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    SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME
    24.
    发明申请
    SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME 有权
    含有乙烯的乙烯嵌段共聚物配方包括膜和包含其的电子器件模块

    公开(公告)号：US20150013753A1

    公开(公告)日：2015-01-15

    申请号：US14371136

    申请日：2013-02-01

    Applicant: Dow Global Technologies LLC

    Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Rajen M. Patel ,  Morgan M. Hughes ,  Frank J. Cerk

    IPC: H01L31/048 ,  C08J5/18

    CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  C08F4/65908 ,  C08F4/65912 ,  C08F255/02 ,  C08J5/18 ,  C08J2351/06 ,  H01L31/048 ,  H02S40/34 ,  Y02E10/50 ,  C08F230/08 ,  C08F2500/08 ,  C08F2500/26 ,  C08F210/16 ,  C08F210/14 ,  C08F4/64093 ,  C08F4/6592

    Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

    Abstract translation: 在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜，其包含表面层，其包含：（A）含硅烷的乙烯互聚物，其包含（1）密度小于0.905g / cm 3的乙烯互聚物，以及 （2）至少0.1重量％的烷氧基硅烷; 其特征在于：（3）在60℃下测量的体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中，这种乙烯互聚物的残余硼含量小于10ppm，残余铝含量小于100 ppm。 还公开了层压电子器件模块，其包括：A.至少一个电子器件，以及B.如上所述的乙烯互聚物膜之一，与电子器件的至少一个表面紧密接触。 已经示出了根据本发明的这种层压电子器件模块遭受降低的电位诱导退化（“PID”）。

    ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER
    27.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER 有权
    包含乙烯多嵌段共聚物的电子器件模块

    公开(公告)号：US20130112270A1

    公开(公告)日：2013-05-09

    申请号：US13667722

    申请日：2012-11-02

    Applicant: Dow Global Technologies LLC

    Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

    IPC: C08F210/02 ,  H01L31/048

    CPC classification number: C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

    Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

    Abstract translation: 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

    High processability polyethylene compositions for injection molded articles
    30.
    发明授权
    High processability polyethylene compositions for injection molded articles 有权

    公开(公告)号：US11174377B2

    公开(公告)日：2021-11-16

    申请号：US16329940

    申请日：2017-09-29

    Applicant: Dow Global Technologies LLC

    Inventor： David W. Kababik ,  Shannon E. Hunt ,  Rajen M. Patel

    IPC: C08L23/06

    Abstract: The present disclosure includes a polyethylene composition that may include a first polyethylene resin having a density of from 0.915 g/cc to 0.970 g/cc and a melt index (I2) from 10 g/10 min to 200 g/10 min, when measured according to ASTM D1238 at 190° C. and 2.16 kg load, and a second polyethylene resin having a density of from 0.860 g/cc to 0.930 g/cc and a melt index (I2) of from 400 g/10 min to 2000 g/10 min. The density of the first polyethylene resin may be greater than the density of the second polyethylene resin and the first polyethylene resin, the second polyethylene resin, or both are copolymers of ethylene monomer and at least one α-olefin comonomer, the α-olefin comonomer including C3-C12 α-olefins. Injection molded articles produced from the polyethylene composition are also disclosed herein.

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