公开(公告)号：US08602225B2

公开(公告)日：2013-12-10

申请号：US13235449

申请日：2011-09-18

Applicant: Shu-Chen Lin ,  Chen-Sheng Tang

Inventor： Shu-Chen Lin ,  Chen-Sheng Tang

IPC: A47F7/00

CPC classification number: H05K7/1489 ,  A47B88/43

Abstract: A mounting apparatus for fixing a slide rail to either a first rack post or a second rack post with different sizes or shapes of locating holes, includes a mounting bracket secured to the slide rail, a latch member rotatably mounted to the mounting bracket, and a restoring member. The mounting bracket includes a locating pin having a first segment adapted to extending through the first rack post locating hole, and a second segment adapted to extending through the second rack post locating hole. The latch member includes an arm received in the locating pin, with first and second holding teeth. In the locking position, either the first or the second teeth extend out of the locating pin to clasp the first or the second rack post, the unlocking position is achieved against spring pressure.

Abstract translation: 用于将滑轨固定到具有不同尺寸或形状的定位孔的第一齿条柱或第二齿条柱的安装装置包括固定到滑轨的安装支架，可旋转地安装到安装支架的闩锁构件和 恢复成员。 安装支架包括定位销，该定位销具有适于延伸穿过第一齿条定位孔的第一段，以及适于延伸穿过第二齿条定位孔的第二段。 闩锁构件包括容纳在定位销中的臂，具有第一和第二保持齿。 在锁定位置，第一或第二齿从定位销延伸出来以扣紧第一或第二齿条柱，解除锁定位置抵抗弹簧压力。

公开(公告)号：US08581239B2

公开(公告)日：2013-11-12

申请号：US13353380

申请日：2012-01-19

Applicant: Cheng-Hung Shih ,  Shu-Chen Lin ,  Yung-Wei Hsieh ,  Jun-Yu Yeh

Inventor： Cheng-Hung Shih ,  Shu-Chen Lin ,  Yung-Wei Hsieh ,  Jun-Yu Yeh

IPC: H01L35/24

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/10156 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a protective layer and a plurality of conductive pads, mentioned protective layer comprises a plurality of openings, the conductive pads exposed by the openings, mentioned under bump metallurgy layers being formed on the conductive pads, mentioned copper containing bumps being formed on the under bump metallurgy layers, each of the copper containing bumps comprises a top surface and a ring surface in connection with the top surface, mentioned organic barrier layer having a first coverage portion, and mentioned first coverage portion covers the top surface and the ring surface of each of the copper containing bumps.

Abstract translation: 半导体结构包括载体，多个凸块下金属层，多个含铜凸起和有机阻挡层，其中所述载体包括保护层和多个导电焊盘，所述保护层包括多个开口， 通过开口暴露的导电焊盘，所述凹凸不平的冶金层形成在导电焊盘上，所述含铜凸起形成在凸块下的冶金层上，每个含铜凸块包括顶表面和与 具有第一覆盖部分的上表面的有机阻挡层和所述第一覆盖部分覆盖每个含铜凸块的顶表面和环表面。

公开(公告)号：US20130249081A1

公开(公告)日：2013-09-26

申请号：US13426857

申请日：2012-03-22

Applicant: Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

IPC: H01L23/485 ,  H01L21/768

CPC classification number: H01L23/58 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11906 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05552

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract translation: 制造细间距凸块的方法包括提供硅衬底; 在硅衬底上形成具有多个第一区和多个第二区的含钛金属层; 在含钛金属层上形成光致抗蚀剂层; 图案化光致抗蚀剂层; 形成具有多个第一顶表面和多个第一环表面的多个铜凸块; 加热光致抗蚀剂层以形成多个主体部分和可移除部分; 蚀刻光致抗蚀剂层; 在所述含钛金属层，所述第一顶表面和所述第一环表面上形成多个凸块保护层，所述凸块保护层中的每一个包括凸起覆盖部分; 在凸点覆盖部分处镀覆多个金层; 最终，移除第二区域以使得每个第一区域形成凸起下的冶金层。

公开(公告)号：US08530344B1

公开(公告)日：2013-09-10

申请号：US13426857

申请日：2012-03-22

Applicant: Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

IPC: H01L21/44

CPC classification number: H01L23/58 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11906 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05552

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract translation: 制造细间距凸块的方法包括提供硅衬底; 在硅衬底上形成具有多个第一区和多个第二区的含钛金属层; 在含钛金属层上形成光致抗蚀剂层; 图案化光致抗蚀剂层; 形成具有多个第一顶表面和多个第一环表面的多个铜凸块; 加热光致抗蚀剂层以形成多个主体部分和可移除部分; 蚀刻光致抗蚀剂层; 在所述含钛金属层，所述第一顶表面和所述第一环表面上形成多个凸块保护层，所述凸块保护层中的每一个包括凸起覆盖部分; 在凸点覆盖部分处镀覆多个金层; 最终，移除第二区域以使得每个第一区域形成凸起下的冶金层。

公开(公告)号：US08501614B1

公开(公告)日：2013-08-06

申请号：US13426810

申请日：2012-03-22

Applicant: Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/05666 ,  H01L2224/11472 ,  H01L2224/11906 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2224/05552

Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract translation: 制造细间距凸块的方法包括以下步骤：提供硅衬底; 在所述硅衬底上形成含钛金属层，其中所述含钛金属层包括多个第一区和多个第二区; 在含钛金属层上形成光致抗蚀剂层; 图案化光致抗蚀剂层以形成多个开口槽; 在开口槽处形成多个铜凸块，其中每个铜凸块包括第一顶表面和环表面; 加热光致抗蚀剂层以形成多个主体部分和多个可移除部分; 蚀刻光致抗蚀剂层; 以及移除所述第二区域以使得所述第一区域中的每一个能够形成具有轴承部分和延伸部分的凸起下金属层。

公开(公告)号：US08450303B2

公开(公告)日：2013-05-28

申请号：US12765179

申请日：2010-04-22

Applicant: Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/496 ,  C07D295/192 ,  C07D405/06

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US08449808B2

公开(公告)日：2013-05-28

申请号：US12659431

申请日：2010-03-09

Applicant: Shu-Chen Lin

Inventor： Shu-Chen Lin

IPC: B29C35/08 ,  B29C59/16 ,  B44C1/20 ,  B44C1/22 ,  H05B6/00

CPC classification number: B44C5/0453 ,  B29C37/0032 ,  B29C2037/0042 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/365 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2262/108 ,  B32B2307/584 ,  B32B2307/748 ,  B32B2451/00 ,  B32B2457/00 ,  B44C1/228 ,  Y10T156/1039 ,  Y10T156/1041 ,  Y10T428/24331 ,  Y10T428/24612 ,  Y10T428/24802

Abstract: A plastic shell with ink-free pattern and its manufacturing method thereof are provided. The manufacturing method includes a step of providing a multilayered film with ink-free pattern, a step of adhering a protective layer of the multilayered film on a surface of a plastic shell body, and a step of performing a laser engraving procedure to present a relief pattern on a surface of the protective layer.

Abstract translation: 提供了一种无油墨图案的塑料外壳及其制造方法。 该制造方法包括提供无油墨图案的多层膜的步骤，将多层膜的保护层粘附在塑料壳体的表面上的步骤，以及执行激光雕刻步骤以提供浮雕的步骤 图案在保护层的表面上。

公开(公告)号：US08445477B2

公开(公告)日：2013-05-21

申请号：US12765048

申请日：2010-04-22

Applicant: Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/496 ,  A61K31/55 ,  A61K31/541 ,  C07D205/04 ,  C07D401/12 ,  C07D403/04 ,  C07D409/06 ,  C07D413/12 ,  C07D471/04 ,  C07D491/048

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US08367653B2

公开(公告)日：2013-02-05

申请号：US12765076

申请日：2010-04-22

Applicant: Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark MacIelag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark MacIelag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/496 ,  C07D401/12 ,  C07D403/14 ,  C07D417/12 ,  C07D417/14 ,  C07D487/04 ,  C07D495/04

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US08184452B2

公开(公告)日：2012-05-22

申请号：US12779019

申请日：2010-05-12

Applicant: Tsung-Shih Lee ,  Wei-Hao Huang ,  Shu-Chen Lin

Inventor： Tsung-Shih Lee ,  Wei-Hao Huang ,  Shu-Chen Lin

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H05K5/0278

Abstract: A wireless input apparatus includes a shell having a recess at a top surface thereof. The recess has an opening at a rear wall thereof. A bottom of the recess is formed with two abreast sliding slots which extend perpendicular to the rear wall. A stopper is disposed across each sliding slot and spaced from a rear side of the sliding slot to form a stopping recess. Each of two opposite lateral walls of the recess has a guiding trough. A rear side of the guiding trough has a buckling notch at a lower portion thereof. A wireless transmitter has a main body and an insertion portion protruded from a rear end of the main body. The main body has two lumps at a bottom thereof corresponding to the stopping recesses, and a pair of sliding pieces protruded outwards from two opposite sides thereof corresponding to the buckling notches.

Abstract translation: 无线输入装置包括在其顶表面具有凹部的外壳。 凹部在其后壁处具有开口。 凹部的底部形成有两个平行的滑动槽，其垂直于后壁延伸。 止动件设置在每个滑动槽上并且与滑动槽的后侧间隔开以形成止动凹槽。 凹槽的两个相对的侧壁中的每一个具有导向槽。 引导槽的后侧在其下部具有弯曲的切口。 无线发射机具有主体和从主体的后端突出的插入部分。 主体在其底部具有对应于止动凹部的两个块体，以及从对应于弯曲凹口的两个相对侧向外突出的一对滑动件。