公开(公告)号：US6033787A

公开(公告)日：2000-03-07

申请号：US916258

申请日：1997-08-22

申请人： Toshiyuki Nagase ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Yoshio Kanda ,  Masafumi Hatsushika ,  Masato Otsuki

发明人： Toshiyuki Nagase ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Yoshio Kanda ,  Masafumi Hatsushika ,  Masato Otsuki

IPC分类号： B32B15/04 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  B22F3/00 ,  H01L23/10

CPC分类号： H05K3/0061 ,  B32B15/04 ,  H01L23/15 ,  H01L23/373 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K3/38 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/24926

摘要： A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

摘要翻译： 具有散热片的陶瓷电路板，其热循环寿命长。 第一和第二铝板分别通过Al-Si基钎焊焊料层压并结合到陶瓷衬底的两侧。 将由AlSiC基复合材料形成的散热片层叠并结合到第一铝板的表面上。 陶瓷基板由AlN，Si3N4或Al2O3形成。 散热器中的Al合金的Al纯度为80-99重量％，第一或第二铝板的Al纯度不低于99.98重量％。 通过散热器中的Al合金将散热片层压并结合到第一铝板上。

公开(公告)号：US08564118B2

公开(公告)日：2013-10-22

申请号：US12737042

申请日：2009-06-05

申请人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

发明人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

IPC分类号： H01L23/15 ,  H01L23/06 ,  H01L23/10

CPC分类号： H01L21/76838 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  C04B2237/407 ,  H01L23/3735 ,  H01L23/498 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  Y10T29/49117 ,  Y10T428/12056 ,  Y10T428/12486 ,  Y10T428/12576 ,  Y10T428/12611 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01029 ,  H01L2924/00

摘要： A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

摘要翻译： 功率模块基板包括：具有表面的陶瓷基板; 以及在陶瓷基板和金属板之间的接合界面处连接到由铝构成的陶瓷基板的表面并且包括Cu的金属板，其中接合界面处的Cu浓度在0.05〜5重量％的范围内 ％。

公开(公告)号：US08116084B2

公开(公告)日：2012-02-14

申请号：US12734646

申请日：2008-11-19

申请人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

发明人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

IPC分类号： H05K1/00

CPC分类号： H05K3/38 ,  B23K1/0016 ,  B23K1/19 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/18 ,  B23K2103/52 ,  H01L21/4803 ,  H01L23/15 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K2203/128 ,  Y10T428/12007 ,  Y10T428/12736 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified.

摘要翻译： 一种功率模块基板的制造方法，其特征在于，包括：准备陶瓷基板和由纯铝制成的金属板; 熔融步骤，其中陶瓷基板和金属板层叠有钎料，并且在陶瓷基板和金属板之间的界面处通过熔融钎料填充金属形成熔融铝层， 加热引起的; 以及熔融铝层通过冷却固化的固化步骤，并且当熔融铝层固化时，使晶体生长成以金属板的结晶取向布置。

公开(公告)号：US20100285331A1

公开(公告)日：2010-11-11

申请号：US12734646

申请日：2008-11-19

申请人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

发明人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

IPC分类号： B32B15/20 ,  B23K31/02 ,  B32B15/04

CPC分类号： H05K3/38 ,  B23K1/0016 ,  B23K1/19 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/18 ,  B23K2103/52 ,  H01L21/4803 ,  H01L23/15 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K2203/128 ,  Y10T428/12007 ,  Y10T428/12736 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified.

摘要翻译： 一种功率模块基板的制造方法，其特征在于，包括：准备陶瓷基板和由纯铝制成的金属板; 熔融步骤，其中陶瓷基板和金属板层叠有钎料，并且在陶瓷基板和金属板之间的界面处通过熔融钎料填充金属形成熔融铝层， 加热引起的; 以及熔融铝层通过冷却固化的固化步骤，并且当熔融铝层固化时，使晶体生长成以金属板的结晶取向布置。

公开(公告)号：US20090145642A1

公开(公告)日：2009-06-11

申请号：US12303513

申请日：2007-06-06

申请人： Yoshirou Kuromitsu ,  Hiroya Ishizuka ,  Hiroshi Miyata ,  Takeshi Kitahara ,  Hiroshi Tonomura

发明人： Yoshirou Kuromitsu ,  Hiroya Ishizuka ,  Hiroshi Miyata ,  Takeshi Kitahara ,  Hiroshi Tonomura

IPC分类号： H05K1/03 ,  H05K3/10

CPC分类号： H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/32 ,  H01L2224/32225 ,  H05K1/09 ,  H05K3/38 ,  H05K2201/0269 ,  Y10T29/49124

摘要： A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.

摘要翻译： 一种功率元件安装基板，包括钎焊到陶瓷板的表面的电路层和焊接到电路层的前表面的功率元件，其中电路层使用平均纯度大于或等于 等于98.0重量％且小于或等于99.9重量％时，要钎焊到陶瓷板的表面侧的电路层的Fe浓度小于0.1重量％，电路层的铁浓度在 与钎焊表面相对的表面的一侧大于或等于0.1重量％。

公开(公告)号：US06995104B2

公开(公告)日：2006-02-07

申请号：US10682039

申请日：2003-10-10

申请人： Eung Chul Park ,  Hideaki Sakurai ,  Yoshirou Kuromitsu ,  Ginjiro Toyoguchi

发明人： Eung Chul Park ,  Hideaki Sakurai ,  Yoshirou Kuromitsu ,  Ginjiro Toyoguchi

IPC分类号： C04B35/04

CPC分类号： H01J11/40 ,  C03C17/3411 ,  H01J11/12

摘要： It is an object of the present invention to provide a polycrystalline MgO deposition material which is capable of obtaining a good discharge response characteristic over a wide temperature range. Additionally, it is another object of the present invention to provide a plasma display panel with an improved luminance and a material for the plasma display panel which can remarkably reduce the number of address ICs without lowering the panel luminance. In order to achieve the objects, there is provided an improvement of a polycrystalline MgO deposition material for a passivation layer of the plasma display panel. A characteristic structure is that the polycrystalline MgO deposition material is formed of a sintered pellet of polycrystalline MgO, of which MgO purity is more than 99.9% and relative density is more than 90%. Further, a Si concentration in the polycrystalline MgO is more than 30 ppm and less than 500 ppm.

摘要翻译： 本发明的目的是提供一种多晶MgO沉积材料，其能够在宽的温度范围内获得良好的放电响应特性。 此外，本发明的另一个目的是提供一种具有改进的亮度的等离子体显示面板和用于等离子体显示面板的材料，其可以显着地减少地址IC的数量而不降低面板亮度。 为了实现上述目的，提供了用于等离子体显示面板的钝化层的多晶MgO沉积材料的改进。 特征结构是多晶MgO沉积材料由多晶MgO的烧结颗粒形成，其中MgO的纯度大于99.9％，相对密度大于90％。 此外，多晶MgO中的Si浓度大于30ppm且小于500ppm。

公开(公告)号：US09076755B2

公开(公告)日：2015-07-07

申请号：US13394923

申请日：2010-09-07

申请人： Hiroshi Tonomura ,  Yoshiyuki Nagatomo ,  Yoshirou Kuromitsu

发明人： Hiroshi Tonomura ,  Yoshiyuki Nagatomo ,  Yoshirou Kuromitsu

IPC分类号： H05K7/20 ,  H05K1/00 ,  H01L23/373 ,  H01L23/467 ,  H01L23/473

CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/704 ,  H01L23/467 ,  H01L23/473 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01049

摘要： A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.

摘要翻译： 一种用于制造具有散热器的功率模块用基板的方法，包括将散热器接合到第二金属板的表面的散热焊接工序。 散热焊接工序包括：Cu层形成步骤，用于在第二金属板的表面中的至少一个表面和散热片的接合表面上形成Cu层; 散热层叠步骤，用于经由所述Cu层层压所述第二金属板和所述散热片; 散热器加热步骤，用于在层叠方向上按压并加热第二金属板和散热片，以使Cu层中的Cu扩散到第二金属板和散热片中; 以及熔融金属固化步骤，用于固化由Cu扩散形成的熔融金属，以将第二金属板和散热片结合。

公开(公告)号：US20130335921A1

公开(公告)日：2013-12-19

申请号：US13503126

申请日：2010-10-19

申请人： Yoshiyuki Nagatomo ,  Kazuhiro Akiyama ,  Hiroshi Tonomura ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

发明人： Yoshiyuki Nagatomo ,  Kazuhiro Akiyama ,  Hiroshi Tonomura ,  Nobuyuki Terasaki ,  Yoshirou Kuromitsu

IPC分类号： H05K7/02 ,  H05K13/00 ,  H05K7/20

CPC分类号： H05K7/02 ,  C04B35/645 ,  C04B37/021 ,  C04B37/026 ,  C04B2235/6581 ,  C04B2235/72 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/58 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2224/32225 ,  H05K7/2039 ,  H05K13/00 ,  Y10T29/49002

摘要： Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.

摘要翻译： 提供了一种功率模块基板，其包括陶瓷基板和包含铝或铝合金的金属板，并且其被堆叠并结合在陶瓷基板的表面上，其中一个或多个选自Ag，Zn，Ge的附加元素 ，Mg，Ca，Ga和Li固溶在金属板中，金属板中与陶瓷基板界面附近的Ag浓度大于或等于0.05质量％且小于或等于 等于10质量％，或者与陶瓷基板的界面附近的金属板中的Zn，Ge，Mg，Ca，Ga和Li的总浓度大于等于0.01质量％ 以上5质量％以下。

公开(公告)号：US20110074010A1

公开(公告)日：2011-03-31

申请号：US12737042

申请日：2009-06-05

申请人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

发明人： Yoshirou Kuromitsu ,  Yoshiyuki Nagatomo ,  Takeshi Kitahara ,  Hiroshi Tonomura ,  Kazuhiro Akiyama

IPC分类号： H01L23/373 ,  H01R43/00

CPC分类号： H01L21/76838 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  C04B2237/407 ,  H01L23/3735 ,  H01L23/498 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  Y10T29/49117 ,  Y10T428/12056 ,  Y10T428/12486 ,  Y10T428/12576 ,  Y10T428/12611 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01029 ,  H01L2924/00

摘要： A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

摘要翻译： 功率模块基板包括：具有表面的陶瓷基板; 以及在陶瓷基板和金属板之间的接合界面处连接到由铝构成的陶瓷基板的表面并且包括Cu的金属板，其中接合界面处的Cu浓度在0.05〜5重量％的范围内 ％。

公开(公告)号：US07138350B2

公开(公告)日：2006-11-21

申请号：US10496693

申请日：2002-11-29

申请人： Hideaki Sakurai ,  Ginjiro Toyoguchi ,  Yoshirou Kuromitsu

发明人： Hideaki Sakurai ,  Ginjiro Toyoguchi ,  Yoshirou Kuromitsu

IPC分类号： C04B35/04 ,  C09D1/00

CPC分类号： C04B35/6261 ,  C04B35/053 ,  C04B35/62625 ,  C04B35/6263 ,  C04B35/62655 ,  C04B35/62695 ,  C04B2235/5427 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/661 ,  C04B2235/72 ,  C04B2235/721 ,  C04B2235/722 ,  C04B2235/724 ,  C04B2235/726 ,  C04B2235/727 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/85 ,  C04B2235/87 ,  C04B2235/95 ,  C04B2235/96 ,  C23C14/081 ,  C30B29/16

摘要： Polycrystals with a MgO purity of at least 99.0%, a relative density of at least 90.0%, a sulfur S content of 0.01 to 50 ppm, a chlorine Cl content of 0.01 to 50 ppm, a nitrogen N content of 0.01 to 200 ppm, and a phosphorus P content of 0.01 to 30 ppm. Even when vapor deposition is conducted using electron beam deposition, almost no splash occurs, and the film characteristics of the product MgO film can also be improved.

摘要翻译： MgO纯度至少为99.0％，相对密度至少为90.0％，硫S含量为0.01〜50ppm，氯Cl含量为0.01〜50ppm，氮N含量为0.01〜200ppm的多晶体， 磷P含量为0.01〜30ppm。 即使当使用电子束沉积进行气相沉积时，几乎不发生溅射，并且还可以提高产品MgO膜的膜特性。