Abstract:
A method for aligning an opto-electronic component in an IC die with an optical port is disclosed. This is achieved, in various embodiments, by forming alignment features in the IC die that can mate with complementary alignment features of the optical port. The formation of alignment features can be performed at the wafer level during fabrication of the IC die. An optical signal carrier may be optically coupled to the optical port such that the signal carrier may communicate optically with the opto-electronic component.
Abstract:
An electrical circuit includes a photodiode that receives a light signal from a light source and generates a photocurrent signal, a trans-impedance amplifier that amplifies the photocurrent signal and generates a low noise signal, and a high pass filter that converts the low noise signal into an alternating current (AC) signal having a positive amplitude, a negative amplitude, and a zero cross-over point between the positive amplitude and the negative amplitude. The electrical circuit also includes a positive integrating amplifier that receives the positive amplitude of the AC signal and generates a positive integrated value over an integration period, and a negative integrating amplifier that receives the negative amplitude of the AC signal and generates a negative integrated value over the integration period. The electrical circuit further includes at least one analog-to-digital converter that receives the positive and negative integrated values.
Abstract:
Device for improving an optical detecting smoke apparatus and implementing thereof. Apparatus and methods for detecting the presence of smoke in a small, long-lasting smoke detector are disclosed. Specifically, the present disclosure shows how to build one or more optimized blocking members in a smoke detector to augment signal to noise ratio. This is performed while keeping the reflections from the housing structure to a very low value while satisfying all the other peripheral needs of fast response to smoke and preventing ambient light. This allows very small measurements of light scattering of the smoke particles to be reliable in a device resistant to the negative effects of dust. In particular, geometrical optical elements, e.g., cap and optical defection elements, are disclosed.
Abstract:
A device emitting mid-infrared light that comprises a semiconductor substrate of GaSb or closely related material. The device can also comprise epitaxial heterostructures of InAs, GaAs, AlSb, and related alloys forming light emitting structures cascaded by tunnel junctions. Further, the device can comprise light emission from the front, epitaxial side of the substrate.
Abstract:
A current detection module capable of differentiating and quantifying contribution to a current signal generated by a sensor in response to stimulation by a certain target source from contributions from sources other than the target source (ambient sources) is disclosed. As long as the contribution from the target source comprises a pulsed signal, the module may synchronize itself to the pulse(s) so that there is a predetermined phase relationship between the pulse(s) and functions carried out by various stages of the module. The module may be re-used to also detect and quantify contributions from ambient sources by presenting these contributions to the module as pulses that trigger synchronization of the module. To that end, a detection system disclosed herein is based on the use of such current detection module and allows mode switching where, depending on the selected mode of operation, the module is configured to perform different measurements.
Abstract:
A plethysmography (“PPG”) measurement system may include at least one source of PPG radiation and at least one auxiliary sensor for detection of PPG radiation. The radiation source emits a portion of the PPG radiation toward a subject and another portion along an optical path for direct communication between the PPG radiation source and the auxiliary sensor. The auxiliary sensor may develop a profile against which measurements from primary PPG sensors, which receive light returning from the subject, may be compared. From this comparison, new PPG signals may be generated that exhibit lower noise than the PPG signals output by PPG sensors. These noise mitigation techniques may be used advantageously by a PPG system to generate more accurate measurements and also to reduce power consumption by the radiation sources.
Abstract:
System and apparatus for portable gas detection. Specifically, this disclosure describes apparatuses and systems for optical gas detection in a compact package. There is a need for a very compact, low-power, gas detection system for gases such as CO2, NOx, water vapor, methane etc. This disclosure provides an ultra-compact and highly efficient optical measurement system based on principals of optical absorption spectroscopy. It reduces the size of the instrument as well its power consumption by more than an order of magnitude making it possible to deploy it widely. There is an identified need for large number of distributed gas sensors to improve human health, environment, and save energy usage.
Abstract:
Device for optically detecting smoke and implementing thereof. Apparatus and methods for detecting the presence of smoke in a small, long-lasting smoke detector are disclosed. Specifically, the present disclosure shows how to build a very compact housing around the smoke detector while keeping the reflections from the housing structure to a very low value while satisfying all the other peripheral needs of fast response to smoke and preventing ambient light. This allows very small measurements of light scattering of the smoke particles to be reliable in a device resistant to the negative effects of dust. In particular, geometrical optical elements, e.g., cap and optical defection elements, are disclosed.
Abstract:
An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.