公开(公告)号：US20110039978A1

公开(公告)日：2011-02-17

申请号：US12735355

申请日：2009-01-09

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： C08J9/32 ,  C08K3/28 ,  C08K3/22 ,  C08L63/00 ,  C08G63/02 ,  C08G69/26 ,  C07D307/77

CPC分类号： C08G59/4215 ,  C08L63/00 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

摘要翻译： 本发明的环氧树脂成型材料包含（A）环氧树脂和（B）固化剂，其中（B）固化剂含有多价羧酸缩合物。 本发明的热固性树脂组合物包含（A）环氧树脂和（B）固化剂，其中（B）固化剂在150℃下的粘度为1.0-1000mPa·s，用ICI 锥板布鲁克菲尔德粘度计。

公开(公告)号：US20100140638A1

公开(公告)日：2010-06-10

申请号：US12515182

申请日：2007-11-14

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

IPC分类号： H01L33/00 ,  C08L63/00 ,  C08K3/36 ,  C08K3/22 ,  C08K3/26

CPC分类号： H01L33/60 ,  B29C45/0001 ,  B29C45/02 ,  B29L2011/00 ,  C08G59/4014 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/2279 ,  C08K7/24 ,  C08K7/28 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2244 ,  C08L63/00 ,  C08L63/06 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

摘要翻译： 本发明提供了一种用于光反射的热固性树脂组合物，其在固化后可在可见光到近紫外光的范围内实现高反射率，具有优异的耐热劣化性和片剂成型性，并且在转印期间不太可能引起毛刺 成型，以及树脂组合物的制造方法以及使用该树脂组合物的光半导体元件安装基板和光半导体装置。 用于光反射的热固化树脂组合物包括热固化组分和白色颜料，其特征在于在成型温度为100℃至200℃的条件下在传递模塑时引起的毛刺长度，成型压力不大于 20MPa，成型时间60〜120秒不大于5mm，并且在350nm至800nm的波长下热固化后的光反射率不小于80％。 该树脂组合物可用于构造光学半导体元件安装基板和光学半导体器件。

公开(公告)号：US08367153B2

公开(公告)日：2013-02-05

申请号：US13137232

申请日：2011-07-29

申请人： Naoyuki Urasaki ,  Hayato Kotani

发明人： Naoyuki Urasaki ,  Hayato Kotani

IPC分类号： B05D5/00 ,  B28B19/00 ,  B32B27/20 ,  C08K3/22 ,  H01L33/46

CPC分类号： H01L23/3121 ,  C08G59/3245 ,  C08G59/4215 ,  C08G59/688 ,  C09D163/00 ,  H01L24/48 ,  H01L33/60 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0274 ,  H05K3/285 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/24802 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours.

摘要翻译： 本发明的涂布剂是在导体部件之间使用的涂布剂，其包含热固性树脂，白色颜料，固化剂和固化催化剂，所述涂料可用于白色颜料含量为10 -85体积％，涂布剂的固化物在200℃下放置24小时时白度至少为75。

公开(公告)号：US20130001622A1

公开(公告)日：2013-01-03

申请号：US13536690

申请日：2012-06-28

申请人： Hayato KOTANI ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato KOTANI ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： H01L33/50

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/0753 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

摘要： A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening portion which penetrates the insulating layer and reaches the wiring circuits; and an optical reflection member, which is provided on the upper face of the base substrate, and which forms at least one depressed portion serving as an area for mounting an optical semiconductor element.

摘要翻译： 提供了一种用于安装光学半导体元件的基板，包括：具有绝缘层的基底基板和形成在绝缘层的上表面上的多个布线电路，并具有穿过绝缘层的至少一个外部连接端子形成开口部分 并到达布线电路; 以及光反射构件，其设置在基底基板的上表面上，并且形成用作安装光半导体元件的区域的至少一个凹部。

公开(公告)号：US20110278630A1

公开(公告)日：2011-11-17

申请号：US12998240

申请日：2009-09-25

申请人： Naoyuki Urasaki ,  Hayato Kotani

发明人： Naoyuki Urasaki ,  Hayato Kotani

IPC分类号： H01L33/36 ,  C08L63/06 ,  C08L63/00 ,  B32B27/38

CPC分类号： H01L23/3121 ,  C08G59/3245 ,  C08G59/4215 ,  C08G59/688 ,  C09D163/00 ,  H01L24/48 ,  H01L33/60 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0274 ,  H05K3/285 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/24802 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours.

摘要翻译： 本发明的涂布剂是在导体部件之间使用的涂布剂，其包含热固性树脂，白色颜料，固化剂和固化催化剂，所述涂料可用于白色颜料含量为10 -85体积％，涂布剂的固化物在200℃下放置24小时时白度至少为75。

公开(公告)号：US20110031527A1

公开(公告)日：2011-02-10

申请号：US12805445

申请日：2010-07-30

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： H01L33/48 ,  C08G59/14 ,  C08L63/00 ,  C08K3/22 ,  C07C69/74 ,  C07D307/77 ,  C09K3/00 ,  C08G69/26 ,  C08G63/00

CPC分类号： C07D307/89 ,  C07D307/77 ,  C08G59/4246 ,  C08G69/26 ,  C08K3/013 ,  C08K3/18 ,  C08K3/2279 ,  C08K3/38 ,  C08K7/26 ,  C08K7/28 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08L63/00 ,  C08L63/04 ,  C08L63/06 ,  C08L67/02 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  C08L2666/18 ,  C08L2666/22 ,  H01L2924/00014

摘要： The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.

摘要翻译： 本发明的环氧树脂成型材料包含（A）环氧树脂和（B）固化剂，其中（B）固化剂含有多价羧酸缩合物。 本发明的热固性树脂组合物包含（A）环氧树脂和（B）固化剂，其中（B）固化剂在150℃下的粘度为1.0-1000mPa·s，用ICI 锥板布鲁克菲尔德粘度计。

公开(公告)号：US20100200882A1

公开(公告)日：2010-08-12

申请号：US12679749

申请日：2008-09-25

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Makoto Mizutani

IPC分类号： H01L33/52 ,  G02F1/361 ,  C09K19/38 ,  H01L33/20

CPC分类号： C08G59/3245 ,  C08G77/445 ,  C08L63/00 ,  C08L83/10 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10T428/1068 ,  C08L83/00 ,  H01L2924/00 ,  H01L2224/0401

摘要： There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

摘要翻译： 提供了具有光学半导体元件安装板所需的各种特性的高水平的热固性光反射树脂组合物，例如光学性能和耐热变色性，在模制过程中提供高的脱模性，例如传递模塑，并且允许成型工艺 连续执行。 还提供了一种高可靠性的光学半导体元件安装板和各自用树脂组合物制造的光学半导体装置及其有效生产的方法。 制备并使用热固性光反射树脂组合物，其包括（A）环氧树脂，（B）固化剂，（C）固化催化剂，（D）无机填料，（E）白色颜料， F）添加剂和（G）脱模剂作为主要成分，其中，所述树脂组合物在固化后在400nm的光波长下具有80％以上的漫反射率; 并且树脂组合物可以连续进行100次以上的传递成型。

公开(公告)号：US20090315049A1

公开(公告)日：2009-12-24

申请号：US12303188

申请日：2007-05-21

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

摘要翻译： 提供了一种光学半导体元件安装封装，其具有树脂模制品和引线电极之间良好的粘合性并且具有优异的可靠性，并且还提供了使用该封装的光学半导体器件。 所述光半导体元件安装封装具有作为光半导体元件安装区域的凹部，其特征在于，所述封装通过以下方式形成：将由热固性光反射树脂组合物构成的树脂成形体形成为至少形成所述 凹陷部分 以及至少一对彼此相对设置的正极和负极引线电极，以形成凹部的底面的一部分，并且在树脂模制品和引线电极之间的接合面处没有间隙。