公开(公告)号：US20130026589A1

公开(公告)日：2013-01-31

申请号：US13243800

申请日：2011-09-23

Applicant: YING-CHENG WU ,  KANG-WEI LEE

Inventor： YING-CHENG WU ,  KANG-WEI LEE

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A miniaturization active sensing module includes a substrate unit, an active sensing unit, and an optical unit. The substrate unit includes a substrate body, a plurality of first bottom conductive pads disposed on the bottom side of the substrate body, and a plurality of first conductive tracks embedded in the substrate body. The substrate body has at least one first groove formed therein. The active sensing unit includes at least one active sensing chip embedded in the first groove. The active sensing chip has at least one active sensing area and a plurality of electric conduction pads disposed on the top side thereof, and each first conductive track has two ends electrically contacted by one electric conduction pad and one first bottom conductive pad, respectively. The optical unit includes at least one optical element, disposed on the substrate body, for protecting the active sensing area.

Abstract translation: 小型化主动感测模块包括基板单元，主动感测单元和光学单元。 基板单元包括基板主体，设置在基板主体的底侧上的多个第一底部导电焊盘以及嵌入基板主体中的多个第一导电轨迹。 衬底主体具有形成在其中的至少一个第一凹槽。 主动感测单元包括嵌入第一凹槽中的至少一个主动感测芯片。 主动感测芯片具有至少一个有源感测区域和设置在其顶侧上的多个导电焊盘，并且每个第一导电轨道具有分别由一个导电焊盘和一个第一底部导电焊盘电接触的两个端部。 光学单元包括设置在基板主体上的至少一个光学元件，用于保护主动感测区域。

公开(公告)号：US08072489B2

公开(公告)日：2011-12-06

申请号：US11592912

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: A61B1/04 ,  H04N5/225

CPC classification number: H04N5/2253 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/16195 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract translation: 提供安装在芯片封装上的芯片封装（101）和透镜模块（103）。 芯片封装包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并且经由第一多根导线（50a）与基板电连接。 所述第二芯片安装在所述第一芯片上方并且与所述第一芯片连接的导线上方并且经由第二多个导线（50b）与所述基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。

公开(公告)号：US20090284628A1

公开(公告)日：2009-11-19

申请号：US12210534

申请日：2008-09-15

Applicant: Ying-Cheng WU ,  Te-Chun CHOU

Inventor： Ying-Cheng WU ,  Te-Chun CHOU

IPC: H04N5/335 ,  H01L31/00

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014

Abstract: An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate.

Abstract translation: 图像传感器封装包括图像传感器芯片，侧壁，封装玻璃，导电材料和多个焊球。 图像传感器芯片包括感光区域，环绕感光区域的非感光区域和形成在非感光区域上的多个接合焊盘。 侧壁位于非感光体上，并且限定与接合焊盘对准并对应于接合焊盘的多个第一通孔。 封装玻璃位于侧壁上。 分别在与焊盘对准的封装玻璃上形成多个焊球。 封装玻璃限定多个第二通孔，每个通孔对应于焊盘和相应的焊球。 图像传感器封装还包括导电材料，第一和第二通孔穿过该导电材料。

公开(公告)号：US20090267206A1

公开(公告)日：2009-10-29

申请号：US12192083

申请日：2008-08-14

Applicant: YING-CHENG WU ,  TE-CHUN CHOU

Inventor： YING-CHENG WU ,  TE-CHUN CHOU

IPC: H01L23/488

CPC classification number: H01L25/105 ,  H01L24/16 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01015 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H05K3/323

Abstract: A stacked semiconductor package includes a circuit board with a number of pads disposed thereon, and a number of package units stacked on the circuit board. Each of the package units includes a substrate, a chip, an anisotropic conductive layer, and a number of conductive elements. The substrate has a first surface facing to the circuit board and a second surface opposite to the first surface, both of the first surface and the second surface have a number of pads disposed thereon. The chip is disposed on the substrate and electrically connected with the substrate. The anisotropic conductive layer is disposed between the substrate and the chip, and is capable of fixing the chip on the substrate. The conductive elements electrically connect the pads on the first surface of the substrate with the pads on the second surface of an adjacent substrate and the pads on the circuit board.

Abstract translation: 堆叠的半导体封装包括其上布置有多个焊盘的电路板和堆叠在电路板上的多个封装单元。 每个封装单元包括基板，芯片，各向异性导电层和多个导电元件。 基板具有面对电路板的第一表面和与第一表面相对的第二表面，第一表面和第二表面都具有设置在其上的多个焊盘。 芯片设置在基板上并与基板电连接。 各向异性导电层设置在基板和芯片之间，并且能够将芯片固定在基板上。 导电元件将衬底的第一表面上的焊盘与相邻衬底的第二表面上的焊盘和电路板上的焊盘电连接。

公开(公告)号：US07540672B2

公开(公告)日：2009-06-02

申请号：US11262592

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: G03B17/00

CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H04N5/2253 ,  H01L2924/00014

Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Abstract translation: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。 图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。 衬底在其中限定接收室（203）。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分（29）。 镜筒包括容纳在其中的至少一个透镜（31）。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

公开(公告)号：US20080251875A1

公开(公告)日：2008-10-16

申请号：US11850619

申请日：2007-09-05

Applicant: YING-CHENG WU ,  KUN-HSIAO LIU

Inventor： YING-CHENG WU ,  KUN-HSIAO LIU

IPC: H01L23/22 ,  H01L31/0203

CPC classification number: H01L23/3121 ,  H01L23/16 ,  H01L23/3135 ,  H01L23/50 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An exemplary semiconductor package includes a substrate, at least one passive component, an insulative layer and a chip. The substrate defines a cavity therein. The at least one passive component is disposed within the cavity, and is electrically connected to the substrate. The insulative layer is received in the cavity, and encases the at least one passive component. The chip is disposed on the insulative layer, and is electrically connected to the substrate. The semiconductor package packaging the at least one passive component within the cavity and under the chip can improve a space usage thereof, thus a packaging scale of the semiconductor package could be reduced.

Abstract translation: 示例性半导体封装包括衬底，至少一个无源部件，绝缘层和芯片。 衬底在其中限定空腔。 所述至少一个无源部件设置在所述空腔内，并且电连接到所述基板。 绝缘层被接收在空腔中，并且包围至少一个无源部件。 芯片设置在绝缘层上，并与基板电连接。 封装空腔内和芯片下方的至少一个无源部件的半导体封装可以改善其空间使用，从而可以减少半导体封装的封装尺寸。

公开(公告)号：US20080099864A1

公开(公告)日：2008-05-01

申请号：US11695441

申请日：2007-04-02

Applicant: YING-CHENG WU ,  CHUN-HUNG LIN

Inventor： YING-CHENG WU ,  CHUN-HUNG LIN

IPC: H01L31/0232 ,  H01L21/58 ,  H01L23/48

CPC classification number: H01L31/0203 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14627 ,  H01L31/0232 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.

Abstract translation: 数字照相机模块（100）包括安装在芯片封装上的芯片封装（110）和透镜模块（130），用于在芯片封装上形成聚焦图像。 芯片封装包括支撑件（112），芯片（114），多个电线（116），主粘合剂（118）和盖板（119）。 支撑件包括通过其定义的通孔，并且在通孔周围形成有多个顶部触头（1130）。 芯片设置在通孔中并且包括布置在其上的多个焊盘（1144）。 电线将焊盘电连接到顶部触点。 将主要粘合剂施加到芯片和支撑件之间的间隙，并将芯片固定到支撑件上。 盖板粘接并支撑在主粘合剂上。 还提供了制造芯片封装的方法。

公开(公告)号：US20070165136A1

公开(公告)日：2007-07-19

申请号：US11592912

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/16195 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A digital camera module (10) includes a chip package (101) and a lens module (103) mounted on the chip package. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract translation: 数字照相机模块（10）包括芯片封装（101）和安装在芯片封装上的透镜模块（103）。 芯片封装包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并通过第一多根导线（50a）与基板电连接。 第二芯片安装在第一芯片上方并且连接在与第一芯片连接的导线上方，并且经由第二多个导线（50b）与基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。

公开(公告)号：US20070152345A1

公开(公告)日：2007-07-05

申请号：US11592848

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: H01L23/52

CPC classification number: H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014

Abstract: A stacked chip packaging structure (10) includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip. The mounting of the second chip and the cover in such a manner is facilitated through the use of an adhesive/glue (60a, 60b) that is able to function both as an adherent and as a spacer.

Abstract translation: 堆叠式芯片封装结构（10）包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并通过第一多根导线（50a）与基板电连接。 第二芯片安装在第一芯片上方并且连接在与第一芯片连接的导线上方，并且经由第二多个导线（50b）与基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。 通过使用能够既作为粘着剂又作为隔离物使用的粘合剂/胶（60a，60b），可以有利于以这种方式安装第二芯片和盖。

公开(公告)号：US20070057149A1

公开(公告)日：2007-03-15

申请号：US11453456

申请日：2006-06-14

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H01L27/00

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An image sensor package method includes the steps of first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Abstract translation: 图像传感器封装方法包括以下步骤：首先提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。 第三，提供多条导线，每个电线将图像传感器芯片和载体的相应的一个导电片电连接。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。 最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。