公开(公告)号：US20100132985A1

公开(公告)日：2010-06-03

申请号：US12379684

申请日：2009-02-26

申请人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

发明人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

IPC分类号： H05K1/09 ,  H05K3/20 ,  H05K1/11

CPC分类号： H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0323 ,  H05K2203/0376 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.

摘要翻译： 本发明涉及具有均匀高度的金属凸块并且直接连接到电路图案的印刷电路板，而不使用额外的凸块，从而允许以细间距进行布置。

公开(公告)号：US08677618B2

公开(公告)日：2014-03-25

申请号：US13137631

申请日：2011-08-30

申请人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

发明人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

摘要： A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

摘要翻译： 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

公开(公告)号：US08256112B2

公开(公告)日：2012-09-04

申请号：US12314783

申请日：2008-12-16

申请人： Myung Sam Kang

发明人： Myung Sam Kang

IPC分类号： H01K3/10

CPC分类号： H05K3/205 ,  H05K3/421 ,  H05K3/428 ,  H05K2201/0376 ,  H05K2203/0156 ,  H05K2203/0353 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems occurring in a conventional method of manufacturing a printed circuit board because a conventional CCL is not used as a raw material. The high density printed circuit board includes a first insulating layer having a constant thickness, and a pair of first circuit layers embedded in two sides of the first insulating layer, respectively.

摘要翻译： 高密度印刷电路板及其制造方法技术领域本发明涉及能够制造薄印刷电路板的高密度印刷电路板及其制造方法，并且可克服传统的印刷电路板的制造方法中出现的问题，因为不使用传统的CCL 作为原料。 高密度印刷电路板包括具有恒定厚度的第一绝缘层和分别嵌入第一绝缘层两侧的一对第一电路层。

公开(公告)号：US20120061132A1

公开(公告)日：2012-03-15

申请号：US13373388

申请日：2011-11-14

申请人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

发明人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0323 ,  H05K2203/0376 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

摘要翻译： 一种具有金属凸块的印刷电路板，包括：上电路层，包括嵌入在绝缘层的上部的电路图案，所述电路图案由导电金属制成; 其中所述金属凸块与所述电路图形一体地形成并且从所述电路图案突出并且在所述绝缘层上方突出。

公开(公告)号：US08039762B2

公开(公告)日：2011-10-18

申请号：US12379056

申请日：2009-02-11

申请人： Myung Sam Kang

发明人： Myung Sam Kang

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2201/09736 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： Disclosed is a printed circuit board having a buried solder bump, in which a circuit pattern and a solder bump formed on the circuit pattern are buried in an insulating layer, thus improving the degree of matching between the solder bump and the circuit pattern and obviating a need for an additional coining process of the solder bump. A manufacturing method thereof is also provided.

摘要翻译： 公开了一种具有掩埋焊料凸块的印刷电路板，其中形成在电路图案上的电路图案和焊料凸块被掩埋在绝缘层中，从而提高了焊料凸块与电路图案之间的匹配程度，并且消除了 需要额外的冲压焊过程。 还提供了其制造方法。

公开(公告)号：US20110061905A1

公开(公告)日：2011-03-17

申请号：US12654446

申请日：2009-12-18

申请人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

发明人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC分类号： H05K1/03 ,  H05K3/36

CPC分类号： H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

摘要翻译： 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

公开(公告)号：US20100193232A1

公开(公告)日：2010-08-05

申请号：US12424511

申请日：2009-04-15

申请人： Myung Sam Kang ,  Ok Tae Kim ,  Gil Yong Shin ,  Kil Yong Yun

发明人： Myung Sam Kang ,  Ok Tae Kim ,  Gil Yong Shin ,  Kil Yong Yun

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4084 ,  H05K3/205 ,  H05K3/328 ,  H05K2201/091 ,  H05K2203/063 ,  H05K2203/1115 ,  H05K2203/1572 ,  Y10T29/49155

摘要： Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.

摘要翻译： 这里公开了印刷电路板和制造印刷电路板的工艺。 印刷电路板包括绝缘层和设置在绝缘层两侧的电路层，每个电路层包括焊盘部分和图案部分。 形成在绝缘层两侧的接地部分使用电阻焊接彼此连接。 不需要诸如通孔或凸块的单独的层间连接结构和形成层间连接结构的过程，因此简化了印刷电路板和工艺。

公开(公告)号：US20090101510A1

公开(公告)日：2009-04-23

申请号：US12314783

申请日：2008-12-16

申请人： Myung Sam Kang

发明人： Myung Sam Kang

IPC分类号： C25D5/02

CPC分类号： H05K3/205 ,  H05K3/421 ,  H05K3/428 ,  H05K2201/0376 ,  H05K2203/0156 ,  H05K2203/0353 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems occurring in a conventional method of manufacturing a printed circuit board because a conventional CCL is not used as a raw material. The high density printed circuit board includes a first insulating layer having a constant thickness, and a pair of first circuit layers embedded in two sides of the first insulating layer, respectively.

摘要翻译： 高密度印刷电路板及其制造方法技术领域本发明涉及能够制造薄印刷电路板的高密度印刷电路板及其制造方法，并且可克服传统的印刷电路板的制造方法中出现的问题，因为不使用传统的CCL 作为原料。 高密度印刷电路板包括具有恒定厚度的第一绝缘层和分别嵌入第一绝缘层两侧的一对第一电路层。

公开(公告)号：US08464423B2

公开(公告)日：2013-06-18

申请号：US13373387

申请日：2011-11-14

申请人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

发明人： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

IPC分类号： H01R9/00 ,  H01R43/16 ,  H01R43/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10

CPC分类号： H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0323 ,  H05K2203/0376 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

摘要翻译： 一种制造具有金属凸块的印刷电路板的方法，包括：在第一载体上形成用于形成金属凸块的凹部，在第一载体上形成第一阻挡层，并在第一阻挡层上形成上电路层 所述上电路层包括充电在所述凹部中的金属凸块和电路图案; 在第二载体上形成第二阻挡层，并在第二阻挡层上形成下电路层; 制备绝缘层，并将上下电路层转移到绝缘层; 移除第一和第二载体; 以及去除所述第一和第二阻挡层。

公开(公告)号：US08415200B2

公开(公告)日：2013-04-09

申请号：US13007444

申请日：2011-01-14

申请人： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

发明人： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

摘要翻译： 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。