公开(公告)号：US08367553B2

公开(公告)日：2013-02-05

申请号：US12962055

申请日：2010-12-07

Applicant: Wei-Che Tsao ,  Wen-Chin Lin

Inventor： Wei-Che Tsao ,  Wen-Chin Lin

IPC: H01L21/306

CPC classification number: H01L21/76898 ,  H01L21/7684

Abstract: A method for manufacturing TSVs comprises following steps: A stack structure having a substrate, an ILD layer and a dielectric stop layer is provided, in which an opening penetrating through the ILD layer and the dialectic stop layer and further extending into the substrate is formed. After an insulator layer and a metal barrier are formed on the stack structure, a top metal layer is formed on the stack structure to fulfill the opening. A first planarization process stopping on the metal barrier is conducted, wherein the first planarization process has a polishing rate for removing the metal barrier less than that for removing the top metal layer. A second planarization process stopping on the dielectric stop layer is conducted, wherein the second planarization process has a polishing rate for removing the insulator layer greater than that for removing the dielectric stop layer. The dielectric stop layer is than removed.

Abstract translation: 制造TSV的方法包括以下步骤：提供具有基板，ILD层和电介质停止层的堆叠结构，其中形成穿透ILD层和辩证阻止层并进一步延伸到基板中的开口。 在堆叠结构上形成绝缘体层和金属屏障之后，在堆叠结构上形成顶部金属层以实现开口。 进行停止在金属屏障上的第一平面化处理，其中第一平面化工艺具有除去金属屏障的抛光速率小于除去顶部金属层的抛光速率。 进行停止在电介质停止层上的第二平坦化工艺，其中第二平坦化工艺具有用于除去绝缘体层的抛光速率大于去除电介质停止层的抛光速率。 电介质停止层除去。

公开(公告)号：US20130011938A1

公开(公告)日：2013-01-10

申请号：US13176790

申请日：2011-07-06

Applicant: Wei-Che TSAO ,  Chia-Lin Hsu ,  Jen-Chieh Lin ,  Teng-Chun Tsai ,  Hsin-Kuo Hsu ,  Ya-Hsueh Hsieh ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Wen-Chin Lin ,  Yung-Lun Hsieh

Inventor： Wei-Che TSAO ,  Chia-Lin Hsu ,  Jen-Chieh Lin ,  Teng-Chun Tsai ,  Hsin-Kuo Hsu ,  Ya-Hsueh Hsieh ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Wen-Chin Lin ,  Yung-Lun Hsieh

IPC: H01L21/66 ,  H01L21/306 ,  H01L21/304

CPC classification number: H01L21/31053 ,  H01L21/3212 ,  H01L21/76898 ,  H01L22/12 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing TSVs, wherein the method comprises several steps as follows: A stack structure having a substrate and an ILD layer (inter layer dielectric layer) is provided, in which an opening penetrating through the ILD layer and further extending into the substrate is formed. After an insulator layer and a metal barrier layer are formed on the stack structure and the sidewalls of the opening, a top metal layer is then formed on the stack structure to fulfill the opening. A first planarization process stopping on the barrier layer is conducted to remove a portion of the top metal layer. A second planarization process stopping on the ILD layer is subsequently conducted to remove a portion of the metal barrier layer, a portion of the insulator layer and a portion of the top metal layer, wherein the second planarization process has a polishing endpoint determined by a light interferometry or a motor current.

Abstract translation: 一种制造TSV的方法，其中该方法包括以下几个步骤：提供具有基板和ILD层（层间电介质层）的堆叠结构，其中穿透ILD层并进一步延伸到基板中的开口是 形成。 在堆叠结构和开口的侧壁上形成绝缘体层和金属阻挡层之后，在堆叠结构上形成顶部金属层以实现开口。 进行停止在阻挡层上的第一平面化处理以去除顶部金属层的一部分。 随后进行停止在ILD层上的第二平坦化处理以去除金属阻挡层的一部分，绝缘体层的一部分和顶部金属层的一部分，其中第二平坦化工艺具有由光线确定的抛光终点 干涉测量或电机电流。

公开(公告)号：US08350380B2

公开(公告)日：2013-01-08

申请号：US13346641

申请日：2012-01-09

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H01L21/00

CPC classification number: H01L23/49531 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/14 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4847 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract translation: 引线框封装包括具有四个一体的向外延伸的细长条的管芯焊盘; 沿所述管芯焊盘的周边布置的多个引线; 与所述管芯焊盘分离并与所述多个引线隔离的单独焊盘段; 安装在所述管芯焊盘的上侧的半导体管芯，其中，所述半导体管芯包含与所述多个引线引线接合的第一接合焊盘和与所述独立焊盘区段焊接的第二接合焊盘; 以及封装半导体管芯的模塑料，管芯焊盘的上侧，第一悬挂焊盘段和多个引线的内部。

公开(公告)号：US08349028B2

公开(公告)日：2013-01-08

申请号：US12591236

申请日：2009-11-13

Applicant: Wen-Chin Lin ,  Chien-Wen Lee

Inventor： Wen-Chin Lin ,  Chien-Wen Lee

IPC: C09B62/04

CPC classification number: C09B62/085 ,  C09B62/043 ,  C09B62/06 ,  C09B62/09 ,  C09B62/095 ,  C09B62/10 ,  C09B67/0072 ,  C09B67/0073

Abstract: The present invention relates to a reactive printing dye composition, which includes: (a) at least one reactive dye; (b) an organic buffer; and (c) a mirabilite or a dispersant. The reactive printing dye composition of the present invention is capable for being used in the fabric-dyeing, for example, dyeing of cotton, hemp, silk, rayon, wool, blending, etc. The reactive printing dye composition of the present invention is advantageous in high pH value stability, high storage stability, and reduced degradation in dyeing strength. In addition, the present invention further provides an aqueous reactive printing dye composition.

Abstract translation: 本发明涉及一种反应性印花染料组合物，其包括：（a）至少一种活性染料; （b）有机缓冲液; 和（c）芒硝或分散剂。 本发明的活性印刷染料组合物能够用于织物染色，例如棉，麻，丝，人造丝，羊毛，混纺等的染色。本发明的反应性印花染料组合物是有利的 在高pH值稳定性，高储存稳定性和染色强度降低降低。 此外，本发明还提供一种水性反应性印花染料组合物。

公开(公告)号：US20120327360A1

公开(公告)日：2012-12-27

申请号：US13486096

申请日：2012-06-01

Applicant: Yung-Chin LIN

Inventor： Yung-Chin LIN

IPC: G02C5/22 ,  G02C5/14

CPC classification number: G02C5/2209

Abstract: The present invention is to provide an eyeglass temple structure, which includes a temple having a plate-shaped body formed with a through hole, a temple connector being extended with a fixing ring, and a pivotal hinge structure including a cylindrical pivot body and a fastening insert. The pivot body has a middle section formed with a groove for engaging with the fixing ring, and is axially formed with an aperture. The fastening insert is engaged in the aperture and can pivot with the pivot body, so as to form the pivotal hinge structure having replaceable elements for pivotally connecting the temple to the temple connector and allowing the temple to pivot with respect to the temple connector. Thus, the pivotal hinge structure can be easily engaged with the fixing ring via the groove of the pivot body and inserted in the through hole of the temple.

Abstract translation: 本发明提供一种眼镜镜腿结构，其包括具有形成有通孔的板状体的镜腿，具有固定环延伸的镜腿连接器以及包括圆柱形枢轴体和紧固件的枢转铰链结构 插。 枢轴体具有形成有用于与固定环接合的凹槽的中间部分，并且轴向地形成有孔。 紧固插入件接合在孔中并且可以与枢轴体枢转，以便形成具有用于将镜腿枢转地连接到镜腿连接器并允许镜腿相对于镜腿连接器枢转的可替换元件的枢转铰链结构。 因此，枢转铰链结构可以容易地通过枢轴体的凹槽与固定环接合并插入到凸块的通孔中。

公开(公告)号：US20120322246A1

公开(公告)日：2012-12-20

申请号：US13162813

申请日：2011-06-17

Applicant: Sheng-Hsiung WANG ,  Hsien-Chin LIN ,  Yuan-Ching PENG ,  Chia-Pin LIN ,  Fan-Yi HSU ,  Ya-Jou HSIEH

Inventor： Sheng-Hsiung WANG ,  Hsien-Chin LIN ,  Yuan-Ching PENG ,  Chia-Pin LIN ,  Fan-Yi HSU ,  Ya-Jou HSIEH

IPC: H01L21/20 ,  H01L21/311 ,  H01L21/3205

CPC classification number: H01L21/823857 ,  H01L21/823842 ,  H01L29/66545

Abstract: A method for manufacturing the integrated circuit device including, providing a substrate having a first region and a second region. Forming a dielectric layer over the substrate in the first region and the second region. Forming a sacrificial gate layer over the dielectric layer. Patterning the sacrificial gate layer and the dielectric layer to form gate stacks in the first and second regions. Forming an ILD layer within the gate stacks in the first and second regions. Removing the sacrificial gate layer in the first and second regions. Forming a protector over the dielectric layer in the first region; and thereafter removing the dielectric layer in the second region.

Abstract translation: 一种用于制造集成电路器件的方法，包括提供具有第一区域和第二区域的衬底。 在第一区域和第二区域中的衬底上形成介电层。 在电介质层上形成牺牲栅极层。 对牺牲栅极层和电介质层进行图案化以在第一和第二区域中形成栅极叠层。 在第一和第二区域内的栅堆叠内形成ILD层。 去除第一和第二区域中的牺牲栅极层。 在第一区域中的介电层上形成保护膜; 然后除去第二区域中的电介质层。

公开(公告)号：US20120313107A1

公开(公告)日：2012-12-13

申请号：US13368662

申请日：2012-02-08

Applicant: Yi CHANG ,  Chia-Hua CHANG ,  Yueh-Chin LIN ,  Yu-Kong CHEN ,  Ting-En SHIE

Inventor： Yi CHANG ,  Chia-Hua CHANG ,  Yueh-Chin LIN ,  Yu-Kong CHEN ,  Ting-En SHIE

IPC: H01L29/20

CPC classification number: H01L29/7786 ,  H01L29/2003 ,  H01L29/452

Abstract: A semiconductor device includes a main body made of a GaN-based semiconductor material, and at least one electrode structure. The electrode structure includes an ohmic contact layer that is formed on the main body, a buffer layer that is formed on the ohmic contact layer opposite to the main body, and a circuit layer that is made of a copper-based material and that is formed on the buffer layer opposite to the ohmic contact layer. The ohmic contact layer is made of a material selected from titanium, aluminum, nickel, and alloys thereof. The buffer layer is made of a material different from the material of the ohmic contact layer and selected from titanium, tungsten, titanium nitride, tungsten nitride, and combinations thereof.

Abstract translation: 半导体器件包括由GaN基半导体材料制成的主体和至少一个电极结构。 电极结构包括形成在主体上的欧姆接触层，形成在与主体相反的欧姆接触层上的缓冲层，以及由铜基材料制成并形成的电路层 在与欧姆接触层相反的缓冲层上。 欧姆接触层由选自钛，铝，镍及其合金的材料制成。 缓冲层由不同于欧姆接触层材料的材料制成，选自钛，钨，氮化钛，氮化钨及其组合。

公开(公告)号：US08307274B2

公开(公告)日：2012-11-06

申请号：US12180599

申请日：2008-07-28

Applicant: Kuo-Lung Chang ,  Yi-Ju Chen ,  Hsing-Yung Wang ,  Li-Chin Lin

Inventor： Kuo-Lung Chang ,  Yi-Ju Chen ,  Hsing-Yung Wang ,  Li-Chin Lin

IPC: G06F17/00

CPC classification number: G06F17/217

Abstract: A method for converting a computerized briefing file to a PC-less briefing file is disclosed and comprises the steps of: presenting the computerized briefing file via a briefing software, wherein the computerized briefing file has a plurality of pages of briefing data; capturing the plurality of frames of the presented page of briefing data while presenting each page of briefing data, wherein if a difference block is existed between the last frame and the next frame, the difference block being stored in the PC-less file, otherwise, to presenting the next frame; judging whether the pagination of the presented frame is changed or not, if not, continuously capturing, comparing and storing the present page of briefing data, otherwise, capturing, comparing and storing the next page of briefing data; and such steps are not stopped until the last page of briefing data has being done.

Abstract translation: 公开了一种将计算机简报文件转换为无PC简报文件的方法，包括以下步骤：通过简报软件呈现计算机化简报文件，其中计算机简报文件具有多页简报数据; 在呈现简报数据的每个页面的同时捕获所呈现的简报数据页面的多个帧，其中如果在最后一帧和下一帧之间存在差分块，则差分块被存储在无PC文件中，否则， 呈现下一帧; 判断所呈现的帧的分页是否改变，如果不是，连续地捕获，比较和存储简报数据的当前页面，否则，捕获，比较和存储简报数据的下一页; 并且直到简报数据的最后一页已经完成，这些步骤才停止。

公开(公告)号：US08259072B2

公开(公告)日：2012-09-04

申请号：US11867768

申请日：2007-10-05

Applicant: Chin-Lin Hsieh ,  Jr-Wei Lian ,  Shun-Nan Liou ,  Ming-Jye Tsai

Inventor： Chin-Lin Hsieh ,  Jr-Wei Lian ,  Shun-Nan Liou ,  Ming-Jye Tsai

IPC: G06F3/02 ,  G09G5/00

CPC classification number: A63F13/22 ,  A63F13/06 ,  A63F13/211 ,  A63F13/23 ,  A63F2300/1018 ,  A63F2300/105

Abstract: An input control apparatus and an interactive system using the same are disclosed. The input control apparatus comprises: a switch unit, for selecting an input mode for the input control apparatus selected from the group consisting of a mouse mode, a joystick mode, a keyboard mode and the combination thereof; an interface unit, for generating an input signal according to the input mode selected by the switch unit; a remote control unit, for generating and thus transmitting a control signal according to the input mode and the input signal. By transmitting the control signals of two aforesaid input control apparatuses to an electronic device, such as a computer, an interactive gaming device or an interactive multimedia device, two such input control apparatuses can be integrated as a handheld apparatus with a left-hand unit and a right-hand unit for meeting the control requirements of a comparatively more complicated game executing on the electronic device. However, for those less complicated game, the two input control apparatuses can be configured as independent devices to be operated by different users. Thereby, users are able to interact with the electronic device.

Abstract translation: 公开了一种输入控制装置和使用该控制装置的交互式系统。 输入控制装置包括：开关单元，用于从由鼠标模式，操纵杆模式，键盘模式及其组合组成的组中选择输入控制装置的输入模式; 接口单元，用于根据由开关单元选择的输入模式生成输入信号; 遥控单元，用于根据输入模式和输入信号产生和发送控制信号。 通过将两个上述输入控制装置的控制信号发送到诸如计算机，交互式游戏装置或交互式多媒体装置之类的电子装置，可将两个这样的输入控制装置集成为具有左手装置的手持装置， 用于满足在电子设备上执行的比较复杂的游戏的控制要求的右侧单元。 然而，对于那些较不复杂的游戏，两个输入控制装置可以被配置为由不同用户操作的独立设备。 因此，用户能够与电子设备进行交互。

公开(公告)号：US20120126418A1

公开(公告)日：2012-05-24

申请号：US12954397

申请日：2010-11-24

Applicant: Chien-Te Feng ,  Shih-Chin Lin

Inventor： Chien-Te Feng ,  Shih-Chin Lin

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/481 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81418 ,  H01L2224/8142 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81463 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81473 ,  H01L2224/81476 ,  H01L2224/81478 ,  H01L2224/83385 ,  H01L2224/85409 ,  H01L2224/85411 ,  H01L2224/85413 ,  H01L2224/85416 ,  H01L2224/85418 ,  H01L2224/8542 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85457 ,  H01L2224/8546 ,  H01L2224/85463 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85473 ,  H01L2224/85476 ,  H01L2224/85478 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit (IC) device includes a polymer substrate having a topside surface and a bottomside surface opposite the topside surface, a plurality of through-holes that extend from the topside surface to the bottomside surface, and a plurality of bottom metal pads on the bottomside surface positioned over the plurality of through-holes. At least one IC die having an active topside including a plurality of bond pads and a second side is affixed to the topside surface. Bonding features are coupled to the plurality of bond pads for coupling respective ones of the plurality of bond pads to the plurality bottom metal pads. The bonding features extend into the through-holes to contact the bottom metal pads.

Abstract translation: 集成电路（IC）装置包括具有顶侧表面和与顶侧表面相对的底部表面的聚合物基板，从顶侧表面延伸到底部表面的多个通孔，以及多个底部金属焊盘 底部表面定位在多个通孔上。 具有包括多个接合焊盘的活动顶面和第二侧的至少一个IC管芯固定到顶侧表面。 接合特征耦合到多个接合焊盘，用于将多个接合焊盘中的相应接合焊盘连接到多个底部金属焊盘。 接合特征延伸到通孔中以接触底部金属焊盘。