公开(公告)号：US07701144B2

公开(公告)日：2010-04-20

申请号：US11858701

申请日：2007-09-20

Applicant: Hironori Tsukamoto ,  Noriaki Ito

Inventor： Hironori Tsukamoto ,  Noriaki Ito

IPC: B60Q1/02

CPC classification number: B60Q1/2696 ,  B60Q1/0094 ,  F21S43/14 ,  F21S43/195 ,  H05K1/0284 ,  H05K1/14 ,  H05K1/148 ,  H05K1/189 ,  H05K3/202 ,  H05K3/328 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/10287 ,  H05K2201/10651 ,  H05K2203/302

Abstract: A vehicular lamp includes a lamp body; a plurality of LED light sources disposed inside a lamp chamber formed by a front cover positioned in front of the lamp body; and a lighting circuit portion positioned behind the LED light sources. The LED light source is electrically connected to a conductive bus bar, and forms a light-emitting surface at a position opposite the front cover. The lighting circuit portion is formed on the back side of the light-emitting surface of the LED light source with respect to the front cover, and a circuit element thereof is electrically connected to the conductive bus bar. The conductive bus bar to which the LED light source is connected and the conductive bus bar to which the circuit element is connected are conductively connected.

Abstract translation: 车灯包括灯体; 多个LED光源，其设置在由位于灯体前方的前盖形成的灯室内; 以及位于LED光源后面的照明电路部分。 LED光源电连接到导电母线，并且在与前盖相对的位置处形成发光表面。 照明电路部分相对于前盖形成在LED光源的发光表面的背面上，并且其电路元件电连接到导电母线。 连接有LED光源的导电母线和连接有电路元件的导电母线导电连接。

公开(公告)号：US07586446B2

公开(公告)日：2009-09-08

申请号：US11061149

申请日：2005-02-18

Applicant: Isao Sakama ,  Minoru Ashizawa

Inventor： Isao Sakama ,  Minoru Ashizawa

IPC: H01Q1/24

CPC classification number: H05K1/16 ,  H01Q1/2225 ,  H01Q9/285 ,  H01Q19/24 ,  H05K1/0266 ,  H05K1/184 ,  H05K3/403 ,  H05K2201/10098 ,  H05K2201/10446 ,  H05K2201/10651

Abstract: To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surface 1a and a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.

Abstract translation: 为了在不牺牲无线IC标签的传输距离的情况下提高电子部件封装效率，在印刷电路板的正面侧形成有凹部。 将IC芯片放置在凹部中，使得IC芯片不从印刷线路板的前侧表面，第一主表面1a和第二主表面突出。 天线的天线元件分别形成在IC芯片的相对侧的前侧表面上，并且天线连接到IC芯片。 天线是长度等于由天线辐射的无线电波的波长的一半的偶极子天线。

公开(公告)号：US07561442B2

公开(公告)日：2009-07-14

申请号：US11751227

申请日：2007-05-21

Applicant: Yasuyuki Fukumoto

Inventor： Yasuyuki Fukumoto

IPC: H05K7/02

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

Abstract translation: 电子部件保持器包括保持器主体和电线保持部。 保持器本体包括形成在保持器主体的顶面中的多个第一槽和形成在保持器主体的后表面中的多个第二槽。 第一凹槽和第二凹槽构造成接收电子部件的引线。 引线被配置为弯曲以设置在第二凹槽中的一个中。 背面与顶面相交。 电线保持部设置在保持体上。 电线保持部分构造成接合引线以将导线保持在第二凹槽中。

公开(公告)号：US20090078460A1

公开(公告)日：2009-03-26

申请号：US12284036

申请日：2008-09-17

Applicant: Yong Dong ,  Jiebing Pan ,  Tieming Luo

Inventor： Yong Dong ,  Jiebing Pan ,  Tieming Luo

IPC: H01L23/48

CPC classification number: H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/2036 ,  H05K2203/167 ,  H05K2203/304

Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.

Abstract translation: 本申请公开了一种壳体和相应的安装装置，用于在将元件焊接在电路板上的工艺流程期间保护元件的销钉熔化，同时节省了将元件焊接在电路板上所需的面积。 壳体包括设置有至少一个开口的中空主体。

公开(公告)号：US20090057850A1

公开(公告)日：2009-03-05

申请号：US11850526

申请日：2007-09-05

Applicant: Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

Inventor： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

IPC: H01L33/00 ,  H01L21/768 ,  H01L23/495

CPC classification number: H05K3/3426 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/15747 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10848 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

Abstract translation: 公开了诸如LED的封装电路元件及其制造方法。 封装电路元件包括引线框架，成型体和容纳电路元件的管芯。 引线框架具有第一和第二引线，每个引线具有第一和第二部分。 成形体围绕每个引线的第一部分，并且该裸片与第一和第二引线的第一部分上的第一引线和第二引线电连接。 第一和第二引线中的每一个的第二部分基本上平行于主体的相对的侧表面，并且包括阻止熔融焊料润湿部件与该引线的第一部分之间的每个引线的第二部分的一部分的特征 同时允许熔融焊料润湿第二部分的剩余表面。

公开(公告)号：US20090046469A1

公开(公告)日：2009-02-19

申请号：US12191406

申请日：2008-08-14

Applicant: Ching-Fu Yang ,  Chich-Hua Shen ,  Lei-Wei Tseng

Inventor： Ching-Fu Yang ,  Chich-Hua Shen ,  Lei-Wei Tseng

IPC: F21V7/00

CPC classification number: F21V19/0035 ,  F21K9/00 ,  F21V19/0055 ,  F21V29/71 ,  F21V29/717 ,  F21V29/76 ,  F21V29/85 ,  F21Y2115/10 ,  H05K1/056 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10651

Abstract: A light emitting diode (LED) module is disclosed. The LED module includes a base, a LED component, a pressing piece, and a plurality of screws. The base has a top surface and a positioning hole on the top surface. The LED component has a bottom surface and includes a positioning protrusion on the bottom surface. Wherein after the LED component is disposed on the base, the positioning protrusion is coupled with the positioning hole to position the LED component at the base. A pin of the LED component is located between the pressing piece and the base. The screws are used to screw the pressing member on the base.

公开(公告)号：US20080305660A1

公开(公告)日：2008-12-11

申请号：US11845832

申请日：2007-08-28

Applicant: Ya Cao ,  Qi-Fei Zhao

Inventor： Ya Cao ,  Qi-Fei Zhao

IPC: H01R12/00

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10651 ,  Y02P70/611

Abstract: A display and a circuit device thereof are disclosed. The display includes a circuit device and a panel electrically connected to the circuit device. The circuit device includes a printed circuit board and an electronic device. The printed circuit board includes a first conducting pad set. The first conducting pad set includes a plurality of pads electrically connected to each other. The electronic component includes a first connecting terminal electrically connected to at least one of the pads.

Abstract translation: 公开了一种显示器及其电路装置。 显示器包括电路装置和电连接到电路装置的面板。 电路装置包括印刷电路板和电子装置。 印刷电路板包括第一导电垫组。 第一导电焊盘组包括彼此电连接的多个焊盘。 电子部件包括电连接到至少一个焊盘的第一连接端子。

公开(公告)号：US20080198565A1

公开(公告)日：2008-08-21

申请号：US11675716

申请日：2007-02-16

Applicant: Sheldon Lynn Horst ,  John Steven Wilson

Inventor： Sheldon Lynn Horst ,  John Steven Wilson

IPC: H05K7/14

CPC classification number: H01R4/02 ,  H01R12/707 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49117

Abstract: A surface mount device having a surface mount foot and a method for making the same is disclosed. The method includes providing a piece of pre-plated conductive stock of a conductive base material and a corrosion-resistant conductive plating material different from the conductive base material at least partially overlying the conductive base material. The stock is cut and formed to create a surface mount device having a surface mount foot extending therefrom. The surface mount foot has a top surface, a plated bottom surface and an at least one unplated side surface intermediate the top and bottom surfaces. The plated bottom surface is swaged to create a new plated coined edge surface intermediate the unplated side surface and the plated bottom surface of the surface mount foot.

Abstract translation: 公开了一种具有表面安装底座的表面安装装置及其制造方法。 该方法包括提供导电基材的一块预镀导电原料和至少部分地覆盖导电基材的不同于导电基材的耐腐蚀导电电镀材料。 切割并形成原料以形成具有从其延伸的表面安装脚的表面安装装置。 表面安装脚具有顶表面，电镀底表面和位于顶表面和底表面之间的至少一个未镀层侧表面。 电镀底表面被锻压，以在表面安装脚的未镀层侧表面和镀层底表面之间产生新的镀层创面边缘表面。

公开(公告)号：US20080106898A1

公开(公告)日：2008-05-08

申请号：US11936501

申请日：2007-11-07

Applicant: Jin Hee PARK ,  Jung Tae KANG ,  Jin Ho HA ,  Hyun Chul BAE ,  Joo Young KIM

Inventor： Jin Hee PARK ,  Jung Tae KANG ,  Jin Ho HA ,  Hyun Chul BAE ,  Joo Young KIM

IPC: F21V21/00 ,  H01J9/00

CPC classification number: F21V19/0025 ,  G02F1/133603 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/182 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2201/10878 ,  H01L2924/00014

Abstract: A light source unit including light emitting diodes mounted on a printed circuit board by not using a soldering method but a fitting method, and a backlight unit and liquid crystal display including the light source unit. The light source unit includes light emitting diodes including lead terminals and a printed circuit board including a fitting hole. Each of the lead terminals includes a base part and a fitting part protruding from the base part. The fitting part of the light emitting diode is fitted into the fitting hole of the printed circuit board and so that the light emitting diode is mounted on the printed circuit board.

Abstract translation: 一种光源单元，包括通过不使用焊接方法而不是使用拟合方法安装在印刷电路板上的发光二极管，以及包括该光源单元的背光单元和液晶显示器。 光源单元包括包括引线端子和包括装配孔的印刷电路板的发光二极管。 每个引线端子包括基部和从基部突出的嵌合部。 发光二极管的装配部分装配到印刷电路板的装配孔中，使得发光二极管安装在印刷电路板上。

公开(公告)号：US07365957B2

公开(公告)日：2008-04-29

申请号：US11703171

申请日：2007-02-07

Applicant: Masaaki Togashi ,  Kentaro Ushioda

Inventor： Masaaki Togashi ,  Kentaro Ushioda

IPC: H01G4/228 ,  H01G2/20

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.

Abstract translation: 陶瓷电容器包括陶瓷烧结体和形成在陶瓷烧结体的外表面上的第一和第二端电极。 第一端子电极通过第一金属端子电连接到形成在基板上的焊盘。 第一金属端子具有机械地连接到第一端子电极的第一电容器连接部分，机械地连接到焊盘的第一端子部分和将第一电容器连接部分和第一端子部分彼此电连接的第一中间部分。 第一金属端子的第一电容器连接部分平行于基板。