公开(公告)号：US07108809B2

公开(公告)日：2006-09-19

申请号：US10262754

申请日：2002-10-01

Applicant: Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

Inventor： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

IPC: B29D11/00

CPC classification number: B29D11/00 ,  B29C33/42

Abstract: An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.

Abstract translation: 用于复制各种类型的光学器件的表面特征的光耦合器装置。 还公开了一种准确地复制光学器件的表面特征的新颖方法; 特别是通过利用新颖的光耦合装置。

公开(公告)号：US20120260063A1

公开(公告)日：2012-10-11

申请号：US13082599

申请日：2011-04-08

Applicant: Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

Inventor： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

IPC: G06F15/76 ,  G06F9/02

CPC classification number: H05K3/365 ,  H01L2924/0002 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/10159 ,  H05K2201/209 ,  H01L2924/00

Abstract: A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

Abstract translation: 在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。 突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。 逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

公开(公告)号：US08240031B2

公开(公告)日：2012-08-14

申请号：US12837640

申请日：2010-07-16

Applicant: Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

Inventor： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

IPC: H05K3/30

CPC classification number: H05K3/3436 ,  H05K1/111 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4919

Abstract: A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

Abstract translation: 柔性，高密度贴花及其在柔性芯片载体和印刷线路板之间形成可拆卸电互连的方法。 柔性贴花在第一表面上具有细间距焊盘，并且在第二表面上具有比微细间距更宽的间距的焊盘，设计成电连接到半导体器件的第一表面上的细间距焊盘和较宽间距 第二表面上的焊盘被设计成电连接到印刷线路板等。 第一表面上的焊盘通过柔性贴花中的一个或多个绝缘水平导电地连接到第二表面上的焊盘。

公开(公告)号：US20090109624A1

公开(公告)日：2009-04-30

申请号：US11976468

申请日：2007-10-25

Applicant: Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

Inventor： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

IPC: H05K7/20 ,  H05K3/20

CPC classification number: H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

Abstract translation: 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

公开(公告)号：US07511518B2

公开(公告)日：2009-03-31

申请号：US11902976

申请日：2007-09-27

Applicant: Frank D. Egitto ,  How T. Lin

Inventor： Frank D. Egitto ,  How T. Lin

IPC: G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.

Abstract translation: 一种制造其中至少两个电介质层彼此结合以夹在其间的多个导体的插入件的方法。 这些导体各自电耦合相应的一对相对的电触点，其形成在也作为该方法的一部分的电介质层内形成的开口内并从其中突出。 所得到的内插器非常适合用作测试装置的一部分，以将半导体芯片的高密度图案的焊球接触件与装置的印刷电路板上的较小致密的触点阵列相互连接。

公开(公告)号：US07449381B2

公开(公告)日：2008-11-11

申请号：US11352279

申请日：2006-02-13

Applicant: Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC: H01L21/8234 ,  H01L21/00

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/013 ,  H05K2203/0568

Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

Abstract translation: 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US20080238323A1

公开(公告)日：2008-10-02

申请号：US11730404

申请日：2007-04-02

Applicant: Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

Inventor： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

IPC: H01J7/44

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21K9/69 ,  F21V29/85 ,  F21W2131/202 ,  F21W2131/205 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10106

Abstract: An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such assemblies may be used within an LED lamp, as also provided herein. The lamp is ideal for use within medical and dental environments to assure optimal light onto a patient located at a specified distance from the lamp.

Abstract translation: 一种LED照明组件，包括安装在公共的可弯曲的散热构件上的多个单独的LED，该散热构件被设计成在操作期间从LED移除热量并且还被形成（弯曲）以提供期望的光的方向和强度。 如本文也提供的，LED灯内可以使用若干这样的组件。 该灯是理想的在医疗和牙科环境中使用，以确保最佳的光照射到距离灯具指定距离的患者。

公开(公告)号：US07429510B2

公开(公告)日：2008-09-30

申请号：US11352276

申请日：2006-02-13

Applicant: Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC: H01L21/8242 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/0568

Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

Abstract translation: 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 可光成像材料用于促进正在印刷的电容电介质的定位。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US07292055B2

公开(公告)日：2007-11-06

申请号：US11110901

申请日：2005-04-21

Applicant: Frank D. Egitto ,  How T. Lin

Inventor： Frank D. Egitto ,  How T. Lin

IPC: G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: An interposer including at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers.

Abstract translation: 一种插入器，包括彼此结合的至少两个介电层，在其间夹有多个导体。 这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。

公开(公告)号：US06827505B2

公开(公告)日：2004-12-07

申请号：US10320844

申请日：2002-12-16

Applicant: Subhash L. Shinde ,  L. Wynn Herron ,  Mario J. Interrante ,  How T. Lin ,  Steven P. Ostrander ,  Sudipta K. Ray ,  William E. Sablinski ,  Hilton Toy

Inventor： Subhash L. Shinde ,  L. Wynn Herron ,  Mario J. Interrante ,  How T. Lin ,  Steven P. Ostrander ,  Sudipta K. Ray ,  William E. Sablinski ,  Hilton Toy

IPC: G02B636

CPC classification number: G02B6/4201 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.