公开(公告)号：US07824941B2

公开(公告)日：2010-11-02

申请号：US12421814

申请日：2009-04-10

申请人： Bert Braune ,  Herbert Brunner

发明人： Bert Braune ,  Herbert Brunner

IPC分类号： H01L21/56

CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

公开(公告)号：US07688401B2

公开(公告)日：2010-03-30

申请号：US11748058

申请日：2007-05-14

申请人： Franz Schellhorn ,  Günter Kirchberger ,  Günter Waitl ,  Herbert Brunner ,  Bernhard Bachl

发明人： Franz Schellhorn ,  Günter Kirchberger ,  Günter Waitl ,  Herbert Brunner ,  Bernhard Bachl

IPC分类号： G02F1/1335

CPC分类号： G02B6/0018 ,  G02B6/00 ,  G02B6/0001 ,  G02B6/0043 ,  G02B6/0068 ,  G02B6/4298 ,  G02F1/133615 ,  G09F9/35

摘要： A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

摘要翻译： 光源元件采用液晶显示器的背光，并且包括倾斜放置的光出射面和/或光入射面。 在其表面处，光波导被反射器包围，其中可能形成适当的孔径区域。 提供了多个光源和/或更直观的视图，并因此提供亮度结果的相应增加。 还提供了一种用于制造具有集成反射器的光源元件的方法。

公开(公告)号：US07688400B1

公开(公告)日：2010-03-30

申请号：US09868364

申请日：1999-12-29

申请人： Franz Schellhorn ,  Günter Kirchberger ,  Günter Waitl ,  Herbert Brunner ,  Bernhard Bachl

发明人： Franz Schellhorn ,  Günter Kirchberger ,  Günter Waitl ,  Herbert Brunner ,  Bernhard Bachl

IPC分类号： G02F1/1335

CPC分类号： G02B6/0018 ,  G02B6/00 ,  G02B6/0001 ,  G02B6/0043 ,  G02B6/0068 ,  G02B6/4298 ,  G02F1/133615 ,  G09F9/35

摘要： A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

摘要翻译： 光源元件采用液晶显示器的背光，并且包括倾斜放置的光出射面和/或光入射面。 在其表面处，光波导被反射器包围，其中可能形成适当的孔径区域。 提供了多个光源和/或更直观的视图，并因此提供亮度结果的相应增加。 还提供了一种用于制造具有集成反射器的光源元件的方法。

公开(公告)号：US20090212316A1

公开(公告)日：2009-08-27

申请号：US11991230

申请日：2006-08-24

申请人： Bert Braune ,  Herbert Brunner ,  Thomas Höfer ,  Harald Jäger ,  Raimund Schwarz

发明人： Bert Braune ,  Herbert Brunner ,  Thomas Höfer ,  Harald Jäger ,  Raimund Schwarz

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L21/56

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/01055 ,  H01L2924/01065 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation.

摘要翻译： 一种表面安装部件，包括光电子半导体芯片，一体地模制在半导体芯片上的模制体，至少在模制体的表面的至少一部分形成的安装区域，该部件的至少一个连接位置和侧面区域 是通过分割生成的。

公开(公告)号：US20090206352A1

公开(公告)日：2009-08-20

申请号：US11920757

申请日：2006-05-11

申请人： Daniel Becker ,  Herbert Brunner ,  Tim Fiedler ,  Jörg Strauss ,  Martin Zachau

发明人： Daniel Becker ,  Herbert Brunner ,  Tim Fiedler ,  Jörg Strauss ,  Martin Zachau

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/505 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.

摘要翻译： 一种发光转换LED，其具有连接到电连接的辐射发射芯片，并且被包括至少包括基体和盖的壳体包围，所述芯片位于基体上，特别是在基体的切口中 并且所述芯片的主要辐射通过转换元件至少部分地转换成更长的波长辐射，其中所述盖由玻璃体形成，所述转换装置包含在所述玻璃体中，所述玻璃体的折射率为 高于1.6，优选至少n = 1.7。

公开(公告)号：US07510888B2

公开(公告)日：2009-03-31

申请号：US11686525

申请日：2007-03-15

申请人： Ewald Karl Michael Guenther ,  Günter Waitl ,  Herbert Brunner ,  Jörg Strauss

发明人： Ewald Karl Michael Guenther ,  Günter Waitl ,  Herbert Brunner ,  Jörg Strauss

IPC分类号： H01L21/00

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

摘要翻译： 本发明涉及一种具有至少一个LED芯片的LED装置，其包括辐射去耦表面，通过该辐射去耦表面在LED芯片中产生的大部分电磁辐射被去耦合。 布置在辐射去耦表面上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层。 壳体包围LED芯片和荧光体层的部分。

公开(公告)号：US20090065800A1

公开(公告)日：2009-03-12

申请号：US10588167

申请日：2005-02-18

申请人： Ralf Wirth ,  Herbert Brunner ,  Stefan Illek ,  Dieter Eissler

发明人： Ralf Wirth ,  Herbert Brunner ,  Stefan Illek ,  Dieter Eissler

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L31/18

CPC分类号： H01L31/022408 ,  H01L31/022416 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/382 ,  H01L2224/16225

摘要： Disclosed is an optoelectronic component (1) comprising a semiconductor function region (2) with an active zone (400) and a lateral main direction of extension, said semiconductor function region including at least one opening (9, 27, 29) through the active zone, and there being disposed in the region of the opening a connecting conductor material (8) that is electrically isolated (10) from the active zone in at least in a subregion of the opening. Further disclosed are a method for producing such an optoelectronic component and a device comprising a plurality of optoelectronic components. The component and the device can be produced entirely on-wafer.

摘要翻译： 公开了一种光电子部件（1），其包括具有有源区（400）和横向主延伸方向的半导体功能区（2），所述半导体功能区包括至少一个开口（9,27,29） 并且在所述开口的区域中设置有至少在所述开口的一个子区域中与所述活性区电隔离（10）的连接导体材料（8）。 进一步公开的是制造这种光电子部件的方法和包括多个光电子部件的器件。 组件和设备可以完全在晶片上生产。

公开(公告)号：US20070253667A1

公开(公告)日：2007-11-01

申请号：US10593794

申请日：2005-03-09

申请人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Hofer

发明人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Hofer

IPC分类号： H01L31/0203

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01L2924/00

摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

摘要翻译： 提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13） 导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型 彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

公开(公告)号：US07247940B2

公开(公告)日：2007-07-24

申请号：US10792538

申请日：2004-03-01

申请人： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

发明人： Thomas Höfer ,  Herbert Brunner ,  Frank Möllmer ,  Günter Waitl ,  Rainer Sewald ,  Markus Zeiler

IPC分类号： H01L23/03

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.

摘要翻译： 一种光电子器件，包括封装主体（57）和布置在封装主体（57）上的至少一个半导体芯片（50）。 封装主体（57）的表面具有金属化子区域（15）和非金属化子区域（20）。 包装体（57）包括至少两种不同的塑料（53,54），塑料中的一种是不可金属化的（54），该塑料确定非金属化子区域（20）。 还提供了用于制造这种组分的方法和用于含塑料体的图案化金属化的方法。

公开(公告)号：US20050014302A1

公开(公告)日：2005-01-20

申请号：US10918100

申请日：2004-08-13

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.

摘要翻译： 本发明描述了具有发光转换元件的辐射发射半导体部件，半导体本体被放置在基体的凹部中。 在包含发光转换元件并涂覆半导体主体的半导体主体周围的凹部内部模制杯状区域。 杯状部分形成为凹陷内部的凹陷或凹陷的基部上的环形边界。