公开(公告)号：US20220379428A1

公开(公告)日：2022-12-01

申请号：US17335868

申请日：2021-06-01

Applicant: Applied Materials, Inc.

Inventor： Jimin ZHANG ,  Brian J. BROWN ,  Eric LAU ,  Ekaterina MIKHAYLICHENKO ,  Jeonghoon OH ,  Gerald J. ALONZO

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

公开(公告)号：US20220118583A1

公开(公告)日：2022-04-21

申请号：US17488429

申请日：2021-09-29

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Jamie Stuart LEIGHTON ,  Roger M. JOHNSON ,  Van H. NGUYEN

IPC: B24B37/04

Abstract: An apparatus and method for sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing (CMP) systems is disclosed. A method includes transferring a first substrate to a first polishing station of a plurality of polishing stations, polishing the first substrate at the first polishing station, transferring the first substrate to a second polishing station, and transferring a second substrate to the first polishing station. The method includes cleaning a first surface of a plurality of surfaces of the polishing system by dispensing a first cleaning fluid from a first one or more nozzles of a plurality of nozzles to direct the first cleaning fluid onto the first surface and dispensing a second cleaning fluid from the first one or more nozzles to direct the second cleaning fluid onto the first surface, where the second cleaning fluid is different from the first cleaning fluid.

公开(公告)号：US20200086456A1

公开(公告)日：2020-03-19

申请号：US16552901

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Dmitry SKLYAR ,  Jeonghoon OH ,  Gerald J. ALONZO ,  Jonathan DOMIN ,  Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B49/04 ,  H01L21/321 ,  H01L21/67 ,  B24B37/005 ,  B24B57/04

Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

公开(公告)号：US20190030677A1

公开(公告)日：2019-01-31

申请号：US16037783

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  David J. LISCHKA ,  Erik RONDUM ,  Jay GURUSAMY ,  Robert D. TOLLES ,  Steven M. ZUNIGA ,  Steven M. REEDY ,  Wai- Ming KAN

IPC: B24B37/24 ,  B24B37/005

Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.

公开(公告)号：US20180019108A1

公开(公告)日：2018-01-18

申请号：US15715859

申请日：2017-09-26

Applicant: Applied Materials, Inc.

Inventor： Brian T. WEST ,  Michael S. COX ,  Jeonghoon OH

IPC: H01J37/34 ,  C23C14/35 ,  C23C14/34

CPC classification number: H01J37/3405 ,  C23C14/3407 ,  C23C14/35 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/347 ,  H01J37/3491 ,  H01J37/3497

Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

公开(公告)号：US20170274495A1

公开(公告)日：2017-09-28

申请号：US15456413

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/10 ,  H01L21/687 ,  H01L21/67 ,  B24B37/20 ,  B24B57/02

CPC classification number: B24B37/10 ,  B24B37/20 ,  B24B57/02 ,  H01L21/67092 ,  H01L21/68785

Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20130101241A1

公开(公告)日：2013-04-25

申请号：US13648082

申请日：2012-10-09

Applicant: Applied Materials, Inc.

Inventor： TAO HOU ,  Jeonghoon OH ,  Tom K. CHO ,  Andrzej MATLOSZ ,  Frank F. HOOSHDARAN ,  Yao-Hung YANG

IPC: F16C29/02 ,  C23C16/458

CPC classification number: C23C16/4586 ,  C23C16/505 ,  F16C29/02 ,  H01L21/68742

Abstract: A bushing assembly for supporting a substrate within a processing chamber is generally provided. In one aspect, the bushing assembly comprises a tubular body having an outer perimeter and an aperture extending therethrough, a first ring having a first inner edge, the first ring disposed in the aperture in an upper portion of the tubular body, and a second ring having a second inner edge, the second ring disposed in the aperture in a lower portion of the tubular body. In another aspect, the first inner edge has a first radius of curvature, and the second inner edge has a second radius of curvature. In another aspect, a first inner edge diameter, a second inner edge diameter, the first radius of curvature, and the second radius of curvature are selected such that a support pin extending through the aperture contacts the bushing assembly on at most two points.

Abstract translation: 通常提供用于在处理室内支撑衬底的衬套组件。 在一个方面，套管组件包括具有外周边和延伸穿过其的孔的管状体，第一环具有第一内边缘，第一环设置在管状体的上部中的孔中，第二环 具有第二内边缘，所述第二环设置在所述管状体的下部中的所述孔中。 在另一方面，第一内边缘具有第一曲率半径，并且第二内边缘具有第二曲率半径。 在另一方面，选择第一内边缘直径，第二内边缘直径，第一曲率半径和第二曲率半径，使得延伸穿过孔的支撑销在最多两点处接触衬套组件。

公开(公告)号：US20240307963A1

公开(公告)日：2024-09-19

申请号：US18183000

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Ximeng XUE ,  David J. LISCHKA ,  Jay GURUSAMY ,  Steven M. ZUNIGA ,  Jeonghoon OH ,  Jagan RANGARAJAN

IPC: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

CPC classification number: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

Abstract: Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.

公开(公告)号：US20240051081A1

公开(公告)日：2024-02-15

申请号：US17888007

申请日：2022-08-15

Applicant: Applied Materials, Inc.

Inventor： Jay GURUSAMY ,  Steven M. ZUNIGA ,  Takashi FUJIKAWA ,  Jeonghoon OH

IPC: B24B37/20

CPC classification number: B24B37/20

Abstract: Embodiments of the present disclosure provide a multiple disk pad conditioner and methods of using the multiple disk pad conditioner during a chemical mechanical polishing (CMP) process. The multiple disk pad conditioner has a plurality of conditioning heads having conditioning disks affixed thereto. The multiple disk pad conditioner can include a conditioning arm, and a plurality of conditioning heads attached to the conditioning arm. Each of the plurality of conditioning heads has a conditioning disk affixed thereto. In some embodiments, each of the conditioning heads include a rotational axis, wherein each of the rotational axes is disposed a distance apart in a first direction that extends along the length of the conditioning arm.

公开(公告)号：US20220388116A1

公开(公告)日：2022-12-08

申请号：US17339699

申请日：2021-06-04

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Christopher Heung-Gyun LEE

IPC: B24B53/017 ,  B24B37/005

Abstract: A method and apparatus for determining a polishing pad thickness profile are described herein. A set of displacement sensors, including an arm displacement sensor and one or more conditioning disk displacement sensors are utilized to determine the orientation of a conditioning disk and the thickness of the polishing pad. The displacement sensors are non-contact sensors, such as a laser sensor, a capacitive sensor, or an inductive sensor. Once the thickness profile of the polishing pad is determined, one or more process conditions is altered to improve substrate polishing.