公开(公告)号：US20110148146A1

公开(公告)日：2011-06-23

申请号：US12646041

申请日：2009-12-23

申请人： Satoshi TAKAYA ,  Masafumi Inoue ,  Shinichi Tanba ,  Daisuke Takagi ,  Masahiro Koga ,  Yoshitaka Nishikawa ,  Takao Kawabata ,  Dave Reinke

发明人： Satoshi TAKAYA ,  Masafumi Inoue ,  Shinichi Tanba ,  Daisuke Takagi ,  Masahiro Koga ,  Yoshitaka Nishikawa ,  Takao Kawabata ,  Dave Reinke

IPC分类号： B60N2/36 ,  B60N2/30

CPC分类号： B60N2/36 ,  B60N2/3011 ,  B60N2/3065 ,  B60N2002/363

摘要： The present invention is a pick-up style utility vehicle with an expandable cargo bed, including a front seat, a rear seat, a stationary bottom plate serving as a bottom face of the cargo bed, an expansion bottom plate for expanding the bottom face of the cargo bed, and a shared linkage mechanism for holding the rear seat at a use position where the rear seat is positioned on the upper side of the stationary bottom plate and a shunting position where the rear seat is shunted into a rear leg room provided on the front lower side of the stationary bottom plate, and also for holding the expansion bottom plate at a storage position where the expansion bottom plate is placed out of the upper side of the leg room and an expansion position where the expansion bottom plate is positioned on the upper side of the leg room.

摘要翻译： 本发明是一种具有可膨胀货物床的拾取式多用途车，包括前排座椅，后座椅，用作货物底面的固定底板，膨胀底板，用于将底面扩张 货舱，以及用于将后座椅保持在后座位于固定底板上侧的使用位置的共用连杆机构以及后排座椅分流到设置在其上的后腿房间的分流位置 固定底板的前下侧，还用于将膨胀底板保持在扩张底板放置在腿部房间上侧的存放位置和膨胀底板位于其上的展开位置 腿部房间的上侧。

公开(公告)号：US07649270B2

公开(公告)日：2010-01-19

申请号：US10589747

申请日：2005-07-21

申请人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

发明人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

IPC分类号： H01L23/29

CPC分类号： H01L33/62 ,  H01L23/49827 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09827 ,  H01L2924/00014 ,  H01L2924/00

摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).

摘要翻译： 通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。 通孔（11）各自具有包括锥形表面（11b，11c）的内表面，锥形表面（11b，11c）具有从主表面（21）和外部连接表面（22）朝向最小尺寸孔逐渐减小的开口尺寸的锥形 部分（11a）。 锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）形成钝角θ1，θ2。 半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。 成像装置（PE2）包括安装在被框架（4）包围的区域中的成像元件（PE1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL）封闭。 发光二极管部件（LE2）包括安装在绝缘构件（2）的主表面（21）上的发光元件（LE1），其中通孔的最小尺寸孔部分（11a）填充有电 导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。 发光二极管（LE3）包括安装在封装（7）中的发光二极管部件（LE2）。

公开(公告)号：US20080138508A1

公开(公告)日：2008-06-12

申请号：US11885870

申请日：2006-03-06

申请人： Daisuke Takagi ,  Xinming Wang ,  Akira Owatari ,  Masanori Ishizaka ,  Akira Fukunaga

发明人： Daisuke Takagi ,  Xinming Wang ,  Akira Owatari ,  Masanori Ishizaka ,  Akira Fukunaga

IPC分类号： B05D5/12 ,  B05C3/02 ,  C09D5/00

CPC分类号： C23C18/1844 ,  C23C18/1653 ,  C23C18/168 ,  H01L21/288 ,  H01L21/76849

摘要： A substrate processing method is useful for forming, by electroless plating, a protective film, such as a magnetic film, which covers exposed surfaces of embedded interconnects composed of an interconnect material, such as copper or silver, embedded in fine interconnect recesses provided in a surface of a substrate. The substrate processing method includes bringing a surface of a substrate into contact with a processing solution whose temperature is adjusted to not more than 15° C., thereby activating the surface, and bringing the activated surface of the substrate into contact with a plating solution, thereby forming a metal film on the surface.

摘要翻译： 基板处理方法可用于通过无电镀形成诸如磁性膜的保护膜，该保护膜覆盖由诸如铜或银的互连材料（例如铜或银）组成的嵌入式互连件的暴露表面，该互连材料嵌入在设置在 基材表面。 基板处理方法包括使基板的表面与温度调整为15℃以下的处理液接触，从而使表面活化，使基板的活化面与电镀液接触， 从而在表面上形成金属膜。

公开(公告)号：US06693570B2

公开(公告)日：2004-02-17

申请号：US10283097

申请日：2002-10-30

申请人： Shinsuke Ohnishi ,  Daisuke Takagi

发明人： Shinsuke Ohnishi ,  Daisuke Takagi

IPC分类号： H03M110

CPC分类号： H03M1/109 ,  H03M1/66

摘要： Digital-to-analog (DA) conversion circuitry with a simplified testing circuit includes a DA converter to which test data, initially “0”, may be applied. The DA converter feeds an analog voltage corresponding to the test data to a voltage holding circuit. Subsequently the test data is incremented to “1” and then converted to a corresponding analog voltage by the DA converter. A comparator compares the analog voltage corresponding to the test data “1” with the previous analog voltage held in the voltage holding circuit and corresponding to the test data “0”. When the test data is sequentially incremented by 1 (one) at intervals, the voltage output from the DA converter is higher than the voltage held in the voltage holding circuit while the DA converter operates normally. The function of the DA converter can be easily, rapidly tested by monitoring the output of the comparator.

摘要翻译： 具有简化测试电路的数模（DA）转换电路包括DA转换器，可以应用测试数据，最初为“0”。 DA转换器将对应于测试数据的模拟电压馈送到电压保持电路。 随后，测试数据增加到“1”，然后由DA转换器转换成相应的模拟电压。 比较器将对应于测试数据“1”的模拟电压与保持在电压保持电路中的先前的模拟电压进行比较，并对应于测试数据“0”。 当测试数据间隔地顺序增加1（1）时，DA转换器输出的电压高于保持在电压保持电路中的电压，而DA转换器正常工作。 DA转换器的功能可以通过监视比较器的输出来轻松快速地测试。

公开(公告)号：US5742480A

公开(公告)日：1998-04-21

申请号：US552351

申请日：1995-11-02

申请人： Sosaku Sawada ,  Ryoji Sakamoto ,  Hiromi Kurashima ,  Daisuke Takagi ,  Satoshi Ohe ,  Takeshi Sekiguchi ,  Nobuo Shiga

发明人： Sosaku Sawada ,  Ryoji Sakamoto ,  Hiromi Kurashima ,  Daisuke Takagi ,  Satoshi Ohe ,  Takeshi Sekiguchi ,  Nobuo Shiga

IPC分类号： G02B6/42 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H01R9/09

CPC分类号： H05K1/189 ,  G02B6/4274 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4245 ,  G02B6/4269 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/3447 ,  Y02P70/611

摘要： It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board according to the present invention includes a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion having the multilayered structure and extending from one end of the main body portion, and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor, Particularly, the neck portion defines the positional relationship between the main body portion and the head portion so as to give the circuit board a sufficient mechanical strength.

摘要翻译： 本发明的目的是提供一种具有足够的机械强度相对于外部应力的高度可靠的光学模块电路板。 根据本发明的光学模块电路板包括具有至少多层结构的柔性印刷电路，其中包含导电金属互连的层被夹在绝缘层之间，其中柔性印刷电路包括具有多层结构的主体部分 ，安装有电子部件的第一表面和与第一表面相对的第二表面，具有多层结构并从主体部分的一端延伸的颈部和位于颈部的远端的头部 具有多层结构的主体部分的一端延伸并安装有光操作元件和旁路电容器的部分，特别地，颈部限定主体部分和头部之间的位置关系，从而 给电路板提供足够的机械强度。

公开(公告)号：US09757944B2

公开(公告)日：2017-09-12

申请号：US15305723

申请日：2015-05-19

申请人： Daisuke Takagi ,  Hisashi Habashi ,  Tomoyuki Aratani ,  Tatsuya Sameshima ,  Ryo Ogawa ,  Takuya Matsuda

发明人： Daisuke Takagi ,  Hisashi Habashi ,  Tomoyuki Aratani ,  Tatsuya Sameshima ,  Ryo Ogawa ,  Takuya Matsuda

IPC分类号： B41J2/14

CPC分类号： B41J2/1433 ,  B41J2/14274 ,  B41J2/1606 ,  B41J2202/03 ,  C08G59/245 ,  C08G59/5073 ,  C08G59/66

摘要： Provided is a liquid jet head, including a flow path including a first member, a resin layer, and a second member, wherein the resin layer contains a cured product of a resin composition containing an epoxy compound represented by General Formula (1), a polythiol compound having 2 or more thiol groups in a molecule thereof, and a specific imidazole compound, where in General Formula (1), L is an integer of 0 or greater but less than 3, m is a positive number of 0.1 or greater but less than 50, R1 represents any one of a hydrogen atom, and an alkyl group having 1 to 4 carbon atoms, and R2 represents a substituent represented by a formula below where R3 and R4 each represent any one of hydrogen atom, and a non-substituted or fluorine-substituted methyl group, and n is an integer of 4 to 12.

公开(公告)号：US08240737B2

公开(公告)日：2012-08-14

申请号：US12646041

申请日：2009-12-23

申请人： Satoshi Takaya ,  Masafumi Inoue ,  Shinichi Tanba ,  Daisuke Takagi ,  Masahiro Koga ,  Yoshitaka Nishikawa ,  Takao Kawabata ,  Dave Reinke

发明人： Satoshi Takaya ,  Masafumi Inoue ,  Shinichi Tanba ,  Daisuke Takagi ,  Masahiro Koga ,  Yoshitaka Nishikawa ,  Takao Kawabata ,  Dave Reinke

IPC分类号： B62D25/00

CPC分类号： B60N2/36 ,  B60N2/3011 ,  B60N2/3065 ,  B60N2002/363

摘要： A pick-up style utility vehicle with an expandable cargo bed, including a front seat, a rear seat, a stationary bottom plate serving as a bottom face of the cargo bed, an expansion bottom plate for expanding the bottom face of the cargo bed, and a shared linkage mechanism for holding the rear seat at a use position where the rear seat is positioned on the upper side of the stationary bottom plate and a shunting position where the rear seat is shunted into a rear leg room provided in front of and below the stationary bottom plate. The shared linkage mechanism also holds the expansion bottom plate at a storage position where the expansion bottom plate is above the stationary bottom plate and an expansion position where the expansion bottom plate is positioned over the leg room.

摘要翻译： 一种具有可膨胀货床的拾取式多用途车，包括前排座椅，后座椅，用作货物底面的底面的固定底板，用于扩大货物底面的膨胀底板， 以及共享连杆机构，用于将后座椅保持在后座椅位于固定底板上侧的使用位置和后座椅分流到设在前后的后腿房间中的分流位置 固定底板。 共享连接机构还将膨胀底板保持在膨胀底板位于固定底板上方的储存位置和膨胀底板位于腿部空间上方的膨胀位置。

公开(公告)号：US07819965B2

公开(公告)日：2010-10-26

申请号：US11866107

申请日：2007-10-02

申请人： Atsuya Yoshinaka ,  Daisuke Takagi

发明人： Atsuya Yoshinaka ,  Daisuke Takagi

IPC分类号： C09D5/25

CPC分类号： C23C18/1208 ,  C09D1/00 ,  C23C18/127 ,  C23C18/1283 ,  H01G4/1218 ,  H01G9/2031 ,  H01L21/31691 ,  H01L28/40 ,  Y02E10/542 ,  Y02P70/521

摘要： A coating formulation contains the following components (A), (B) and (C): (A) an organic acid-titanium compound having at least one titanium atom and at least one C2-12 aliphatic organic acid residual group as essential constituents and having no constituent other than the essential constituents, (B) fine particles of a titanate-based compound, said fine particles having an average particle size of from 10 to 100 nm, and (C) an organic solvent. A content of the components (A) is from 0.1 to 1.5 mol/kg in terms of titanium atoms, and a content of the component (B) is from 0.1 to 1.5 mol/kg in terms of titanium atoms. A production process for a titanate-based ceramic film, which makes use of the coating formulation, is also disclosed.

摘要翻译： 涂料配方含有以下组分（A），（B）和（C）：（A）具有至少一个钛原子和至少一个C 2-12脂族有机酸残基作为必要组分的有机酸 - 钛化合物，以及 不含有必要成分的成分，（B）钛酸酯系化合物的微粒，所述微粒的平均粒径为10〜100nm，（C）有机溶剂。 组分（A）的含量以钛原子计为0.1至1.5mol / kg，组分（B）的含量以钛原子计为0.1至1.5mol / kg。 还公开了利用涂料配方的钛酸酯系陶瓷膜的制造方法。

公开(公告)号：US20080090006A1

公开(公告)日：2008-04-17

申请号：US11866107

申请日：2007-10-02

申请人： Atsuya YOSHINAKA ,  Daisuke Takagi

发明人： Atsuya YOSHINAKA ,  Daisuke Takagi

IPC分类号： B05D3/02

CPC分类号： C23C18/1208 ,  C09D1/00 ,  C23C18/127 ,  C23C18/1283 ,  H01G4/1218 ,  H01G9/2031 ,  H01L21/31691 ,  H01L28/40 ,  Y02E10/542 ,  Y02P70/521

摘要： A coating formulation contains the following components (A), (B) and (C): (A) an organic acid-titanium compound having at least one titanium atom and at least one C2-12 aliphatic organic acid residual group as essential constituents and having no constituent other than the essential constituents, (B) fine particles of a titanate-based compound, said fine particles having an average particle size of from 10 to 100 nm, and (C) an organic solvent. A content of the components (A) is from 0.1 to 1.5 mol/kg in terms of titanium atoms, and a content of the component (B) is from 0.1 to 1.5 mol/kg in terms of titanium atoms. A production process for a titanate-based ceramic film, which makes use of the coating formulation, is also disclosed.

摘要翻译： 涂料制剂含有下列组分（A），（B）和（C）：（A）具有至少一个钛原子和至少一个C 2-12脂族基团的有机酸 - 钛化合物 有机酸残基作为必要成分，不含有必要成分的成分，（B）钛酸酯系化合物的微粒，所述微粒的平均粒径为10〜100nm，（C）有机酸残基 溶剂。 组分（A）的含量以钛原子计为0.1至1.5mol / kg，组分（B）的含量以钛原子计为0.1至1.5mol / kg。 还公开了利用涂料配方的钛酸酯系陶瓷膜的制造方法。

公开(公告)号：US20080067679A1

公开(公告)日：2008-03-20

申请号：US11663351

申请日：2005-09-22

申请人： Daisuke Takagi ,  Xinming Wang ,  Akira Owatari ,  Akira Fukunaga ,  Akihiko Tashiro

发明人： Daisuke Takagi ,  Xinming Wang ,  Akira Owatari ,  Akira Fukunaga ,  Akihiko Tashiro

IPC分类号： H01L23/52 ,  H01B1/02 ,  H01L21/4763

CPC分类号： H01L23/53238 ,  C23C18/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has interconnects protected with an alloy film having a minimum thickness necessary for producing the effect of preventing diffusion of oxygen, copper, etc., formed more uniformly over an entire surface of a substrate with less dependency to the interconnect pattern of the substrate. The semiconductor device includes, embedded interconnects, formed by filling an interconnect material into interconnect recesses formed in an electric insulator on a substrate, and an alloy film, containing 1 to 9 atomic % of tungsten or molybdenum and 3 to 12 atomic % of phosphorus or boron, formed by electroless plating on at least part of the embedded interconnects.

摘要翻译： 半导体器件具有被合金膜保护的互连，所述合金膜具有为了产生防止在衬底的整个表面上更均匀地形成的氧，铜等的扩散所必需的最小厚度，而对衬底的互连图案的依赖性较小 。 半导体器件包括通过将互连材料填充到形成在基板上的电绝缘体中的互连凹槽中形成的嵌入式互连，以及包含1至9原子％的钨或钼和3至12原子％的磷的合金膜， 硼，通过在至少部分嵌入式互连件上的无电镀形成。