公开(公告)号：US20110021104A1

公开(公告)日：2011-01-27

申请号：US11647040

申请日：2006-12-28

申请人： Jia-Peng Lin ,  Pui-Leng Lai ,  Wan-Ling Lu ,  Ding-Han Huang ,  Chao-Huei Liu ,  Chun-Hung Lin

发明人： Jia-Peng Lin ,  Pui-Leng Lai ,  Wan-Ling Lu ,  Ding-Han Huang ,  Chao-Huei Liu ,  Chun-Hung Lin

IPC分类号： C08L33/08 ,  C08L67/00 ,  C08L23/10 ,  C08L33/26 ,  D04H1/56 ,  D04H3/16

CPC分类号： C08L33/26 ,  C08F212/08 ,  C08F285/00 ,  C08F2438/03 ,  C08L33/02 ,  C08L35/06 ,  C08L51/003 ,  C08L67/02 ,  C08L2203/02 ,  D01F1/10 ,  D01F1/103 ,  Y10T428/249938 ,  Y10T428/2998 ,  Y10T442/68 ,  Y10T442/681 ,  Y10T442/696 ,  Y10T442/698 ,  Y10T442/699 ,  C08F220/06 ,  C08L2666/02 ,  C08L2666/24 ,  C08F220/56

摘要： Amphoteric polymer composite nanoparticles are added into the polymer grains of synthetic fibers. The synthetic fibers are woven to form a textile capable of adjusting pH value.

摘要翻译： 将两性聚合物复合纳米颗粒加入到合成纤维的聚合物颗粒中。 合成纤维被织造以形成能够调节pH值的织物。

公开(公告)号：US07814276B2

公开(公告)日：2010-10-12

申请号：US11943228

申请日：2007-11-20

申请人： Yen-Chin Lin ,  Hsin-Chung Wang ,  Chun-Hung Lin

发明人： Yen-Chin Lin ,  Hsin-Chung Wang ,  Chun-Hung Lin

IPC分类号： G06F12/00

CPC分类号： G06F12/0804 ,  G06F12/0886 ,  G06F2212/2022

摘要： The present invention provides a data cache architecture interposed between a host and a flash memory, the data cache architecture comprising: a buffer memory, receiving data from the host; a memory controller, deploying the data in the buffer memory; and a data cache memory, controlled by the memory controller according to a cache algorithm. The data cache architecture and the cache algorithm used in the data cache architecture can be used to minimize the program/erase count of the NAND type flash device.

摘要翻译： 本发明提供一种插入在主机和闪速存储器之间的数据高速缓存架构，所述数据高速缓存架构包括：缓冲存储器，从所述主机接收数据; 存储器控制器，将数据部署在缓冲存储器中; 以及由存储器控制器根据高速缓存算法控制的数据高速缓冲存储器。 可以使用数据高速缓存架构中使用的数据高速缓存结构和缓存算法来最小化NAND型闪存设备的编程/擦除计数。

公开(公告)号：US07760807B2

公开(公告)日：2010-07-20

申请号：US11206137

申请日：2005-08-18

申请人： Chun-Hung Lin

发明人： Chun-Hung Lin

IPC分类号： H04N7/12

CPC分类号： H04N19/198 ,  H04N19/102 ,  H04N19/176 ,  H04N19/186 ,  H04N19/196 ,  H04N19/51

摘要： A method and system for motion estimation using chrominance information, which is based on each block of a current frame to find a corresponding block from a previous frame within a search area and accordingly determines a motion vector and includes first separately computing luminance differences and chrominance differences between luminance and chrominance of a target block in a current frame and luminance and chrominance of candidate blocks in a search range of a previous frame, next adjusting the luminance differences based on the first chrominance differences and the second chrominance differences and outputting adjusted luminance differences; and finally finding a minimum one among the adjusted luminance differences and accordingly determining the motion vector.

摘要翻译： 一种使用色度信息的运动估计的方法和系统，其基于当前帧的每个块以从搜索区域内的先前帧中找到相应的块，并因此确定运动矢量，并且包括首先分别计算亮度差和色度差 在当前帧中的目标块的亮度和色度之间以及前一帧的搜索范围内的候选块的亮度和色度，接着基于第一色差和第二色度差来调整亮度差并输出调整的亮度差; 最后在调整后的亮度差中找到最小的亮度差，从而确定运动矢量。

公开(公告)号：US20100044850A1

公开(公告)日：2010-02-25

申请号：US12405043

申请日：2009-03-16

申请人： Chun-Hung Lin ,  Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Wei-Lun Cheng

发明人： Chun-Hung Lin ,  Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Wei-Lun Cheng

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/4832 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An advanced quad flat non-leaded package structure includes a carrier, a chip and a molding compound. The carrier includes a die pad and a plurality of leads. The die pad has a central portion, a peripheral portion disposed around the central portion and a plurality of connecting portions connecting the central portion and the peripheral portion. The central portion, the peripheral portion, and the connecting portions define at least two hollow regions. The leads are disposed around the die pad. The chip is located within the central portion of the die pad and electrically connected to the leads via a plurality of wires. The molding compound encapsulates the chip, the wires, inner leads and a portion of the carrier.

摘要翻译： 先进的四边形扁平非铅封装结构包括载体，芯片和模塑料。 载体包括管芯焊盘和多个引线。 芯片焊盘具有中心部分，围绕中心部分设置的周边部分和连接中心部分和周边部分的多个连接部分。 中心部分，周边部分和连接部分限定至少两个中空区域。 引线设置在管芯焊盘周围。 芯片位于芯片焊盘的中心部分内，并通过多条电线与引线电连接。 模塑料封装芯片，导线，内引线和载体的一部分。

公开(公告)号：US07585331B2

公开(公告)日：2009-09-08

申请号：US11419106

申请日：2006-05-18

申请人： Pui-Leng Lai ,  Cheng-Chieh Chen ,  Chun-Hung Lin ,  Jia-Peng Lin ,  Nai-Yun Liang

发明人： Pui-Leng Lai ,  Cheng-Chieh Chen ,  Chun-Hung Lin ,  Jia-Peng Lin ,  Nai-Yun Liang

IPC分类号： D06M13/50 ,  D06M11/79

CPC分类号： D06M11/44 ,  D06M11/46 ,  D06M11/79 ,  D06M11/83 ,  D06M23/08

摘要： A long-term antibiotic and deodorant textile with mesoporous structure and processing method thereof are provided. At first, a textile is dipped into an aqueous solution of a surfactant containing nanoparticles. An aqueous solution of a silicon source is prepared and its pH value is adjusted to about 5˜9. Then, the aqueous solution of the surfactant and the aqueous solution of the silicon source are mixed to form a mixture solution. The mixture solution is stirred until silica powder form therein. The textile is taken out and dipped into water and organic solvent separately several times. Finally, the textile is dried to obtain the long-term antibiotic and deodorant textile with mesoporous structure.

摘要翻译： 提供了具有介孔结构及其加工方法的长期抗生素和除臭织物。 首先，将织物浸入含有纳米颗粒的表面活性剂的水溶液中。 制备硅源的水溶液，将其pH值调节至约5〜9。 然后，将表面活性剂的水溶液和硅源的水溶液混合，形成混合溶液。 将混合溶液搅拌直至形成二氧化硅粉末。 将纺织品取出并分别浸入水和有机溶剂中几次。 最后，将纺织品干燥，得到具有中孔结构的长期抗生素和除臭纺织品。

公开(公告)号：US07571021B2

公开(公告)日：2009-08-04

申请号：US11674497

申请日：2007-02-13

申请人： Chun-Hung Lin ,  Shy-Jay Lin ,  Heng-Hsin Liu ,  Chien-Hsun Lin ,  Jui-Chung Peng ,  Yao-Wen Guo

发明人： Chun-Hung Lin ,  Shy-Jay Lin ,  Heng-Hsin Liu ,  Chien-Hsun Lin ,  Jui-Chung Peng ,  Yao-Wen Guo

IPC分类号： G06F19/00 ,  G05B13/02

CPC分类号： H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for improving critical dimension of a substrate is provided. Manufacturing data of a plurality of critical dimension deviations corresponding to a plurality of areas on the substrate is collected. A plurality of sensitivity data corresponding to the plurality of areas is also collected. A plurality of exposure dosage offsets corresponding to the plurality of areas are calculated based on the plurality of critical dimension deviations and the plurality of sensitivity data.

摘要翻译： 提供了一种改善基板临界尺寸的方法。 收集对应于基板上的多个区域的多个临界尺寸偏差的制造数据。 还收集对应于多个区域的多个灵敏度数据。 基于多个临界尺寸偏差和多个灵敏度数据来计算对应于多个区域的多个曝光剂量偏移量。

公开(公告)号：US07554197B2

公开(公告)日：2009-06-30

申请号：US11400182

申请日：2006-04-10

申请人： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Feng Chiu

发明人： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Feng Chiu

IPC分类号： H01L23/48 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/10 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.

摘要翻译： 高频IC封装主要包括衬底，凸起芯片和多个导电填料，其中衬底具有从顶表面到底表面穿透的多个凸起孔。 芯片的有源表面以分别插入到凸块孔中的方式附接到基板的顶表面。 导电填料形成在凸起孔中，以将凸块电连接到基板的电路层。 高频IC封装具有更短的电路径和更薄的封装厚度。

公开(公告)号：US20090075397A1

公开(公告)日：2009-03-19

申请号：US12283469

申请日：2008-09-12

申请人： Chun-Hung Lin ,  Chuan-Fa Chang

发明人： Chun-Hung Lin ,  Chuan-Fa Chang

IPC分类号： G01N33/543

CPC分类号： G01N33/54353

摘要： This invention provides a donor bead for use in an assay, wherein the bead (a) is coated with a layer of hydrogel having directly or indirectly bound thereto a polyacrylamide-supported sugar or a polyacrylamide-supported glycan, and (b) comprises a photosensitizer which, upon excitation by laser light of a suitable wavelength, converts ambient oxygen to singlet state oxygen. This invention also provides an acceptor bead for use in an assay, wherein the bead (a) is coated with a layer of hydrogel having directly or indirectly bound thereto a polyacrylamide-supported sugar or a polyacrylamide-supported glycan, and (b) comprises a chemiluminescer and a fluorophore, whereby when the bead is contacted with singlet state oxygen, the singlet state oxygen reacts with the chemiluminescer which in turn activates the fluorophore so as to cause the emission of light of a predetermined wavelength. This invention further provides related kits, detection methods and characterization methods.

摘要翻译： 本发明提供用于测定中的供体珠粒，其中珠粒（a）涂覆有直接或间接结合聚丙烯酰胺负载的糖或聚丙烯酰胺负载的聚糖的水凝胶层，（b）包含光敏剂 其在经适当波长的激光激发后将环境氧转化为单态态氧。 本发明还提供用于测定中的受体珠粒，其中珠粒（a）涂覆有直接或间接结合有聚丙烯酰胺负载的糖或聚丙烯酰胺负载的聚糖的水凝胶层，（b）包含 化学发光体和荧光团，由此当珠粒与单态态氧接触时，单线态氧与化学发光体反应，其又激活荧光团，从而引起预定波长的光的发射。 本发明还提供了相关试剂盒，检测方法和表征方法。

公开(公告)号：US20080017961A1

公开(公告)日：2008-01-24

申请号：US11530165

申请日：2006-09-08

申请人： Chun-Hung Lin ,  Shih-Wen Chou ,  Yu-Tang Pan

发明人： Chun-Hung Lin ,  Shih-Wen Chou ,  Yu-Tang Pan

IPC分类号： H01L21/00

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A manufacturing method of a chip package structure is provided. A circuit substrate having a first surface, a second surface, and a through hole connecting the first surface and the second surface is provided. A chip having an active surface and bonding pads disposed on the active surface is provided. The chip is fixed on the circuit substrate, wherein the second surface is opposite to the active surface and the bonding pads are exposed to the through hole. Bonding wires connecting the bonding pads and the first surface are formed through the through hole. A film having an opening is formed on the first surface. The bonding wires, the bonding pads, the through hole, and part of the first surface are exposed by the opening. An encapsulant is formed to encapsulate part of the active surface, the bonding wires, and part of the first surface. The film is removed.

摘要翻译： 提供了一种芯片封装结构的制造方法。 提供具有第一表面，第二表面和连接第一表面和第二表面的通孔的电路基板。 提供具有有源表面的芯片和设置在有源表面上的接合焊盘。 芯片固定在电路基板上，其中第二表面与有源表面相对，并且焊盘暴露于通孔。 通过通孔形成连接接合焊盘和第一表面的接合线。 具有开口的膜形成在第一表面上。 接合线，接合焊盘，通孔和第一表面的一部分由开口露出。 形成密封剂以封装部分活性表面，接合线和第一表面的一部分。 电影被删除。

公开(公告)号：US20070228581A1

公开(公告)日：2007-10-04

申请号：US11761299

申请日：2007-06-11

申请人： Shih-Wen Chou ,  Chun-Hung Lin ,  Wu-Chang Tu ,  Yu-Tang Pan

发明人： Shih-Wen Chou ,  Chun-Hung Lin ,  Wu-Chang Tu ,  Yu-Tang Pan

IPC分类号： H01L23/52

CPC分类号： H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A universal chip package structure including a carrier, a chip, a plurality of bonding wires, and a molding compound is provided. The carrier has a plurality of through holes, a carrying surface, and a back surface corresponding to the carrying surface. The back surface has a plurality of contacts around the through holes. The chip with an active surface and a plurality of bonding pads on the active surface is disposed on the carrying surface. The active surface is attached to the carrying surface and the through holes expose the bonding pads. The bonding wires go through the through holes to electrically connect with the bonding pads and the contacts. In addition, the shape and size of the molding compound can be adjusted for covering the chip, the contacts, and the bonding wires.

摘要翻译： 提供了包括载体，芯片，多个接合线和模塑料的通用芯片封装结构。 载体具有多个通孔，承载表面和对应于承载表面的后表面。 后表面具有围绕通孔的多个触点。 具有活性表面的芯片和有源表面上的多个接合焊盘设置在承载表面上。 活性表面附着在承载表面上，通孔露出接合垫。 接合线穿过通孔，以与接合焊盘和触点电连接。 此外，可以调整模塑料的形状和尺寸以覆盖芯片，触点和接合线。