公开(公告)号：US06665194B1

公开(公告)日：2003-12-16

申请号：US09711038

申请日：2000-11-09

Applicant: Janak G. Patel ,  Dana J. Thygesen

Inventor： Janak G. Patel ,  Dana J. Thygesen

IPC: H05K700

CPC classification number: H01L23/49805 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/10704 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A substrate for supporting a semiconductor chip has area array connectors on at least two surfaces to provide a large number of connectors to the chip. At least one contact on one surface is not connected to a contact on the other surface through the substrate. Carriers, such as printed circuit boards are mounted to the two surfaces.

Abstract translation: 用于支撑半导体芯片的基板在至少两个表面上具有面阵列连接器，以向芯片提供大量连接器。 一个表面上的至少一个触点不通过基板连接到另一个表面上的触点。 诸如印刷电路板的载体安装在两个表面上。

公开(公告)号：US20030214800A1

公开(公告)日：2003-11-20

申请号：US10401103

申请日：2003-03-25

Inventor： Joseph Ted Dibene II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

Abstract translation: 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于在提供低阻抗的同时承受两个基板之间的机械公差。 互连。

公开(公告)号：US20030198033A1

公开(公告)日：2003-10-23

申请号：US10383028

申请日：2003-02-25

Inventor： Augusto P. Panella ,  John E. Lopata ,  James L. McGrath ,  Arindum Dutta

IPC: H05K007/10 ,  H05K007/06

CPC classification number: H05K1/0262 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

Abstract translation: 安装到电路板的处理器通过在处理器的与电路板相对的一侧安装用于处理器的电压调节器模块，通过低电感电路板迹线提供调节电压。 来自稳压器的电流通过调节器和处理器之间的一个或多个导体从一侧延伸到另一侧而提供给处理器。 通过将电压调节器放置在靠近负载的位置，减少了引脚长度的电感。 通过将电压调节器移动到相对侧，可以增加电路板处理器侧的电路板空间。

公开(公告)号：US20030183406A1

公开(公告)日：2003-10-02

申请号：US10428202

申请日：2003-04-30

Inventor： Joseph T. DiBene II ,  Edward J. Derian

IPC: H02G003/08

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704

Abstract: An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

Abstract translation: 组件包括具有微处理器的电子组件，该微处理器通过柔性导体组件耦合到功率转换组件。 柔性导体组件包括安装在载体中的多个弹簧导体。 所选择的弹簧导体与其他弹簧导体电磁耦合。 另外，每个弹簧导体提供多个导电路径。

公开(公告)号：US06618268B2

公开(公告)日：2003-09-09

申请号：US09801437

申请日：2001-03-08

Applicant: Joseph T. Dibene, II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

Inventor： Joseph T. Dibene, II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

IPC: H01R1216

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

Abstract translation: 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。

公开(公告)号：US06611435B2

公开(公告)日：2003-08-26

申请号：US10042773

申请日：2002-01-08

Applicant: Pavan Kumar ,  Lilly Huang

Inventor： Pavan Kumar ,  Lilly Huang

IPC: H05K702

CPC classification number: H05K1/0262 ,  G06F1/26 ,  H05K1/0231 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2201/10704

Abstract: A power delivery device includes a socket to couple and deliver power to an electronic component. A voltage control sensor is coupled to the socket to sense an output voltage at the socket and to provide negative feedback control. An impedance of the socket and an associated baseboard is incorporated into the negative feedback control and may help compensate for voltage droop in the output voltage.

Abstract translation: 电力输送装置包括用于耦合并向电子部件输送电能的插座。 电压控制传感器耦合到插座以感测插座处的输出电压并提供负反馈控制。 插座和相关底板的阻抗被并入到负反馈控制中，并且可以帮助补偿输出电压中的电压下降。

公开(公告)号：US06556455B2

公开(公告)日：2003-04-29

申请号：US10022454

申请日：2001-10-30

Applicant: Joseph T. Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

Inventor： Joseph T. Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC: H01R1216

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract translation: 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并且允许大量的电流从一个基板静态或动态地从一个基板传递到下一个基板。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US06512180B2

公开(公告)日：2003-01-28

申请号：US10005158

申请日：2001-12-07

Applicant: Hisatsuna Nakagawa

Inventor： Hisatsuna Nakagawa

IPC: H05K102

CPC classification number: H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/111 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A printed-wiring board to be mounted with a circuit element includes a plurality of pads which assist in an electric connection between the circuit element and a wiring pattern, at least one of said plurality of pads being used to serve as an identifier for identifying the printed-wiring board.

Abstract translation: 要安装有电路元件的印刷电路板包括多个辅助电路元件和布线图形之间的电连接的焊盘，所述多个焊盘中的至少一个焊盘用作标识符 印刷电路板。

公开(公告)号：US20030003780A1

公开(公告)日：2003-01-02

申请号：US09764551

申请日：2001-01-18

Inventor： Kenneth W. Johnson ,  Brent A. Holcombe

IPC: H05K001/00

CPC classification number: H05K3/3447 ,  G01R1/0483 ,  H05K1/189 ,  H05K2201/10325 ,  H05K2201/10704 ,  H05K2203/0415

Abstract: In a preferred embodiment, the present invention comprises an unsealed BGA socket, nail head pins which can be inserted flush into an pin carrier to produce a PGA header, a Flex circuit assembly comprising a piece of flexible circuit with various passive resistors and connectors attached and solder preforms used to solder the flex assembly to the pin grid array.

Abstract translation: 在优选实施例中，本发明包括一个未密封的BGA插座，钉头销可以平齐地插入销托架中以产生PGA接头，Flex电路组件包括一片带有各种被动电阻器和连接器的柔性电路， 用于将柔性组件焊接到针栅阵列的焊料预成型件。

公开(公告)号：US20020196614A1

公开(公告)日：2002-12-26

申请号：US10201384

申请日：2002-07-23

Applicant: INCEP Technologies, Inc.

Inventor： Joseph T. DiBene II ,  David H. Hartke ,  James J. Hjerpe Kaskade ,  Carl E. Hoge

IPC: H05K001/14 ,  H05K007/20 ,  H01R012/04

CPC classification number: H01L23/433 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.