is provided as a multilayer coating which is formed from at least one metal oxide layer and at least one layer composed of at least one fluorine-containing silane.

Abstract translation: 微机械部件包括由至少一种含氟硅烷形成的防粘层，其被施加到其表面的至少部分以减小表面力。 为了增加机械和热负荷能力，抗粘剂层被提供为由至少一个金属氧化物层和至少一层由至少一种含氟硅烷组成的多层涂层。

公开(公告)号：US20040012061A1

公开(公告)日：2004-01-22

申请号：US10453933

申请日：2003-06-04

Inventor： Jason S. Reid ,  Nungavram S. Viswanathan

IPC: H01L021/00 ,  H01L029/82

CPC classification number: C09D4/00 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  B82Y30/00 ,  C08G77/00 ,  C08G77/04 ,  C08G77/24

Abstract: A micro-electromechanical device is formed on a substrate. The device has sliding, abrading or impacting surfaces. At least one of these surfaces is covered with an anti-stiction material. The anti-stiction material is provided from a slicon compound precursor (e.g. silane, silanol) or multiple silicon compound precursors. Preferably the precursor(s) is fluorinatednullmore preferably perfluorinated, and is deposited with a solvent as a low molecular weight oligomer or in monomeric form. Examples include silanes (fluorinated or not) with aromatic or polycyclic ring sturctures, and/or silanes (fluorinated or not) having alkenyl, alkynyl, epoxy or acrylate groups. Mixtures either or both of these groups with alkyl chain silanes (preferably fluorinated) are also contemplated.

Abstract translation: 在基板上形成微机电装置。 该装置具有滑动，研磨或冲击表面。 这些表面中的至少一个被抗静电材料覆盖。 抗粘性材料由Slico化合物前体（例如硅烷，硅烷醇）或多种硅化合物前体提供。 优选地，前体被氟化 - 更优选全氟化，并且以溶剂作为低分子量低聚物或以单体形式沉积。 实例包括具有芳族或多环结构的硅烷（氟化或非氟化），和/或具有烯基，炔基，环氧基或丙烯酸酯基团的硅烷（氟化或非氟化）。 这些基团中的一个或两个与烷基链硅烷（优选氟化）混合也是可以预料的。

公开(公告)号：US06674140B2

公开(公告)日：2004-01-06

申请号：US09771872

申请日：2001-01-29

Applicant: John R. Martin

Inventor： John R. Martin

IPC: H01L2984

CPC classification number: H01L21/3122 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02263 ,  H01L24/05 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

Abstract: This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.

Abstract translation: 本发明公开了一种在微加工结构上形成持久的抗静电表面的方法，同时它们仍然是晶片形式（即，在它们被分离成用于组装成包装的分立装置之前）。 该方法涉及材料的气相沉积以产生低粘度表面。 它还公开了有效赋予芯片抗静电性能的化学品。 这些包括聚苯基硅氧烷，硅烷醇封端的苯基硅氧烷和类似的材料。

公开(公告)号：US06656368B2

公开(公告)日：2003-12-02

申请号：US09445374

申请日：2000-03-02

Applicant: Martin Schoefthaler ,  Peter Hein ,  Helmut Skapa ,  Horst Muenzel

Inventor： Martin Schoefthaler ,  Peter Hein ,  Helmut Skapa ,  Horst Muenzel

IPC: H01L2100

CPC classification number: G01P15/0802 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  G01P1/023

Abstract: A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer beneath the movable element is removed so that the movable element becomes movable. After removal of the sacrificial layer, a protective layer is deposited on a surface of the movable element. Silicon oxide and/or silicon nitride is used for the protective layer.

Abstract translation: 一种用于制造微机械部件的方法，以及微机械部件，其中在牺牲层上制造可移动元件。 在随后的步骤中，去除可移动元件下面的牺牲层，使得可移动元件变得可移动。 在去除牺牲层之后，在可移动元件的表面上沉积保护层。 氧化硅和/或氮化硅用于保护层。

公开(公告)号：US06646314B2

公开(公告)日：2003-11-11

申请号：US10188684

申请日：2002-07-03

Applicant: Joachim Rudhard

Inventor： Joachim Rudhard

IPC: H01L2982

CPC classification number: B81B3/0008 ,  B81B3/0086 ,  B81B2201/0235 ,  B81C2201/112

Abstract: A method for producing a micromechanical structure, and a micromechanical structure having a movable structure and a stationary structure made of silicon. In the method for producing the micromechanical structure, in one process step, a superficial metal-silicide layer is produced in the movable structure and/or the stationary structure.

公开(公告)号：US20030099028A1

公开(公告)日：2003-05-29

申请号：US10151011

申请日：2002-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-ho Cho ,  Hyung-jae Shin ,  Woon-bae Kim

IPC: G02F001/29 ,  G02B026/08

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112

Abstract: The micro-mechanical structure includes an anti-stiction layer formed by plasma enhanced chemical vapor deposition. The anti-stiction layer is formed on only the area of a substrate other than the top of a movable structure and a part of an electrode that is subsequently bonded to a wire.

Abstract translation: 微机械结构包括通过等离子体增强化学气相沉积形成的抗静电层。 抗静电层仅形成在除了可移动结构的顶部之外的基底的区域和随后结合到线的电极的一部分上。

公开(公告)号：US20030098618A1

公开(公告)日：2003-05-29

申请号：US09996148

申请日：2001-11-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： David R. Greenberg ,  Hariklia Deligianni ,  Robert A. Groves ,  Christopher V. Jahnes ,  Jennifer L. Lund ,  Katherine L. Saenger ,  Richard P. Volant

IPC: H02H001/00

CPC classification number: B81B3/0016 ,  B81C2201/112 ,  H01H1/24 ,  H01H59/0009 ,  H01H2001/0089 ,  Y10T307/826 ,  Y10T307/911 ,  Y10T307/937

Abstract: A micro-electro mechanical switch having a restoring force sufficiently large to overcome stiction is described. The switch is provided with a deflectable conductive beam and multiple electrodes coated with an elastically deformable conductive layer. A restoring force which is initially generated by a single spring constant k0 upon the application of a control voltage between the deflectable beam and a control electrode coplanar to the contact electrodes is supplemented by adding to k0 additional spring constants k1, . . . , kn provided by the deformable layers, once the switch nears closure and the layers compress. In another embodiment, deformable, spring-like elements are used in lieu of the deformable layers. In an additional embodiment, the compressible layers or deformable spring-like elements are affixed to the deflecting beam facing the switch electrodes

Abstract translation: 描述了具有足够大以克服静止的恢复力的微电机械开关。 开关设置有可偏转的导电束和涂覆有可弹性变形的导电层的多个电极。 在施加可调光束和与接触电极共面的控制电极之间的控制电压时，最初由单个弹簧常数k0产生的恢复力通过增加k0个额外的弹簧常数k1来补充。 。 。 由可变形层提供的，一旦开关接近闭合并且层压缩。 在另一个实施例中，使用可变形的弹簧状元件代替可变形层。 在另外的实施例中，可压缩层或可变形的弹簧状元件固定到面向开关电极的偏转梁

公开(公告)号：US20020155711A1

公开(公告)日：2002-10-24

申请号：US10077422

申请日：2002-02-14

Inventor： Frank Fischer ,  Wilhelm Frey

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B81B3/0008 ,  B81B3/0086 ,  B81B2201/0235 ,  B81C2201/112

Abstract: A method for manufacturing a micromechanical part, having a plurality of components that move with respect to one another, from a substrate, with a conductive coating being applied to at least one facing surface of the plurality of components that move with respect to one another.

Abstract translation: 一种用于制造具有多个相对于彼此移动的部件的微机械部件的方法，其中导电涂层被施加到相对于彼此移动的多个部件的至少一个相对表面。