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公开(公告)号:US07828193B2
公开(公告)日:2010-11-09
申请号:US12000675
申请日:2007-12-14
申请人: Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
发明人: Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
IPC分类号: B23K31/02
CPC分类号: B23K1/06 , H01L21/563 , H01L24/28 , H01L24/75 , H01L24/81 , H01L2224/03828 , H01L2224/73203 , H01L2224/75 , H01L2224/75355 , H01L2224/8101 , H01L2224/81024 , H01L2224/81075 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/81906 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3489 , H05K2203/0285 , H05K2203/086 , H05K2203/1476 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2224/8182 , H01L2224/29099
摘要: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.
摘要翻译: 在将电子部件安装在基板上的方法中,基板和电子部件中的至少一个上的电极端子由焊锡凸块构成。 将基板的电极端子和电子部件的电极端子接触,将超声波振动施加到基板和电子部件中的至少一个,以将电极端子临时接合在一起。 然后用焊剂填充填充衬底和电子部件之间的间隙,并且通过回流焊料凸块来接合衬底和电子部件的电极端子。
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公开(公告)号:US07514788B2
公开(公告)日:2009-04-07
申请号:US11979165
申请日:2007-10-31
申请人: Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
发明人: Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
IPC分类号: H01L21/302
CPC分类号: H01L24/81 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/75 , H01L2224/0401 , H01L2224/0603 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/13144 , H01L2224/1403 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81136 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00
摘要: The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.
摘要翻译: 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于,通过对电子部件施加超声波振动,电子部件的凸起分别与电路基板的电极倒装接合, 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。
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公开(公告)号:US07471081B2
公开(公告)日:2008-12-30
申请号:US11326598
申请日:2006-01-06
申请人: Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人: Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号: G01R33/12
CPC分类号: G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
摘要翻译: 滑块测试器包括使测试介质旋转的驱动单元,可拆卸地支撑滑块作为单个主体的固定板,以及与由固定板支撑的滑块电连接的调查装置,并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构,其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56,其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。
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公开(公告)号:US20080203138A1
公开(公告)日:2008-08-28
申请号:US12000675
申请日:2007-12-14
申请人: Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
发明人: Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
IPC分类号: B23K1/06
CPC分类号: B23K1/06 , H01L21/563 , H01L24/28 , H01L24/75 , H01L24/81 , H01L2224/03828 , H01L2224/73203 , H01L2224/75 , H01L2224/75355 , H01L2224/8101 , H01L2224/81024 , H01L2224/81075 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/81906 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3489 , H05K2203/0285 , H05K2203/086 , H05K2203/1476 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2224/8182 , H01L2224/29099
摘要: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.
摘要翻译: 在将电子部件安装在基板上的方法中,基板和电子部件中的至少一个上的电极端子由焊锡凸块构成。 将基板的电极端子和电子部件的电极端子接触,将超声波振动施加到基板和电子部件中的至少一个,以将电极端子临时接合在一起。 然后用焊剂填充填充衬底和电子部件之间的间隙,并且通过回流焊料凸块来接合衬底和电子部件的电极端子。
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公开(公告)号:US20060172575A1
公开(公告)日:2006-08-03
申请号:US11326598
申请日:2006-01-06
申请人: Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人: Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号: H01R13/15
CPC分类号: G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.
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26.
公开(公告)号:US20060094157A1
公开(公告)日:2006-05-04
申请号:US11041292
申请日:2005-01-25
申请人: Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
发明人: Kenji Kobae , Hidehiko Kira , Norio Kainuma , Takayoshi Matsumura
IPC分类号: H01L21/50
CPC分类号: H01L24/81 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/75 , H01L2224/0401 , H01L2224/0603 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/13144 , H01L2224/1403 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81136 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00
摘要: The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.
摘要翻译: 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于,通过对电子部件施加超声波振动,电子部件的凸起分别与电路基板的电极倒装接合, 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。
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公开(公告)号:US06943971B2
公开(公告)日:2005-09-13
申请号:US10348680
申请日:2003-01-21
CPC分类号: G11B5/455 , G11B27/36 , G11B2005/0013 , G11B2220/20
摘要: The slider tester is capable of solely testing a slider and securely selecting good sliders so as to reduce wasteful costs. The slider tester, which tests reading and writing functions of a slider for reading data from and writing data on a recording medium, includes a testing device for testing the functions of the slider, and a setting plate holding the slider and electrically connecting the slider to the testing device. The setting plate separates the slider a prescribed distance from the recording medium during the test so as to read data from and write data on the recording medium, wherein the slider can be independently attached to and detached from the setting plate.
摘要翻译: 滑块测试仪能够单独测试滑块并安全地选择好的滑块,以减少浪费的成本。 滑块测试器测试用于在记录介质上读取数据和将数据写入记录介质的滑块的读和写功能,包括用于测试滑块的功能的测试装置,以及夹持滑块并将滑块电连接到 测试设备。 在测试期间,设置板将滑块与记录介质分开规定距离,以便从记录介质上读取数据和写入数据,其中滑块可以独立地安装到设置板上并从设置板拆下。
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公开(公告)号:US06770319B2
公开(公告)日:2004-08-03
申请号:US09811605
申请日:2001-03-20
申请人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
发明人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号: B05D512
CPC分类号: B05C11/1034 , B05C5/0212 , H01L21/563 , H01L24/743 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H05K1/0269 , H05K3/0091 , H05K3/284 , H05K2203/0126 , H05K2203/163 , H01L2924/00 , H01L2224/05599
摘要: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.
摘要翻译: 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤:对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。
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公开(公告)号:US06437450B1
公开(公告)日:2002-08-20
申请号:US09614726
申请日:2000-07-12
申请人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
发明人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号: H01R2348
CPC分类号: H01L21/563 , H01L21/67092 , H01L21/67144 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75743 , H01L2224/81191 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/83885 , H01L2224/83951 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/05599
摘要: A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.
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30.
公开(公告)号:US07833831B2
公开(公告)日:2010-11-16
申请号:US11951693
申请日:2007-12-06
申请人: Norio Kainuma , Kuniko Ishikawa , Hidehiko Kira
发明人: Norio Kainuma , Kuniko Ishikawa , Hidehiko Kira
IPC分类号: H01L21/00
CPC分类号: B23K1/06 , B23K1/0016 , B23K2101/40 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81011 , H01L2224/81024 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , H05K3/3478 , H05K2201/10674 , H05K2201/10984 , H05K2203/0285 , H05K2203/0338 , H05K2203/1105 , Y10T428/12493 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.
摘要翻译: 电子部件配备有电极突起,其可以安装电子部件而不用焊料覆盖电路板的连接焊盘,并且以窄的间距配置电路板的连接焊盘,同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法,其中电极突起被焊料覆盖,包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤,将焊料转移到与焊料片接触的电极突起的外表面上。
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