公开(公告)号：US20190036774A1

公开(公告)日：2019-01-31

申请号：US16152280

申请日：2018-10-04

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H04L12/24 ,  A61B5/0205 ,  A61B5/00 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US20180328957A1

公开(公告)日：2018-11-15

申请号：US15771869

申请日：2015-12-17

Applicant: Intel Corporation

Inventor： Feras EID ,  Henning BRAUNISCH ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER

IPC: G01P15/097 ,  B81B7/00 ,  B81C1/00 ,  G01P15/08

CPC classification number: G01P15/097 ,  B81B7/0006 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2203/053 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00166 ,  B81C1/0023 ,  G01P15/0802

Abstract: Embodiments of the invention include a microelectronic device having a sensing device and methods of forming the sensing device. In an embodiment, the sensing device includes a mass and a plurality of beams to suspend the mass. Each beam comprises first and second conductive layers and an insulating layer positioned between the first and second conductive layers to electrically isolate the first and second conductive layers. The first conductive layer is associated with drive signals and the second conductive layer is associated with sense signals of the sensing device.

公开(公告)号：US20180240762A1

公开(公告)日：2018-08-23

申请号：US15773033

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Javier A. FALCON ,  Shawna M. LIFF ,  Yoshihiro TOMITA

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/00 ,  H01L25/16 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104

Abstract: Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180212306A1

公开(公告)日：2018-07-26

申请号：US15746364

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Brandon M. RAWLINGS ,  Georgios C. DOGIAMIS

IPC: H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01L2223/6677 ,  H01Q9/0457 ,  H01Q13/02

Abstract: Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.

公开(公告)号：US20180098428A1

公开(公告)日：2018-04-05

申请号：US15283352

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Fay HUA ,  Brandon M. RAWLINGS ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING

IPC: H05K1/16 ,  H01L23/498 ,  H01L21/48 ,  H05K3/42 ,  H05K3/00 ,  H01L25/16 ,  H05K1/11

Abstract: Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.

公开(公告)号：US20180003569A1

公开(公告)日：2018-01-04

申请号：US15199907

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: G01K11/26 ,  H01L41/09 ,  H01L41/047

CPC classification number: G01K11/26 ,  H01L41/047 ,  H01L41/09 ,  H01L41/1132

Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.

公开(公告)号：US20250006667A1

公开(公告)日：2025-01-02

申请号：US18341916

申请日：2023-06-27

Applicant: Intel Corporation

Inventor： Georgios PANAGOPOULOS ,  Steven CALLENDER ,  Richard GEIGER ,  Georgios C. DOGIAMIS ,  Manisha DUTTA ,  Stefano PELLERANO

IPC: H01L23/66 ,  H01L29/16 ,  H01L29/20 ,  H03F3/195 ,  H03F3/213

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package for wideband sub-terahertz communication, where the package includes a mixer and an amplifier, such as a power amplifier or a low noise amplifier, that are implemented within a layer of III-V material. Other embodiments may be described and/or claimed.

公开(公告)号：US20240266745A1

公开(公告)日：2024-08-08

申请号：US18620275

申请日：2024-03-28

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675 ,  H01L2223/6672 ,  H01L2223/6677

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20230344131A1

公开(公告)日：2023-10-26

申请号：US18216282

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L23/31 ,  H01L23/495 ,  H01Q1/24 ,  H01Q19/22 ,  H01Q1/22 ,  H01L23/552 ,  H01L23/66 ,  H01L21/56 ,  H01Q1/52

CPC classification number: H01Q9/0414 ,  H01L23/3107 ,  H01L23/49541 ,  H01Q1/241 ,  H01Q19/22 ,  H01Q1/2283 ,  H01L23/552 ,  H01L23/66 ,  H01L21/565 ,  H01Q1/526 ,  H01L2223/6677 ,  H01L23/3675

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20220408562A1

公开(公告)日：2022-12-22

申请号：US17349700

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Veronica STRONG ,  Aleksandar ALEKSOV

IPC: H05K1/11 ,  H05K1/03

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a glass core, and a vertically oriented inductor embedded in the glass core. In an embodiment, the inductor comprises vertical vias through the glass core, and where the vertical vias are electrically coupled together by conductive traces over a surface of the glass core to provide a plurality of conductive turns.