公开(公告)号：US20060223913A1

公开(公告)日：2006-10-05

申请号：US11395216

申请日：2006-04-03

Applicant: Shoichi Osada

Inventor： Shoichi Osada

IPC: C08L63/00 ,  C08K9/10 ,  C08G79/04

CPC classification number: C08L63/00 ,  C08G59/621 ,  C08K3/016 ,  C08K5/5399 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: A flame retardant comprising an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) wherein X is selected from the group consisting of a single bond, CH2, C(CH3)2, SO2, S, O, and O(CO)O, n is an integer of from 3 to 1000, d and e are numbers with 2d+e=2n, said phosphazene compound being supported on said inorganic porous fine particle, and a resin layer coating said inorganic porous fine particle with the phosphazene compound supported thereon, said resin thermally decomposing to lose weight by 10% at a temperature of from 300° C. to 500° C. as measured by thermogravimetry in the air at a heating rate of 10° C./min.

Abstract translation: 一种阻燃剂，其包含无机多孔微粒，由以下平均组成式（1）表示的磷腈化合物，其中X选自单键，CH 2，C（CH 3） 2，SO 2，S，O和O（CO）O，n为3〜1000的整数，d和 e是2d + e = 2n的数，所述磷腈化合物负载在所述无机多孔微粒上，树脂层涂覆所述无机多孔微粒与磷腈化合物负载在其上，所述树脂热分解减少10％ 通过在10℃/分钟的加热速率下在空气中通过热重分析法测量的温度为300℃至500℃。

公开(公告)号：US06630745B1

公开(公告)日：2003-10-07

申请号：US09558384

申请日：2000-04-26

Applicant: Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: H01L2329

CPC classification number: H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract translation: 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。

公开(公告)号：US06168872A

公开(公告)日：2001-01-02

申请号：US09220439

申请日：1998-12-24

Applicant: Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: H01L2912

CPC classification number: H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/12528 ,  H01L2924/00

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.

Abstract translation: 包含环氧树脂，固化剂，无机填料和固化促进剂的环氧树脂组合物适用于半导体封装。 使用特定的有机磷化合物作为固化促进剂。 组合物流畅平稳，储存期间稳定，有效固化和脱模，并且可以模制和固化成不含导线流动和空隙的产品。

公开(公告)号：US08022137B2

公开(公告)日：2011-09-20

申请号：US12569433

申请日：2009-09-29

Applicant: Yusuke Taguchi ,  Junichi Sawada ,  Kenji Hagiwara ,  Shoichi Osada ,  Kazutoshi Tomiyoshi

Inventor： Yusuke Taguchi ,  Junichi Sawada ,  Kenji Hagiwara ,  Shoichi Osada ,  Kazutoshi Tomiyoshi

IPC: C08L83/00

CPC classification number: H01L23/296 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/22 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014

Abstract: The present invention provides a silicone resin composition for an optical semiconductor device, comprising (A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2  (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c

Abstract translation: 本发明提供一种光半导体装置用有机硅树脂组合物，其包含：（A）100质量份的重均分子量为500〜20000的有机聚硅氧烷，还原为聚苯乙烯，由下列平均组成式（ 1），（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）其中R1是具有1至4个碳原子的有机基团，a，b和c是满足下列等式的数字： 0.8和nlE; a＆nlE; 1.5,0.001和nlE; c＆nlE; 0.5和0.801≤n1E; a + b + c2，（B）3到200质量份白色颜料，（C）400 1000质量份除了所述白色颜料以外的无机填充材料，（D）0.01〜10质量份的缩合催化剂，（E）2〜50质量份的由有机聚硅氧烷构成的有机聚硅氧烷，所述直链二有机聚硅氧烷部分由 下式（2），其中R 2和R 3彼此独立地是选自羟基，烷基 具有1至3个碳原子的基团，环己基，乙烯基，苯基和烯丙基，其中m为5-50的整数。

公开(公告)号：US07969027B2

公开(公告)日：2011-06-28

申请号：US11806184

申请日：2007-05-30

Applicant: Shoichi Osada

Inventor： Shoichi Osada

IPC: H01L23/29 ,  H01L23/28 ,  H01L23/31 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00

CPC classification number: H01L23/295 ,  C08G59/621 ,  C08L63/00 ,  H01L21/561 ,  H01L23/293 ,  H01L23/3114 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01067 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01105 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device comprising an organic substrate, at least one semiconductor chip provided on a surface of the substrate, and a cured resin composition encapsulating the semiconductor chip provided on the surface of the substrate, characterized in that an absolute value of a distance between an imaginary line connecting two diagonally opposite corners of the substrate and a highest or lowest position on the surface of the substrate between the corners is smaller than 600 μm, as measured with a laser three-dimensional measuring instrument, a total volume ratio of the semiconductor chip to the semiconductor device ranges from 18 to 50%, and the cured resin composition comprises an inorganic filler (C) in such an amount that a weight ratio of the inorganic filler (C) to a total weight of the cured resin composition ranges from 80 to 90%.

Abstract translation: 一种半导体器件，包括有机衬底，设置在衬底的表面上的至少一个半导体芯片和封装设置在衬底表面上的半导体芯片的固化树脂组合物，其特征在于，虚构 连接基板的两个斜对角并且在角部之间的基板表面上的最高或最低位置的线小于600μm，如用激光三维测量仪器测量的，半导体芯片的总体积比 半导体装置的范围为18〜50％，固化后的树脂组合物含有无机填料（C）的无机填充材料（C）与固化树脂组合物的总重量的重量比为80〜 90％。

公开(公告)号：US07910638B2

公开(公告)日：2011-03-22

申请号：US12357764

申请日：2009-01-22

Applicant: Tomoyoshi Tada ,  Shoichi Osada ,  Miyuki Wakao ,  Kazutoshi Tomiyoshi ,  Kenichi Totsuka ,  Tadaharu Ikeda

Inventor： Tomoyoshi Tada ,  Shoichi Osada ,  Miyuki Wakao ,  Kazutoshi Tomiyoshi ,  Kenichi Totsuka ,  Tadaharu Ikeda

IPC: C08L63/00 ,  C08K3/00 ,  C08K3/04 ,  C08K9/00 ,  B32B27/38

CPC classification number: C08G59/621 ,  C08K3/04 ,  C08L63/00

Abstract: A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.

Abstract translation: 包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料和（D）炭黑）的半导体封装环氧树脂组合物通过将炭黑原料和固化剂与 将有机溶剂过滤出残留在网孔上的粗粒子，开孔为20μm，从滤液中除去溶剂，得到固化剂和炭黑的预混合物，并将预混料与其余成分捏合。

公开(公告)号：US20060025501A1

公开(公告)日：2006-02-02

申请号：US11193351

申请日：2005-08-01

Applicant: Shoichi Osada ,  Eiji Nakayama

Inventor： Shoichi Osada ,  Eiji Nakayama

IPC: C08L63/00 ,  H01L21/56 ,  B32B27/38

CPC classification number: H01L23/295 ,  C08K3/013 ,  C08K3/22 ,  C08K5/5399 ,  C08L61/04 ,  C08L63/00 ,  C08L85/02 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

Abstract: Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices.

Abstract translation: 环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料，（D）稀土氧化物和任选的（E）磷腈化合物固化成具有改善的耐热性的产物 和防潮可靠性，最适合于半导体器件的封装。

公开(公告)号：US06518332B2

公开(公告)日：2003-02-11

申请号：US09841046

申请日：2001-04-25

Applicant: Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Masachika Yoshino ,  Toshio Shiobara ,  Shoichi Osada

Inventor： Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Masachika Yoshino ,  Toshio Shiobara ,  Shoichi Osada

IPC: C08K310

CPC classification number: H01L23/293 ,  C08G59/3218 ,  C08K9/12 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L61/04 ,  H01L2924/00

Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

公开(公告)号：US06274251B1

公开(公告)日：2001-08-14

申请号：US09337520

申请日：1999-06-22

Applicant: Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Shoichi Osada ,  Toshio Shiobara

Inventor： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Shoichi Osada ,  Toshio Shiobara

IPC: C09D16300

CPC classification number: H01L23/293 ,  C08G59/688 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L61/04 ,  H01L2924/00

Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.

Abstract translation: 环氧树脂组合物含有（A）环氧树脂，（B）酚醛树脂固化剂，（C）固化催化剂和（D）无机填料。 催化剂是与具有至少两个羟基的酚醛树脂混合并反应的季磷化合物或季磷化合物。 该组合物是有效流动的，可模制的和可固化的，因此适合于半导体封装。

公开(公告)号：US6162878A

公开(公告)日：2000-12-19

申请号：US310999

申请日：1999-05-13

Applicant: Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

IPC: C08G59/08 ,  C08G59/20 ,  C08G59/40 ,  C08G59/62 ,  C08K3/00 ,  C08L61/04 ,  C08L63/00 ,  C08L83/04 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/293 ,  C08G59/08 ,  C08G59/4085 ,  C08L61/04 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

Abstract translation: 一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料， 适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。