摘要:
A semiconductor memory device has a plurality of memory cells in an array, into which the memory cells data is writable, and which can subsequently be read. Each memory cell has a switching element with one terminal connected to a bit line of the array another terminal connected to at least one ferroelectric capacitor, and a control terminal connected to a word line. The cell may then be operated to detect the change in polarization of the ferroelectric capacitor when a voltage is applied which is not sufficient to cause a change of state of the ferroelectric capacitor. Alternatively, a ferroelectric capacitor and a capacitor other than a ferroelectric capacitor is connected to the switching element. In a further alternative, a plurality of ferroelectric capacitors are connected to the switching element, so that different data are writable into each.
摘要:
The present invention provides a stainless steel which is suitable for use in the food manufacturing plant, particularly a soy sauce manufacturing plant. A stainless steel to be used in the environment which contains organic acid and common salt comprising, C; 0.05 wt % or less, Si; 1.00 wt % or less, Mn; 1.00 wt % or less, P; 0.040 wt % or less, S; 0.03 wt % or less, Ni; 40.0 wt % or less, 16.0 wt %≦Cr≦26.0 wt %, 2.0 wt %≦Mo≦8.0 wt %, 0.05 wt %≦Al≦0.100 wt %, 0.10 wt %≦N≦0.30 wt %, Mg: 0.005 wt % or less, Ca; 0.0010 wt % or less and balance consisting of Fe and inevitable impurities, and satisfying equation (1), Cr+3.3Mo+20N≧38 (1) wherein, Cr, Mo and N show the content of each ingredients by weight %.
摘要:
The present invention and method relates to an apparatus for forming and separating rolled sushi dishes. The device comprises a non-stick, flexible mat with slots to facilitate the cutting of the rolled food product. The slots are positioned perpendicular to the axis of flexibility of the mat so that the formed food product may be cut into cylindrical portions.
摘要:
Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.
摘要:
An insulated gate semiconductor device has a semiconductor substrate having an irregular surface of raised portions and depressed portions, and a main device region and a protective circuit region. The protective circuit region is formed in a raised portion of the semiconductor substrate and includes a semiconductor device which is driven by an insulated gate electrode formed in a depressed portion of the semiconductor substrate. The raised portions and the depressed portions of the semiconductor substrate are formed by a trench etching method.
摘要:
A semiconductor device is provided which comprises a memory mat formed by dividing a memory into a plurality of blocks and a circuit arrangement disposed at every memory mat block for generating access suppression signals at least for defective memory cells within that block. Using this arrangement, the access speed to a redundant memory cell array for relieving the defects is increased so that a semiconductor memory device capable of a high speed operation is obtained.
摘要:
A semiconductor integrated circuit comprising first n-channel MISFETs constituting the memory cells of a storage system, second n-channel MISFETs constituting the peripheral circuits of the storage system, and third n-channel MISFETs constituting the output circuit among the peripheral circuits. The respective threshold voltages of the first n-channel MISFETs, the second n-channel MISFETs and the third n-channel MISFETs are decreased in that order when the respective gate lengths of those MISFETs are substantially the same.
摘要:
An arrangement which is particularly effective for decoders in semiconductor memory circuits which use, for example, common NMOS to receive one input for a plurality of logic decoder gates is provided includes a plurality of logic gates each having a first input terminal for respectively receiving first input signals and each being coupled to a common node. In one embodiment, first and second switching elements are also coupled to the common node. The first and second switching elements are both coupled to a second input terminal for receiving a second input signal which is common to the plurality of logic gates, and both operate complementary to one another in response to the second input signal. An improved read/write arrangement is also provided for such semiconductor memory circuit which includes circuitry to prevent connection of a common read line to the data lines during the writing operation. This enhances the writing speed by removing the load of the common read line during writing.
摘要:
The semiconductor IC device has a circuit arrangement constituted by a first CMOS logic gate having input and output terminals, and a second CMOS logic gate which performs the same logic operation as that of the first CMOS logic gate and which has an input terminal connected to the input terminal of the first CMOS logic gate. The arrangement also requires a differentiator circuit which has an input terminal thereof connected to an output terminal of the second CMOS logic gate and has an output terminal connected to the output terminal of the first CMOS logic gate. With such an arrangement, the dependency of the effective gate propagation delay time on an output load is lowered. As a result, therefore, the arrangement can be effected using a low power supply voltage while securing a high operation speed as well as a low power consumption. The CMOS logic gates can also be facilitated in combination with NPN bipolar transistors which are connected therewith in an emitter follower circuit form. This type of arrangement is used to effect a BiNMOS type of logic (inverter) circuit. In accordance with another structural scheme, in place of the first CMOS logic gate, a BiCMOS type of arrangement is effected in combination with the second CMOS logic gate and differentiator.
摘要:
The semiconductor IC device has a circuit arrangement in which one or more of the circuits, such as on a single substrate, include a totem-pole series connection of bipolar transistors which are driven by arrangements of complementary MOS circuits in a manner such that high-speed logic/switching operation is effected. Arrangements of circuits can also be effected in which the totem-pole series connection is constituted by a PNP transistor, on the power source terminal side, and an NPN or NMOS transistor on the ground or pull-down side thereof. With such configurations, the output signal swing at low operating voltages can be maximized while achieving the same with reduced propagation delay time and low power consumption. The device can also be implemented by circuitry employing capacitance bootstrapping effect as well as IIL (I.sup.2 L) design schemes.