公开(公告)号：US06564454B1

公开(公告)日：2003-05-20

申请号：US09752244

申请日：2000-12-28

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy D. Holloway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy D. Holloway

IPC: H01K310

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10477 ,  H05K2201/10681 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first apertures, and a second aperture. Each circuit trace overlies a first aperture, and an end of the circuit trace is near the second aperture. Solder balls are placed in each first aperture and fused to the overlying circuit trace. A die is placed in the second aperture. Each circuit trace may include a third aperture over the first aperture. Solder from the solder ball within the first aperture fills the overlying third aperture. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.

Abstract translation: 公开了封装的半导体封装和方法。 一种示例性方法包括提供具有第一表面的印刷电路板，其上具有电路迹线，第一孔和第二孔。 每个电路迹线覆盖第一孔，电路迹线的一端靠近第二孔。 焊球放置在每个第一孔中并与上覆电路迹线融合。 模具被放置在第二孔中。 每个电路迹线可以包括在第一孔上的第三孔。 在第一孔内从焊球焊接填充上覆的第三孔。 第二个包装可以堆放在第一个包装上。 第二封装的焊球通过第一封装的第三孔与第一封装的底层焊球熔合。 堆叠包装的管芯可以被定位成彼此进行光学连通。

公开(公告)号：US06528857B1

公开(公告)日：2003-03-04

申请号：US09712313

申请日：2000-11-13

Applicant: Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

Inventor： Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

IPC: H01L31203

CPC classification number: H01L27/14618 ,  H01L24/94 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. Interior traces are formed on a lower surface of a step up ring. Electrically conductive bumps are formed between the interior traces on the lower surface of the step up ring and the bond pads on the upper surface of the image sensor thus flip chip mounting the step up ring to the image sensor. Electrically conductive vias extend through the step up ring to electrically connect the interior traces to exterior traces formed on an upper surface of the step up ring.

Abstract translation: 图像传感器封装包括具有上表面的图像传感器。 图像传感器还包括有效区域和上表面上的接合焊盘。 通过窗口支持在活动区域​​上方支持一个窗口。 内部轨迹形成在升压环的下表面上。 在升压环的下表面上的内部迹线和图像传感器的上表面上的接合焊盘之间形成导电凸块，从而将升压环安装到图像传感器。 导电通孔延伸通过升压环，以将内部迹线电连接到形成在升压环的上表面上的外部迹线。

公开(公告)号：US06526653B1

公开(公告)日：2003-03-04

申请号：US09457515

申请日：1999-12-08

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H05K336

CPC classification number: H01L24/97 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49876 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract translation: 图像传感器封装包括具有锁定特征的模制件。 该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。 为了形成图像传感器封装，将窗口放置在模制品的口袋中。 卡扣盖固定就位。 一旦固定，卡扣盖压靠窗口外表面的周边区域。 窗口夹在模制件和卡扣盖之间并保持就位。

公开(公告)号：US06492699B1

公开(公告)日：2002-12-10

申请号：US09577692

申请日：2000-05-22

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H01L310203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support. The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.

Abstract translation: 一种图像传感器封装包括具有有效面积的上表面和形成在其上的接合焊盘的图像传感器。 上表面的非临界区域在有源区域和接合焊盘之间。 窗口覆盖有效区域，并通过窗口支持在非关键区域上支持。 窗口，窗口支撑和图像传感器限定了一个密封的空腔，有源区域位于空腔内。 特别地，活动区域位于空腔内，其被密封以保护活动区域免受外部湿气，灰尘和污染。

公开(公告)号：US06483030B1

公开(公告)日：2002-11-19

申请号：US09457516

申请日：1999-12-08

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H01L2302

CPC classification number: H01L27/14625 ,  B29C33/0022 ,  B29C43/36 ,  B29C2043/023 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract translation: 图像传感器封装包括具有锁定特征的模制件。 该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。 为了形成图像传感器封装，将窗口放置在模制品的口袋中。 卡扣盖固定就位。 一旦固定，卡扣盖压靠窗口外表面的周边区域。 窗口夹在模制件和卡扣盖之间并保持就位。

公开(公告)号：US06448506B1

公开(公告)日：2002-09-10

申请号：US09752662

申请日：2000-12-28

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy D. Holloway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy D. Holloway

IPC: H05K116

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/854 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H05K1/0268 ,  H05K1/144 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein are semiconductor packages and stacks thereof. An example package includes an insulative substrate having a first surface, first apertures, a second aperture, and circuit traces on the first surface. A first portion of each circuit trace overlies a first aperture and an end of the circuit trace is near the second aperture. A solder ball is in each first aperture, fused to the overlying circuit trace. A semiconductor die is in the second aperture and is electrically connected to the ends of the traces. A third aperture may extend through the first portion of each circuit trace. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.

Abstract translation: 本文公开了半导体封装及其堆叠。 示例性封装包括具有第一表面，第一孔，第二孔和第一表面上的电路迹线的绝缘衬底。 每个电路迹线的第一部分覆盖第一孔径，并且电路迹线的一端在第二孔附近。 每个第一个孔中都有一个焊球，与上覆电路迹线融合。 半导体管芯位于第二孔中并电连接到迹线的端部。 第三孔可以延伸穿过每个电路迹线的第一部分。 第二个包装可以堆放在第一个包装上。 第二封装的焊球通过第一封装的第三孔与第一封装的底层焊球熔合。 堆叠包装的管芯可以被定位成彼此进行光学连通。

公开(公告)号：US06441504B1

公开(公告)日：2002-08-27

申请号：US09558397

申请日：2000-04-25

Applicant: Thomas P. Glenn ,  Steven Webster ,  Gary L. Swiss

Inventor： Thomas P. Glenn ,  Steven Webster ,  Gary L. Swiss

IPC: H01L23544

CPC classification number: H01L23/544 ,  B23D59/001 ,  B28D5/0058 ,  H01L24/48 ,  H01L24/97 ,  H01L29/0657 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A structure includes a substrate such as a wafer or an array of packages. The substrate has a front-side surface and a back-side surface. A reference feature such as a scribe grid is on the front-side surface. In at least one alignment mark is on the back-side surface, the alignment mark having a precise positional relationship to the reference feature on the front-side surface. The reference mark is used to cut the substrate from the back-side surface.

Abstract translation: 结构包括诸如晶片或封装阵列的衬底。 基板具有前侧表面和后侧表面。 诸如划线网格的参考特征位于前侧表面。 在背侧表面上至少有一个对准标记，对准标记与前侧表面上的参考特征具有精确的位置关系。 参考标记用于从背面切割基板。

公开(公告)号：US06407381B1

公开(公告)日：2002-06-18

申请号：US09610314

申请日：2000-07-05

Applicant: Thomas P. Glenn ,  Steven Webster ,  Tony Arellano

Inventor： Thomas P. Glenn ,  Steven Webster ,  Tony Arellano

IPC: H01L310203

CPC classification number: H01L31/0203 ,  H01L23/3128 ,  H01L24/94 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.

Abstract translation: 图像传感器封装包括具有接合焊盘的图像传感器和图像传感器的上表面上的有效区域。 图像传感器封装还包括在图像传感器的上表面上的窗口支撑。 窗户支撑件完全包围包括活动区域和接合垫的上表面。 一个窗口与窗口支撑件接触，窗口覆盖有效区域。 通常，窗户支撑和窗户完全包围，从而保护图像传感器的有效区域。

公开(公告)号：US20150369763A1

公开(公告)日：2015-12-24

申请号：US14728282

申请日：2015-06-02

Applicant: Gordon J. KENNEDY ,  Frank Cheng-Yu WANG ,  Steven Webster LEVINE ,  Liepao Oscar FARNG ,  Margaret May-Som WU

Inventor： Gordon J. KENNEDY ,  Frank Cheng-Yu WANG ,  Steven Webster LEVINE ,  Liepao Oscar FARNG ,  Margaret May-Som WU

IPC: G01N24/08 ,  G01R33/48 ,  G01R33/46

CPC classification number: G01N24/08 ,  G01R33/46

Abstract: The distribution of nitrogen species in a long chain alkenyl succinimide dispersants is quantitated and speciated by means of 15N nuclear magnetic resonance spectroscopy.

Abstract translation: 通过15N核磁共振光谱法定量分析长链烯基琥珀酰亚胺分散剂中氮物质的分布。

公开(公告)号：US20120112042A1

公开(公告)日：2012-05-10

申请号：US13350619

申请日：2012-01-13

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L27/146 ,  H05K13/00

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。