公开(公告)号：US10910352B2

公开(公告)日：2021-02-02

申请号：US16414162

申请日：2019-05-16

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L25/00 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US10811573B2

公开(公告)日：2020-10-20

申请号：US16686457

申请日：2019-11-18

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/00 ,  H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

公开(公告)号：US09887327B2

公开(公告)日：2018-02-06

申请号：US13957290

申请日：2013-08-01

Applicant: CREE, INC.

Inventor： Jesse Reiherzer ,  Andrew Signor ,  Joseph Gates Clark ,  Michael John Bergmann

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/58 ,  H01L33/54 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The encapsulant can also have a upper curved surface with a relatively large radius of curvature, with the combination of curved and planar surfaces resulting in efficient emission of light with a relatively narrow emission profile.

公开(公告)号：US20170294417A1

公开(公告)日：2017-10-12

申请号：US15399729

申请日：2017-01-05

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/00 ,  H01L27/15 ,  H01L33/50

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：USD758976S1

公开(公告)日：2016-06-14

申请号：US29462795

申请日：2013-08-08

Applicant: CREE, INC.

Designer： Jesse Reiherzer ,  Michael John Bergmann ,  Joseph Gates Clark

公开(公告)号：US20150179903A1

公开(公告)日：2015-06-25

申请号：US14575805

申请日：2014-12-18

Applicant: CREE, INC.

Inventor： ARTHUR PUN ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

IPC: H01L33/54 ,  H01L33/44 ,  H01L33/60 ,  H01L33/48 ,  H01L33/08 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 LED封装还针对允许根据本发明的LED封装的改进或定制的发光特性的特征或布置。 这些特征或布置中的一些包括但不限于光源尺寸与基座尺寸的较大比率，用于LED封装层的特定材料（例如，不同的硅氧烷），改进的反射层布置，改进的组成和 磷光体层的布置，调整密封剂的形状和/或改善层之间的结合。 这里仅公开了一些改进，其中一些导致LED封装具有比常规LED封装更高的发光强度的发光。

公开(公告)号：US11387221B2

公开(公告)日：2022-07-12

申请号：US16950142

申请日：2020-11-17

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L25/00 ,  H01L27/15 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US11342313B2

公开(公告)日：2022-05-24

申请号：US16950142

申请日：2020-11-17

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L25/00 ,  H01L27/15 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：USD892066S1

公开(公告)日：2020-08-04

申请号：US29655949

申请日：2018-07-09

Applicant: CREE, INC.

Designer： Jesse Reiherzer ,  Jeremy Nevins ,  Joseph Clark

公开(公告)号：US20200105984A1

公开(公告)日：2020-04-02

申请号：US16686457

申请日：2019-11-18

Applicant: Cree, Inc.

Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

IPC: H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.