公开(公告)号：US07287322B2

公开(公告)日：2007-10-30

申请号：US10933063

申请日：2004-09-02

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: H01R9/00

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/06761 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/326 ,  H05K3/4092 ,  Y10S438/977 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract translation: 通过光刻技术形成包括弹簧接触元件的互连的方法。 在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料） 并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。 在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。 在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。 另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

公开(公告)号：US07285968B2

公开(公告)日：2007-10-23

申请号：US11306515

申请日：2005-12-30

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum ,  A. Nicholas Sporck ,  Thomas N. Watson

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

公开(公告)号：US07251884B2

公开(公告)日：2007-08-07

申请号：US10831870

申请日：2004-04-26

Applicant: Gary W. Grube ,  Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Chadwick D. Sofield

Inventor： Gary W. Grube ,  Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Chadwick D. Sofield

IPC: H01R9/00

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：US07218094B2

公开(公告)日：2007-05-15

申请号：US10690170

申请日：2003-10-21

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  A. Nicholas Sporck ,  Charles A. Miller

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  A. Nicholas Sporck ,  Charles A. Miller

IPC: G01R31/28

CPC classification number: G01R31/3025 ,  G01R31/31907 ,  G01R31/31908

Abstract: One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

Abstract translation: 一个或多个测试人员与一个或多个测试台无线通信。 无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。 无线通信还可以包括将测试结果传输给测试者。 消息也可以被无线地交换。

公开(公告)号：US07204008B2

公开(公告)日：2007-04-17

申请号：US10609263

申请日：2003-06-26

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: G01R31/28

CPC classification number: G01R31/31926 ,  G01R1/07314 ,  G01R31/318505 ,  G01R31/31905 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.

Abstract translation: 通过可拆卸地将集成电路连接到模块基板来组装电子模块。 然后以特定的操作速度测试模块。 如果模块在测试速度下无法正常工作，则会导致故障的集成电路或电路被更换为新的集成电路，并重新测试模块。 一旦确定模块以测试速度正确运行，模块可能被评定为以测试速度运行并出售，或者模块可以以更高的速度进行测试。

公开(公告)号：US07128587B2

公开(公告)日：2006-10-31

申请号：US11264948

申请日：2005-11-01

Applicant: Benjamin N. Eldridge ,  Carl V. Reynolds

Inventor： Benjamin N. Eldridge ,  Carl V. Reynolds

IPC: H01R13/44

CPC classification number: G01R31/2851 ,  G01R31/2886

Abstract: The present invention discloses a cover over electrical contacts of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.

公开(公告)号：US07119564B2

公开(公告)日：2006-10-10

申请号：US11216579

申请日：2005-08-30

Applicant: Rod Martens ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand Shinde ,  Gaetan L. Mathieu

Inventor： Rod Martens ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand Shinde ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

公开(公告)号：US07108546B2

公开(公告)日：2006-09-19

申请号：US09886521

申请日：2001-06-20

Applicant: Charles A. Miller ,  Benjamin N. Eldridge

Inventor： Charles A. Miller ,  Benjamin N. Eldridge

IPC: H01R9/05

CPC classification number: G01R1/0466 ,  H01R13/025 ,  H01R13/40 ,  H01R2201/20

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

公开(公告)号：US07071715B2

公开(公告)日：2006-07-04

申请号：US10771099

申请日：2004-02-02

Applicant: Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

Inventor： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

IPC: G01R31/02 ,  G01R31/26 ,  H05K7/02 ,  H01R12/04

CPC classification number: G01R31/2889 ,  G01R1/07378

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

Abstract translation: 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

公开(公告)号：US06949942B2

公开(公告)日：2005-09-27

申请号：US10725824

申请日：2003-12-01

Applicant: Benjamin N. Eldridge ,  Charles A. Miller

Inventor： Benjamin N. Eldridge ,  Charles A. Miller

IPC: G01R31/26 ,  G01R31/28 ,  G01R31/317 ,  G01R31/319 ,  G06F1/26 ,  H01L21/66 ,  G01R31/02

CPC classification number: G06F1/26 ,  G01R31/2851 ,  G01R31/31721 ,  G01R31/31905 ,  G01R31/31924

Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

Abstract translation: 主电源将电流通过路径阻抗提供给被测集成电路器件（DUT）的电源端子。 在测试期间，DUT对电源输入端的电流需求暂时增加了在测试期间施加到DUT的时钟信号的随后边缘，作为IC开关中的晶体管响应于时钟信号的边缘。 为了限制电源输入端子的电压变化（噪声），辅助电源为电源输入端子提供额外的电流脉冲，以满足在时钟信号的每个周期期间增加的需求。 电流脉冲的大小是在该时钟周期期间电流需求的预测增加以及由反馈电路控制的适配信号的大小的函数，以限制在DUT的功率输入端产生的电压变化。