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    Semiconductor device and method of manufacturing the same
    21.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US07663219B2

    公开(公告)日：2010-02-16

    申请号：US11978370

    申请日：2007-10-29

    Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC: H01L23/48

    CPC classification number: H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    Abstract translation: 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
    22.
    发明授权
    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
    半导体封装的印刷电路板和使用其的半导体封装的安装方法

    公开(公告)号：US07576437B2

    公开(公告)日：2009-08-18

    申请号：US11598755

    申请日：2006-11-14

    Applicant: Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    Inventor： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    IPC: H01L23/48 ,  H01L23/495

    CPC classification number: H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

    Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

    Abstract translation: 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。

    Apparatus for inspecting a semiconductor device
    24.
    发明申请
    Apparatus for inspecting a semiconductor device 审中-公开
    用于检查半导体器件的装置

    公开(公告)号：US20070189451A1

    公开(公告)日：2007-08-16

    申请号：US11703249

    申请日：2007-02-07

    Applicant: Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han

    Inventor： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han

    IPC: G01N23/06 ,  G01F1/66

    CPC classification number: G01N21/95607 ,  H01L2224/16225

    Abstract: An apparatus for inspecting a semiconductor device may include an external image detector to acquire an exterior image of the semiconductor device, an internal image detector to acquire an interior image of the semiconductor device, and a controller to compare the acquired images with respective references. The apparatus may both inspect the exterior and the interior of the semiconductor device.

    Abstract translation: 用于检查半导体器件的装置可以包括：外部图像检测器，用于获取半导体器件的外部图像;内部图像检测器，用于获取半导体器件的内部图像;以及控制器，用于将获取的图像与各自的参考值进行比较。 该装置可以检查半导体器件的外部和内部。

    Open socket
    26.
    发明授权
    Open socket 失效
    打开插座

    公开(公告)号：US07061768B2

    公开(公告)日：2006-06-13

    申请号：US10868976

    申请日：2004-06-17

    Applicant: Dong-Chun Lee ,  Byung-Man Kim ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Young-Soo Lee

    Inventor： Dong-Chun Lee ,  Byung-Man Kim ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Young-Soo Lee

    IPC: H05K5/03

    CPC classification number: H01R13/2471 ,  H01R13/111

    Abstract: An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.

    Abstract translation: 可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。

    Method and apparatus for circulating pallets in an elevator unit of the module IC handler
    28.
    发明授权
    Method and apparatus for circulating pallets in an elevator unit of the module IC handler 失效
    在模块IC处理机的电梯单元中循环托盘的方法和装置

    公开(公告)号：US06629812B1

    公开(公告)日：2003-10-07

    申请号：US09455467

    申请日：1999-12-06

    Applicant: Sang Soo Lee ,  Wan Gu Le ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

    Inventor： Sang Soo Lee ,  Wan Gu Le ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

    IPC: B65G6000

    CPC classification number: B65G65/00 ,  G01R31/2808 ,  H01L21/67778

    Abstract: A module IC handler used for testing module Ics is disclosed in which the handler enables loading and unloading operations for module ICs, without further elevating pallet over an installation plate, and provides sequential transferring operations for the pallet on which test or customer tray is placed. To this end, after all module Ics 1 are loaded from the test tray 6 exposed to the loading or unloading position 19 or 26 by the loading and unloading elevator units 18a, 18b, or the test-finished module Ics are filled in the customer tray 17, the pallet 5 is moved to a rotation position 30 by a transfer 31, and then can be circulated to an upper side of the loading or unloading elevation plate 36 by the downer 32.

    Abstract translation: 公开了用于测试模块Ic的模块IC处理器，其中处理器能够对模块IC进行加载和卸载操作，而不需要在安装板上进一步提升托盘，并为放置测试或客户托盘的托盘提供顺序传送操作。 为此，在所有模块Ics 1从装载和卸载电梯单元18a，18b暴露于装载或卸载位置19或26的测试托盘6装载之后，或者测试完成的模块Ics填充在顾客托盘 如图17所示，托板5通过转移件31移动到旋转位置30，然后可以通过下降器32循环到装载或卸载升降板36的上侧。

    Method for handling a module IC and a carrier of a module IC handler
    29.
    发明授权
    Method for handling a module IC and a carrier of a module IC handler 失效
    用于处理模块IC和模块IC处理程序的载体的方法

    公开(公告)号：US06498472B1

    公开(公告)日：2002-12-24

    申请号：US09449636

    申请日：1999-11-30

    Applicant: Sang Soo Lee ,  Wan Gu Lee ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

    Inventor： Sang Soo Lee ,  Wan Gu Lee ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

    IPC: G01R3102

    CPC classification number: H01L21/67271 ,  G01R31/2887

    Abstract: There is disclosed a method for handling a module IC and a carrier of a module IC handler used for transferring the carrier containing a plurality of module ICs between the processes. While a separate carrier containing the produced module ICs is transferred between the processes, the tests for the module ICs are performed. Thus, the reliability of the product discharged can be further improved, and the operation rate of a high-cost test apparatus is maximized. For this, a plurality of module ICs 1 vertically loaded in the carrier are transferred inside a heating chamber 22, the tests for the module ICs 1 are conducted at a test site 7 under the state that the module ICs 1 are contained in the carrier 18, and then at an unloading position 20, the module ICs having been tested are held by pick-up means 8 in an unloading side and classified based upon the test results and the classified module ICs are placed in customer trays 9.

    Abstract translation: 公开了一种用于处理模块IC的模块IC的处理器的方法和用于在所述处理之间传送包含多个模块IC的载体的模块IC处理器的载体。 虽然在这些过程之间传送包含所产生的模块IC的单独的载体，但是对模块IC进行测试。 因此，可以进一步提高放电产品的可靠性，并且使成本高的测试装置的操作率最大化。 为此，垂直装载在载体上的多个模块IC1被传送到加热室22内，模块IC1的测试在模块IC1被包含在载体18中的状态下在测试地点7进行 ，然后在卸载位置20，已经被测试的模块IC由卸载侧的拾取装置8保持，并且基于测试结果进行分类，并且将分类的模块IC放置在客户托盘9中。

    Carrier handling apparatus of an IC module handler
    30.
    发明授权
    Carrier handling apparatus of an IC module handler 失效
    IC模块处理器的载体处理装置

    公开(公告)号：US06471462B1

    公开(公告)日：2002-10-29

    申请号：US09449573

    申请日：1999-11-29

    Applicant: Sang Soo Lee ,  Wan Gu Lee ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

    Inventor： Sang Soo Lee ,  Wan Gu Lee ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

    IPC: G01R3126

    CPC classification number: H01L21/68 ,  G01R31/2808 ,  H01L21/67766

    Abstract: A carrier handling apparatus of an IC module handler includes a carrier transferring unit for holding one side of the carrier to transfer the same between the various processes, and a carrier positioning unit for precisely positioning the carrier. The carrier handling apparatus includes a carrier for transferring predetermined modules, a carrier transferring unit for transferring the carrier from a loading location to an unloading location, and a carrier positioning unit for precisely positioning the carrier in the loading and unloading locations, thereby allowing IC modules contained in a tray to be accurately loaded into the carrier or unloaded therefrom by a pick-up means. According to another aspect of the present invention, a slider is installed to be moved along the traveling path of the carrier, and is provided with a pair of fingers that can be withdrawn or spread by one cylinder, so that the area required to install the carrier transferring apparatus can be minimized. Further, since the carrier is accurately positioned before the pick-up means loads and unloads the IC modules in the loading and unloading locations, any troubles which may be caused due to position inaccuracies during the loading and unloading of the IC modules can be prevented in advance, thereby maximizing the operation rate of the apparatus.

    Abstract translation: IC模块处理器的载体处理装置包括载体传送单元，用于保持载体的一侧在各种处理之间传送载体;以及载体定位单元，用于精确地定位载体。 载体处理装置包括用于传送预定模块的载体，用于将载体从装载位置转移到卸载位置的载体传送单元和用于将载体精确地定位在装载和卸载位置的载体定位单元，由此允许IC模块 容纳在托盘中以被精确地装载到托架中或通过拾取装置从其中卸载。 根据本发明的另一方面，滑块被安装成沿着承载件的移动路径移动，并且设置有可以由一个气缸抽出或扩展的一对手指，使得安装 载体传送装置可以最小化。 此外，由于在拾取装置在装载和卸载位置装载和卸载IC模块之前载体被准确定位，所以可以防止由于在IC模块的装载和卸载期间的位置不准确而引起的任何故障 从而使设备的操作速度最大化。

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