公开(公告)号：US11865665B2

公开(公告)日：2024-01-09

申请号：US16163070

申请日：2018-10-17

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Masayuki Nakanishi ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: H01L21/02 ,  H01L21/67 ,  B24B37/005 ,  H01L21/687 ,  B24B21/00 ,  B24B37/04 ,  B24B21/10 ,  B24B37/30 ,  B24B41/06 ,  B24B7/22 ,  B24B37/10

CPC classification number: B24B37/042 ,  B24B7/228 ,  B24B21/004 ,  B24B21/008 ,  B24B21/10 ,  B24B37/005 ,  B24B37/105 ,  B24B37/30 ,  B24B41/067 ,  H01L21/0209 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68764

Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

公开(公告)号：US11648638B2

公开(公告)日：2023-05-16

申请号：US16638711

申请日：2018-08-20

Applicant: Ebara Corporation

Inventor： Tetsuji Togawa ,  Kenichi Kobayashi

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/306

CPC classification number: B24B37/042 ,  B24B57/02 ,  H01L21/30625

Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

公开(公告)号：US11331769B2

公开(公告)日：2022-05-17

申请号：US15431062

申请日：2017-02-13

Applicant: EBARA CORPORATION

Inventor： Kenji Kamimura ,  Kenichi Kobayashi

IPC: B24B51/00 ,  B24B41/06 ,  B24B47/00

Abstract: A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.

公开(公告)号：US11305399B2

公开(公告)日：2022-04-19

申请号：US16530175

申请日：2019-08-02

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/34 ,  B25B11/02 ,  B23P19/10 ,  B24B37/32

Abstract: Provided is a jig for assisting the dismounting and mounting of a top ring.
One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting at least a part of the top ring, which is in a dismounted state, a plurality of posts for positioning the jig at a predetermined position relative to the top ring, the plurality of posts being configured to be engaged with the top ring, and a drive mechanism for moving the movable plate in a direction toward and away from the top ring.

公开(公告)号：US20200094371A1

公开(公告)日：2020-03-26

申请号：US16575844

申请日：2019-09-19

Applicant: EBARA CORPORATION

Inventor： Kenichi Akazawa ,  Makoto Kashiwagi ,  Yu Ishii ,  Atsushi Yoshida ,  Kenichi Kobayashi ,  Tetsuji Togawa ,  Hozumi Yasuda

IPC: B24B37/10 ,  B24B41/06 ,  B24B49/16

Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.

公开(公告)号：US10525564B2

公开(公告)日：2020-01-07

申请号：US15248028

申请日：2016-08-26

Applicant: Ebara Corporation

Inventor： Kenichi Akazawa ,  Kenichi Kobayashi ,  Akihiro Yazawa ,  Manao Hoshina

IPC: B24B41/00 ,  B24B27/00 ,  B08B3/02 ,  B24B9/00

Abstract: Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.

公开(公告)号：US10141211B2

公开(公告)日：2018-11-27

申请号：US15690025

申请日：2017-08-29

Applicant: EBARA CORPORATION

Inventor： Toshio Yokoyama ,  Masahiko Sekimoto ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Takashi Mitsuya ,  Keiichi Kurashina

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

公开(公告)号：US10071458B2

公开(公告)日：2018-09-11

申请号：US15353913

申请日：2016-11-17

Applicant: Ebara Corporation

Inventor： Akihiro Yazawa ,  Kenichi Kobayashi

IPC: B24B49/16 ,  B24B9/00 ,  B24B37/005 ,  B24B9/06

CPC classification number: B24B37/005 ,  B24B9/065

Abstract: An object of the invention is to provide a calibration apparatus which enables the pressing force of the polishing pad to be adjusted by a simple method without the need of removing a stage on which a substrate can be placed. One embodiment of the invention provides a calibration apparatus for a bevel polishing system for polishing a bevel portion of a substrate, comprising: a load measuring device capable of measuring a pressing load from a polishing pad of the bevel polishing system; and a base plate capable of having the load measuring device placed thereon, wherein the base plate is capable of being fixed on a vacuum suction table which is capable of having a substrate placed thereon.

公开(公告)号：US09362129B2

公开(公告)日：2016-06-07

申请号：US14061673

申请日：2013-10-23

Applicant: EBARA CORPORATION

Inventor： Mitsuru Miyazaki ,  Kenichi Kobayashi ,  Teruaki Hombo ,  Akira Imamura ,  Boyu Dong ,  Hiroyuki Shinozaki

IPC: B24B37/10 ,  B24B37/30 ,  B24B37/34 ,  H01L21/306 ,  H01L21/67

CPC classification number: H01L21/30625 ,  B24B37/30 ,  B24B37/34 ,  B24B37/345 ,  H01L21/67051 ,  H01L21/67219

Abstract: A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.

Abstract translation: 抛光装置用于抛光诸如半导体晶片的基板的表面以平坦化基板的表面。 抛光装置包括具有抛光表面的抛光台，以及顶环，其构造成保持基板的外周边缘由保持环包围并将基板压靠在抛光表面上。 顶环可在抛光台上方的抛光位置，抛光台侧面的位置和清洁位置之间移动。 抛光装置包括清洁单元，该清洁单元设置在清洁位置并且被配置为朝着正在旋转的顶环的下表面喷射清洁液体，由此清洁由顶环保持的基板与顶部的下表面 环。

公开(公告)号：US09358662B2

公开(公告)日：2016-06-07

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC: H01L21/67 ,  H01L21/306 ,  B24B37/34 ,  H01L21/677

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.